Electroninks Launches World-First Copper MOD Ink to Revolutionize Advanced Semiconductor Packaging
September 03 2024 - 5:02PM
Business Wire
New copper ink displaces electroless copper
plating and other industry-standard manufacturing processes with
significantly faster production speed, lower ownership cost, and
greater sustainability levels
Electroninks, the leader in metal organic decomposition (MOD)
inks for additive manufacturing and advanced semiconductor
packaging, today announced the launch of the company’s advanced
conductive copper ink line. The new copper ink extends
Electroninks’ global-leading portfolio of metal complex inks while
providing further manufacturing flexibility and lower total
ownership costs to customers. Electroninks will be showcasing the
new copper ink line at booth Q5152 in Hall 2 of SEMICON Taiwan
September 4-6, 2024.
This press release features multimedia. View
the full release here:
https://www.businesswire.com/news/home/20240903380708/en/
Example of Copper MOD ink, and film of
thin copper MOD seed layer (~100nm) spin-coated on wafer (Photo:
Business Wire)
A high-demand application for the new copper ink is seed layer
printing for fine-line metallization and RDL formation in
combination with the company’s proprietary iSAP™ process. For this
application, Electroninks copper ink effectively displaces industry
use of electroless (e-less) copper plating and physical vapor
deposition (PVD) tie layers while achieving a significant increase
in manufacturing throughput and a vast reduction in ESG footprint.
Compared to legacy methods (PVD and e-less), ink-based additive
printing uses a fraction of the water and energy, factory footprint
and CAPEX, thus providing customers with the lowest total cost of
ownership and highest ROI on the market.
The copper inks are deposited by spray coating, screen printing,
inkjet, spin-on, and other conventional printing methods. Beyond
the seed layer application, Electroninks is working with customers
on a multitude of applications, including advanced packaging,
serving a diversity of markets. “These copper inks bolster
Electroninks’ strong and diverse MOD ink product portfolio and
deliver best-in-class ESG and cost savings to customers,” stated
Brett Walker, CEO and co-founder of Electroninks.
“MOD inks, which have been on the market from Electroninks for a
few years now, provide unique properties that are well suited for
today’s semiconductor wafer and module-based packages requiring
high performance thermal and power management,” stated Jim Haley,
Vice President of Marketing, IMAPS Executive Council. “By
introducing a copper-based MOD product, markets and customers are
generally more supportive, as copper is a standard in electronic
design for many use-cases. While silver, gold, and other MOD inks
will continue to serve this market, we welcome copper MOD inks to
address key needs in advanced packaging.”
Electroninks is offering a range of copper ink grades to address
customer demand for adhesion to various substrates, including
glass, silicon, and EMC. These inks are compatible with multiple
printing techniques and can be cured at low temperatures for short
times – as low as 140C in 5 minutes under nitrogen or ambient
conditions.
Electroninks’ corporate executives and its international sale
team will be showcasing the company’s copper ink release at SEMICON
Taiwan (https://www.semicontaiwan.org/en/node/7046). For more
information on Electroninks products and solutions, please visit
www.Electroninks.com.
About Electroninks
Electroninks Incorporated is a world-leader in the
commercialization of advanced materials for electronics and
semiconductor packaging. We have developed a full suite of
proprietary metal complex conductive ink solutions and
complimentary material sets, thus accelerating time to market for
both new innovations and drop-in manufacturing breakthroughs.
Electroninks’ metal complex inks – including silver, gold,
platinum, nickel and copper – deliver higher conductivity,
manufacturing flexibility, and cost-effectiveness. The company’s
conductive inks provide reliable solutions for applications in
printed circuit board (PCB) manufacturing, semiconductor packaging,
consumer electronics, wearables, medical devices and more. We also
partner closely with best-in-class equipment and integration
partners to provide customers with a total ink and process solution
with the ultimate goal to reduce the manufacturing costs and
complexity.
To learn more visit: www.Electroninks.com
View source
version on businesswire.com: https://www.businesswire.com/news/home/20240903380708/en/
Media Contact: Nicolia Wiles PRIME|PR O: 512.477.7373 M:
512.698.7373 nwiles@prime-techpr.com
Contact@Electroninks.com 512-766-7555