UMC Introduces Industry’s First 3D IC Solution for RFSOI, Accelerating Innovations in the 5G Era
May 02 2024 - 2:00AM
Business Wire
News Highlights:
- UMC's 3D IC solution for RFSOI reduces circuit footprint by
more than 45%, enabling integration of more RF components in
5G-enabled devices.
- UMC's innovative 3D IC technology addresses the challenge of
radio frequency (RF) interference, and the company also seeks to
develop 3D IC solutions for 5G mmWave going forward.
- UMC's comprehensive solutions for RF front-end modules are
available in various technology types and technology nodes,
delivering unparalleled performance.
United Microelectronics Corporation (NYSE: UMC; TWSE: 2303)
(“UMC”), a leading global semiconductor foundry, today announced
the industry’s first 3D IC solution for RFSOI technology. Available
on UMC’s 55nm RFSOI platform, the stacked silicon technology
reduces die size by more than 45% without any degradation of radio
frequency (RF) performance, enabling customers to efficiently
integrate more RF components to address the greater bandwidth
requirements of 5G.
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UMC's 3D IC solution for RFSOI reduces
area by 45%, freeing up space for additional modules (Graphic:
Business Wire)
As mobile device manufacturers pack more frequency bands in
newer generations of smartphones, the company’s 3D IC solution for
RFSOI addresses the challenge of integrating more RF front-end
modules (RF-FEM) - critical components in devices to transmit and
receive data – in a device by vertically stacking dies to reduce
surface area. RFSOI is the foundry process used for RF chips such
as low noise amplifiers, switches, and antenna tuners. Utilizing
wafer-to-wafer bonding technology, UMC’s 3D IC solution for RFSOI
resolves the common issue of RF interference between stacked dies.
The company has received multiple patents for this process, which
is now ready for production.
“We are proud to lead the industry in offering this
state-of-the-art solution utilizing our innovative 3D IC technology
for RF-FEM. This groundbreaking technology not only solves the
challenges of increased frequency band demands in smartphones in
the 5G/6G era, but also helps in mobile, IoT, and virtual reality
devices with faster data transfer by accommodating more frequency
bands in parallel,” said Raj Verma, Associate Vice President of
Technology Development at UMC. “We are excited to continue
developing stacked die solutions to meet our customers’ RF needs,
such as for 5G millimeter-wave, in the future.”
UMC offers the most comprehensive RF front-end module IC
solutions in the industry, catering to a broad range of
applications including mobile, Wi-Fi, automotive, IoT, and
satellite communications. With over 500 product tape-outs completed
and more than 38 billion RFSOI chips shipped, UMC’s family of RFSOI
solutions are available in 8-inch and 12-inch wafers, as well as in
a variety of technology nodes from 130nm to 40nm. In addition to
RFSOI technologies, UMC’s 6-inch fab (Wavetek Microelectronics
Corporation) offers compound semiconductor technologies gallium
arsenide (GaAs) and gallium nitride (GaN) as well as RF filters to
supplement the needs of RF-FEM applications.
About UMC
UMC (NYSE: UMC, TWSE: 2303) is a leading global semiconductor
foundry company. The company provides high-quality IC fabrication
services, focusing on logic and various specialty technologies to
serve all major sectors of the electronics industry. UMC’s
comprehensive IC processing technologies and manufacturing
solutions include Logic/Mixed-Signal, embedded High-Voltage,
embedded Non-Volatile-Memory, RFSOI, BCD etc. Most of UMC's 12-in
and 8-in fabs with its core R&D are located in Taiwan, with
additional ones throughout Asia. UMC has a total of 12 fabs in
production with combined capacity of more than 400,000 wafers per
month (12-in equivalent), and all of them are certified with IATF
16949 automotive quality standard. UMC is headquartered in Hsinchu,
Taiwan, plus local offices in United States, Europe, China, Japan,
Korea & Singapore, with a worldwide total of 20,000 employees.
For more information, please visit: http://www.umc.com.
Note from UMC Concerning Forward-Looking Statements
Some of the statements in the foregoing announcement are
forward-looking within the meaning of the U.S. Federal Securities
laws, including statements about introduction of new services and
technologies, future outsourcing, competition, wafer capacity,
business relationships and market conditions. Investors are
cautioned that actual events and results could differ materially
from these statements as a result of a variety of factors,
including conditions in the overall semiconductor market and
economy; acceptance and demand for products from UMC; and
technological and development risks. Further information regarding
these and other risks is included in UMC’s filings with the U.S.
Securities and Exchange Commission. UMC does not undertake any
obligation to update any forward-looking statement as a result of
new information, future events or otherwise, except as required
under applicable law.
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Media UMC Corporate Communications
Lan Fu Tsau 886-3-578-2258 x31083 lan_fu_tsau@umc.com
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