STMicroelectronics' Advanced Automotive Processors with Built-In Security Set to Protect Connected Cars against Cyber Threats...
October 16 2017 - 9:02AM
- New processors combine ST's automotive and security expertise
to meet demanding safety, reliability, and quality standards
- Market's first implementation of dedicated, isolated Hardware
Security Module (HSM) on an automotive microprocessor provides
state-of-the-art security on-chip
Geneva, October 16, 2017 - STMicroelectronics (NYSE:
STM), a global semiconductor leader serving customers across
the spectrum of electronics applications, is leading the race to
protect connected cars against cyber threats with its latest
automotive processors that feature a dedicated, built-in security
module.
Millions of connected cars are already on the road, and industry
analysts predict there will be more than 250 million by 2020[1].
Connected services supported by on-board telematics units, Wi-Fi
hotspots, Bluetooth® devices - and aftermarket equipment such as
on-board diagnostics (OBD) dongles -- enable drivers and passengers
to be safer, more productive, socially connected, and better
entertained on their journeys. Unfortunately, all this connectivity
builds a real surface of attack for hackers.
Automotive groups are quickly addressing security measures to
support growth in valuable markets for connected services such as
content streaming, location-based assistance, intelligent emergency
support, and remote software updates over the air of in-car
electronic control units (ECU), while preventing hackers exploiting
the connections for their own ends. Experts recommend manufacturers
employ a range of techniques, including establishing trust in
connected devices and securing all connections, to provide multiple
layers of defense throughout the vehicle's circuitry and
software.
ST is helping the industry meet these challenges by combining
its expertise in security chips - proven in financial and
government applications worldwide -- and automotive semiconductors
that meet important industry safety and quality standards. The new
Telemaco3P telematics and connectivity processors (STA1385 and its
variants) are the first automotive microprocessors to integrate a
powerful, dedicated, isolated Hardware Security Module (HSM), which
acts like an independent security guard to watch data exchanges and
encrypt and authenticate messages. The HSM securely checks the
authenticity of received messages and any external devices that try
to connect and protects against eavesdropping.
With this HSM on-chip, Telemaco3P devices are ahead of the
general-purpose application processors typically found in current
connected-car systems, which lack dedicated hardware-based
security. ST's new chips are also extremely robust, with a 105°C
maximum temperature rating for use in locations that can become
extremely hot, such as on top or directly beneath the roof in a
smart antenna.
"Realizing the benefits of connected cars requires strong
protection against cyber-attacks," said Antonio Radaelli,
Infotainment Business Unit Director, Automotive and Discrete
Product Group, STMicroelectronics. "Our new Telemaco3P processors
combine ST's proven expertise in hardware security and knowledge of
the automotive industry's standards and requirements to lay solid
ground for safe and enjoyable connected motoring."
The new automotive processors are part of a comprehensive ST
strategy to offer products with embedded security functions that
include stand-alone Secure Elements (ST33) and embedded Flash
microcontrollers (SPC5).
ST is providing engineering samples of the STA1385 to lead
partners now and full production is scheduled for mid-2018.
Technical notes for editors:
In addition to implementing state-of-the-art security
techniques, including symmetric and asymmetric cryptography, the
HSM also runs software-security algorithms, giving extra freedom
for the main high-performance CPU to host more sophisticated
applications.
Integrated CAN FD (Controller Area Network with Flexible Data
rate), Gigabit Ethernet, and 100Mbit/s Secure Digital I/O (SDIO)
interfaces allow the Telemaco3P Family to be used as communication
gateways throughout the vehicle, for linking infotainment systems,
or Electronic Control Units (ECUs) connected to the CAN bus like
door controllers, engine or transmission management systems, or
body electronics. Essential power-management circuitry is also
integrated, which simplifies design, aids miniaturization, and
saves bill-of-materials costs.
The STA1385 is designed to comply with the automotive
functional-safety standard ISO 26261, up to safety integrity level
B (ASIL-B), and meet the AUTOSAR specification for protected
communication across the CAN bus. Telemaco3P devices can run
POSIX-compliant operating systems, giving users flexibility to
choose the optimum OS for a variety of intended use cases.
About STMicroelectronics
ST is a global semiconductor leader delivering intelligent and
energy-efficient products and solutions that power the electronics
at the heart of everyday life. ST's products are found everywhere
today, and together with our customers, we are enabling smarter
driving and smarter factories, cities and homes, along with the
next generation of mobile and Internet of Things devices.
By getting more from technology to get more from life, ST stands
for life.augmented.
In 2016, the Company's net revenues were $6.97 billion, serving
more than 100,000 customers worldwide. Further information can be
found at www.st.com.
For Press Information Contact:
STMicroelectronics Michael Markowitz Director of Technical Media
Relations +1 781 591 0354 michael.markowitz@st.com
[1] http://www.gartner.com/newsroom/id/2970017
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