Infineon and UMC Extend Automotive Partnership with Long-Term Agreement for 40nm eNVM Microcontroller Production
March 07 2023 - 2:00AM
Business Wire
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and United
Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”) today
announced a long-term strategic cooperation agreement to multiply
capacity for the production of Infineon automotive microcontroller
in order to serve the rapidly expanding automotive market. The
high-performance microcontroller product leverages Infineon’s
proprietary eNVM (embedded non-volatile memories) technology and
will be manufactured at UMC’s Singapore fab on its 40nm
process.
Microcontroller are key components controlling a wide range of
functions in vehicles, and demand is increasing as cars evolve to
become ever greener, safer, and smarter. Already this year,
Infineon is ramping the selling rate of automotive microcontroller
to close to one million per day.
“With this strategic cooperation agreement, we secure additional
long-term capacity to serve Infineon’s customers in the
fast-growing automotive market. At the center of this partnership
is a highly reliable embedded memory solution well suited for
enabling next-generation automotive applications while meeting the
stringent safety and security requirements for vehicle systems. We
are pleased to have UMC as a strategic partner to deliver a
reliable supply of high-quality microcontrollers to our customers,”
said Rutger Wijburg, Chief Operating Officer of Infineon. “Going
forward, Infineon and UMC will further deepen the automotive
collaboration in the areas of microcontroller, power management and
connectivity solutions.”
“We are excited that Infineon has chosen UMC to produce its
automotive microcontroller product at our Fab 12i in Singapore, a
strong endorsement of our manufacturing capability and business
commitment. This multi-year supply agreement further strengthens
our long-standing partnership with Infineon across various
automotive, AIoT, and 5G market segments,” said Jason Wang,
Co-President of UMC. “UMC’s shipments of automotive products have
tripled since 2019, and we expect this strong momentum to continue
as demand for automotive semiconductors rises. Given our specialty
technology leadership, diversified manufacturing footprint, and
focus on quality and operational excellence, we look forward to
deepening our collaborations with world-class automotive leaders
such as Infineon.”
About Infineon
Infineon Technologies AG is a global semiconductor leader in
power systems and IoT. Infineon drives decarbonization and
digitalization with its products and solutions. The company has
around 56,200 employees worldwide and generated revenue of about
€14.2 billion in the 2022 fiscal year (ending 30 September).
Infineon is listed on the Frankfurt Stock Exchange (ticker symbol:
IFX) and in the USA on the OTCQX International over-the-counter
market (ticker symbol: IFNNY).
Further information is available at www.infineon.com This press
release is available online at www.infineon.com/press
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About UMC
UMC (NYSE: UMC, TWSE: 2303) is a leading global semiconductor
foundry company. The company provides high quality IC fabrication
services, focusing on logic and various specialty technologies to
serve all major sectors of the electronics industry. UMC’s
comprehensive IC processing technologies and manufacturing
solutions include Logic/Mixed-Signal, embedded High-Voltage,
embedded Non-Volatile-Memory, RFSOI and BCD etc. Most of UMC's
12-in & 8-in fabs with its core R&D are located in Taiwan,
with additional ones throughout Asia. UMC has total 12 fabs in
production with combined capacity of approximately 850,000 wafers
per month (8-in equivalent), and all of them are certified with
IATF 16949 automotive quality standard. UMC is headquartered in
Hsinchu, Taiwan, plus local offices in United States, Europe,
China, Japan, Korea & Singapore, with worldwide total 20,000
employees. For more information, please visit:
https://www.umc.com.
Note from UMC Concerning Forward-Looking Statements
Some of the statements in the foregoing announcement are
forward-looking within the meaning of the U.S. Federal Securities
laws, including statements about introduction of new services and
technologies, future outsourcing, competition, wafer capacity,
business relationships and market conditions. Investors are
cautioned that actual events and results could differ materially
from these statements as a result of a variety of factors,
including conditions in the overall semiconductor market and
economy; acceptance and demand for products from UMC; and
technological and development risks. Further information regarding
these and other risks is included in UMC’s filings with the U.S.
Securities and Exchange Commission. UMC does not undertake any
obligation to update any forward-looking statement as a result of
new information, future events or otherwise, except as required
under applicable law.
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version on businesswire.com: https://www.businesswire.com/news/home/20230306005902/en/
UMC Corporate Communications Michelle Yun 886-3-578-2258 x16951
michelle_yun@umc.com
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