prototype_101
37 minutes ago
Shorts want to argue that the Foundry PDK's are NOT ready, I find it hard to believe that AMF would have actually WANTED to go public that they are producing LWLG World Class 200Gbs devices on 200MM Wafers that can produce MILLIONS of devices annually if the PDK's weren't PERFECT already, do you think there is a snowball's chance in hell that they would have wanted to do that if the PDK they were using was questionable for ongoing results, or the yields were terrible? I don't think so
All the witnesses on the ASM lab tours were reporting a "constant flow of wafers from around the world", I highly doubt if these foundries were struggling to get these PDK's successfully operational that they would be continuing to waste time with LWLG after 2-3 years now already, Foundries are in high demand for their time, and as I understand it, some of our Foundry work is being sponsored/at request of potential Customers
Dr. Michael Lebby commented: "Our newly presented results are incredibly exciting, representing not only the best commercial-grade-compatible polymer modulators to-date, but on commercial 200mm silicon wafers, with performances that fit very well for a 4-channel x 200Gbps (or 800Gbps) pluggable transceiver, as well as the next generation 4-channel x 400Gbps (or 1600Gbps) pluggable transceivers. 200G lanes with clean, open eye diagrams now represent an inflection-point to extend silicon photonics benefits by utilizing the company's polymers to enable much higher data-rate speeds at significantly lower power consumption levels. These results will position LWLG to support the burgeoning demand of generative AI as datacenters around the world begin to upgrade their hardware faster than expected to meet the demands of the future."
https://finance.yahoo.com/news/lightwave-logic-demonstrates-world-class-123100712.html
prototype_101
38 minutes ago
ECOC - World class performance for 200Gbps PAM4 and 400Gbps PAM4 lanes from electro-optic polymer modulators
Michael Lebby, Lightwave Logic Inc
Electro-optic (EO) polymer modulators are a hot topic in the industry today as the industry strives to increase modulation speed while reducing optical network equipment power consumption, driven by G-AI needs to upgrade hypescaler datacenters. Polymer modulators are now showing world class performance for 200Gbps PAM4 lanes, with initial results at 400Gbps PAM4 lanes and headroom for 800Gbps lanes as polymers have significant bandwidth capability. This enables not only 4 channel by 200Gbps PAM4 lanes for 800Gbps pluggable transceivers today, but also 4 channel by 400Gbps PAM4 lanes for 1.6Tbps pluggable transceivers soon. Further, polymer modulators have the capability for 4 channel by 800Gbps PAM4 lanes for 3.2Tbps pluggable transceivers using 800G lanes as part of a technology roadmap plan. Recent world class EO polymers results include:
1) Clean PAM4 eye diagrams at 200Gbps with less than 1V drive voltage.
2) Super high bandwidth polymer based plasmonic devices that exceed 250GHz (EO S21 3dB) for 400Gbps PAM4 lane applications for4 channel by 400Gbps PAM4 (1.6Tbps) pluggable transceivers.
3) Very low voltage drive of ~0.5V (which allows direct drive from ICs, DSPs etc., and potentially can eliminate driver chips)
4) Very small footprint and size, which allows simple integration with PICs to turbo-boost silicon photonics. Tiny optical engines are ideal for pluggable and onboard-optic transceiver form-factors.
5) Commercial silicon foundry 200mm wafers where EO polymers have been easily integrated using standard PDKs.
The talk will discuss the latest world class results with commercial grade electro-optic polymer materials that are being licensed for device applications for datacom at 1310 and 1550nm. These devices are fabricated onto 200mm silicon commercial foundry wafers and perform to 200G lane specifications at drive voltages less than 1V (which supports the drive to lower power consumption). Packaged polymer modulators will show the latest reliability and lifetime performance for datacenter applications. Reliability and stability results will be presented to show the robustness of the technology platform with respect to thermal stability and photostability in testing on materials, packages, and boards. Plans for CSP (Chip Scale Packaging) for polymer PICs will be shown based on dielectric sealants such as Atomic Layer Deposition at temperatures suitable for organic, polymer material. The talk will also show how the performance of EO polymer modulators can extend to not only 800Gbps and 1.6Tbps transceivers, but also 3.2Tbps, 6.4Tbps and beyond using the natural bandwidth characteristics of Perkinamine® chromophore organic material family. With EO bandwidths that exceed 250GHz that have been demonstrated with Polariton, single line or lane data rates that exceed 800Gbps PAM4 possible which opens a path for multi-Tbps data rate pluggable transceiver designs that include 3.2Tbps and 6.4Tbps for an exciting technology roadmap using polymer materials.
https://www.ecocexhibition.com/visit/market-focus/market-focus-session-information/
Bullish
BULLISH
prototype_101
5 hours ago
ECOC Market Focus Topics!! Polymers RULE!! Check it out!!!
September 23-25, 2024
Components/ICs/PICs/fiber
1. Classic component performance (discrete and
integrated photonics), ROADMs
2. High speed, low power modulators (polymer, TFLN,
plasmonic, Silicon, InP etc.)
3. Tunable and fixed wavelength devices
4. Future PIC trends, roadmaps, complexity with InP,
silicon photonics, polymers
5. VCSELs: high speed, arrays, smart pixels
6. Electronics (and associated modulation techniques
– PAM, QPSK, QAM etc.) for lightwave (DSPs, ASICs,
computational processing)
7. Advanced packaging trends (low cost, high speed,
volume driven, CoB, FC, interposers) and associated
testing techniques
https://www.ecocexhibition.com/wp-content/uploads/ECOC2024-Market-Focus-Call-For-Speakers.pdf
LWLG Most Innovative Product Award Finalist
ECOC 2024 Hybrid PIC / Optical Integration Platform
https://pbs.twimg.com/media/GTUvX0HXoAAZIO2?format=jpg&name=small
prototype_101
5 hours ago
teddybear AGAIN FOR 10th TIME!!!! >>> I've called you and your bff out multiple times now to defend WHY anyone in their right mind would say TFLN will be the material that is the winner in Photonics!!! It is ABSURDLY stupid as those that would TOUT IT!!!!
LWLG's TOP Competition is TFLN which is LAUGHABLE!!!
TFLN? here worth another LQQk,
TFLN isn’t ready. Unless HyperLight drastically expanded their production line and figured out their stability issues, they aren’t able to supply the market.
Liobate. No. Luxtelligence and it’s customers. No. Lightium is the new guy. No, years away. Rapid Photonics. Who? Ori-Chip. Maybe if anyone. NanoLN…monopoly on TFLN wafers hence why Luxtelligence and Lightium exist. Eoptolink uses HyperLight’s PICs because their own Chinese suppliers can’t supply…and Eopolink isn’t selling. And why is that…go to the paragraph above.
“The volume will act as a barrier.” LOL for TFLN you mean Markie?
-KCC
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=174320206
HyperLight is TFLN's #1 leading company in world!!! Check out HyperLight's latest Development of "gold-box" TFLN modulators which they are proudly showcasing at CLEO next week!!! Too funny!!!
https://cleo24.mapyourshow.com/8_0/exhibitor/exhibitor-details.cfm?exhid=209&shareguid=0C02EFD5-B1E7-126B-A742469AED53E0F4
Hyperlight is showcasing its TFLN GOLD BOX modulator as their PRIZE DEVELOPMENT!!! TOO FUNNY!!!!
Hyperlight is supposedly the #1 TFLN company in the world!!!!!
This is where LWLG was about 5 years ago!!!!
here's a sample meeting of a Google/Amazon/Nvidia etc CEO with their Chief Engineer of Photonics
CEO, so what do you think we should use for our true next-gen internet transmissions solution?
ENG, well we've been working hard to help you decide the BEST solution and here's what we've got, Mark L says TFLN is going to be the winner of all the materials out there
CEO, ok, so then TFLN must have all those things we spoke about right? Is TFLN incredibly small so as to free up space in the Transceiver box so we don't have to implement Co-Packaged Optics any time within the next several generations?
ENG, well no, actually LWLG Polymers fit 120 devices in the same space TFLN fits only 8, but Mark L says TFLN is going to be the winner of all the materials out there
CEO, ok, well then TFLN must be using the least power right?
ENG, well no, actually LWLG Polymers is the ONLY solution operating at sub-1Volt that ELIMINATE the power hungry and expensive Driver Chip, but Mark L says TFLN is going to be the winner of all the materials out there
CEO, ok, well then TFLN must have the lowest Optical Losses and will save us money on requiring less DSP usage right?
ENG, well no, actually LWLG Polymers has MUCH LOWER Optical Losses, but Mark L says TFLN is going to be the winner of all the materials out there
CEO, ok well TFLN must be SUPER COMPATIBLE with Standard Silicon Foundries right?
ENG, well no, actually LWLG Polymers are SUPER COMPATIBLE with Standard Silicon Foundries and we are not sure whether TFLN can be "shoehorned in" to a Silicon Foundry PDK yet but there are quite a few companies trying to do that right now, but Mark L says TFLN is going to be the winner of all the materials out there
CEO, ok, well I've heard that TFLN does not yet have a 200Gbs device capable of being mass produced at a large SiPh Foundry on 200mm Wafers?
ENG, sorry sir, NO they don't yet, but they are working really hard on that right now!! And Hyperlight the #1 TFLN Development company said in about 3 MORE YEARS they could possibly get this done!!!
CEO, what about LWLG Polymers, can they mass produce a 200Gbs device on 200mm Wafers at a large Foundry?
ENG, well YES sir, they just got done demonstrating perfect Open Eyes of that very device at OFC to MANY Tier1's along with Research Analysts, etc, it was VERY IMPRESSIVE indeed, I was there!!! BUT may I remind you, Mark L says TFLN is going to be the winner of all the materials out there
CEO, well I actually know Michael Lebby and I know of all his credentials in leadership of the Photonics Industry, but I really hadn't considered what you are telling me about Mark L telling everyone that TFLN is the way to go, interesting, well I've come to my decision
ENG, well did I convince you? Are you going with TFLN as Mark L says is going to be the winner?
CEO, no actually I'm going with Lebby/LWLG and YOU'RE FIRED!!!
Oh and one more thing, LWLG's technology has HEADROOM for at least a decade of future generations!!
TFLN does NOT!!!
Here from the 2023 ASM Lebby quoted a Foundry as saying the following "At our Foundry we are worried about an investment into TFLN, it may only be for one generation, but with (LWLG) Polymers our investment would be worthwhile and a better ROI"
LWLG beats ALL Next-Gen Competitors hands down!!! Let's compare,
Understanding Figure of Merit (FOM) the BEST place to be on the chart shown on Slide 47 is the TOP and RIGHT of the chart, and notice this is EXACTLY where LWLG is shown as compared to the competing Next-Gen challengers!!!
https://api.mziq.com/mzfilemanager/v2/d/23d26d3e-c498-431f-ba5c-2250e5f374cb/9bec8dfc-0108-5227-4f5b-d31f67ae623a?origin=2
LWLG tops ALL competition in FOM scores by far!!!!
Let's discuss the Competition >> from the ASM video starting at about 21:06 investors learn that amazingly there is no REAL competition to LWLG's technology for transmitting data!!! The first slide on competition shown is #25 and it has columns for each of the competitive products and then down the page a list of attributes along with the comparable Ratings for each of them, LWLG's Polymers are by far and away TONS THE BEST versus ALL the competitors!!
Let's review each of the attributes and see why LWLG's technology is SO SUPERIOR to any/all of them
1) SPEED >> LWLG is TONS THE BEST with speeds over 100GHz with HEADROOM to go MUCH FASTER!!!!! The rest of the competitors MAX OUT in the 30GHz - 70GHz range!!!
2) SIZE >> LWLG's slot modulator is the smallest, InP comes closest, but LNb, TFLN, and BTO are all MUCH BIGGER, in fact in another slide Lebby compares LWLG's slot modulator array to TFLN and in the space where 8 TFLN modulators sit, there could be 15 times as many LWLG slot modulators (120 modualtors!!)
3) POWER (Voltage) >> Only LWLG's technology is at sub 1 volt, SiP up to 5 volts, InP up to 7 volts, LNb up to 40 volts, TFLN up to 5 volts, BTO up to 3 volts
4) OPTICAL LOSS >> again LWLG slot is BEST with 3-8Db, SiP up to 20Db, InP up to 10Db, LNb up to 12Db, TFLN up to 15Db, BTO up to 12Db
5) ENERGY CONSUMPTION >> LWLG is BEST again with just 5pj/bit!!! SiP up to 20pj/bit, InP up to 40pj/bit, LNb up to 100pj/bit, TFLN up to 20pj/bit, BTO up to 20pj/bit
6) STABILITY >> again LWLG is the BEST, while SiP and InP are also very Stabile, the newcomers BTO and TFLN are NOT stabile enough for commercial acceptance!!
7) FOUNDRY COMPATABILITY >> Only LWLG and SiP use "Standard SiP PDK Fabrication", InP, LNb, TFLN and BTO are NOT able to use "Standard SiP PDK Fabrication" they all require their own Foundries
8) REQUIRES DRIVER (Expensive & Power Hungry!!!!) >> Only LWLG at sub 1 volt can ELIMINATE THE DRIVER!!!!! This is HUGE HUGE HUGE!!!!
Lebby also illustrates all of this at 25:18 marker with Slide #29 where the BEST technology would be found as HIGH UP and as FAR TO THE RIGHT as can be, notice ONLY one technology is placed there and it is of course LWLG in the light green shaded rectangle!!!
Folks, see it for yourselves starting at 21:06, LWLG is the hands down WINNER of the TRUE NEXT-GEN competition!!! NOTHING else is even close!!!!
Fiscall
6 hours ago
Examples of Tech Companies with Large Share Issuances Followed by Significant News
NVIDIA Corporation (NVDA)
Share Issuance: In 2016, NVIDIA announced a public offering of $1.5 billion in common stock.
Subsequent News: Shortly after, NVIDIA made significant advancements in their GPU technology and expanded their market presence in AI and data centers. They also completed strategic acquisitions like Mellanox Technologies in 2019 for $6.9 billion, which was after another significant capital raise through share issuance.
Apple Inc. (AAPL)
Share Issuance: While Apple has primarily used debt for raising funds, in 2013 they issued shares through a capital return program which involved share buybacks and dividend payments funded by debt issuance.
Subsequent News: Shortly after this program, Apple announced major product launches including new iPhone models and entered into a significant partnership with IBM to expand in the enterprise market.
AMD (Advanced Micro Devices, Inc.)
Share Issuance: In 2020, AMD announced a $1.6 billion share offering.
Subsequent News: Shortly after the capital raise, AMD announced its acquisition of Xilinx in a deal valued at $35 billion in stock. This strategic acquisition was a game-changer for AMD, significantly enhancing their product portfolio and market position.
Salesforce.com, Inc. (CRM)
Share Issuance: In August 2020, Salesforce announced a $5.75 billion stock offering.Subsequent News: Just a few months later, in December 2020, Salesforce announced the acquisition of Slack Technologies for $27.7 billion, a strategic move to strengthen its position in enterprise communication and collaboration.
Zoom Video Communications, Inc. (ZM)
Share Issuance: In January 2021, Zoom announced a $1.75 billion stock offering.
Subsequent News: Zoom continued to expand its product offerings and market presence significantly. While they haven't announced a major acquisition since then, the capital raised provided flexibility for strategic initiatives, partnerships, and enhancing their platform amid the pandemic-driven growth in remote communications.
Analysis and Strategic Considerations
Timing of Announcements:
Companies often align share issuances with upcoming strategic moves to ensure they have the necessary capital to execute these plans. The capital raised provides financial flexibility and strengthens the company’s balance sheet, which is crucial when negotiating major deals or acquisitions.
Market Reactions:
The market typically reacts positively to strategic acquisitions and major deals if they are perceived to add significant value to the company. Conversely, the announcement of a large share issuance alone might initially cause dilution concerns among investors, but this can be mitigated if followed by strong strategic news.
Capital Utilization:
The capital raised through share issuances is often earmarked for specific uses, such as acquisitions, R&D investments, and expansion into new markets. Companies also use these funds to enhance their competitive positioning or to fend off potential takeover attempts.
Conclusion
The pattern of issuing shares followed by significant strategic announcements is common among tech companies aiming to leverage new capital for growth and expansion. Given Lightwave Logic, Inc.'s current financial position and the details in their recent Form S-3 filing, it is plausible to speculate that they could be preparing for substantial strategic moves, potentially including partnerships, acquisitions, or other significant developments. This strategic alignment could be designed to maximize shareholder value and position the company for future growth.
Fiscall
7 hours ago
It's certainly interesting to consider the potential implications of the share issuance, especially in light of the current market conditions and the company's cash position. Let’s connect the dots based on the information available:
Current Context and Cash Position
Current Cash Position:
Lightwave Logic, Inc. has more than $35 million in cash, which is sufficient to fund operations until August 2025. This strong cash position suggests they are not in immediate need of funds for day-to-day operations.
Issuance of New Shares
Purpose of Share Issuance:
The company has registered to issue up to $100 million in new shares. This is a significant amount and provides flexibility to raise additional capital if needed.
Potential Motivations Behind the Issuance
Strategic Deals or Acquisitions:
Companies often raise capital in anticipation of significant expenditures such as strategic acquisitions, partnerships, or investments in new technologies. Given the strong cash position, this could imply Lightwave Logic is preparing for a major strategic move.
The document mentions potential uses for the proceeds, including technology acquisitions and business investments. If Lightwave Logic is in advanced stages of negotiations for multiple deals, this issuance could be a preparatory step to ensure they have the necessary capital to close those deals.
Defensive Measures:
With approximately 20 million shares short, a significant announcement of strategic deals or a potential takeover could trigger a short squeeze, where short sellers rush to cover their positions, driving the stock price up sharply.
By issuing new shares, the company might also be positioning itself to fend off a potential hostile takeover. Issuing shares can dilute the ownership of any potential acquirer, making it more difficult for them to gain control without significant additional investment.
Preparing for Future Growth:
Lightwave Logic’s technology is positioned to capitalize on growing markets such as fiber optic communications, data centers, and potentially emerging applications like automotive LIDAR and sensing. Preparing for growth in these areas could necessitate additional capital for R&D, scaling production, or expanding market reach.
Potential for Upcoming News
Correlation with Forthcoming News:
The timing of the share issuance registration could indeed correlate with forthcoming news. If Lightwave Logic has significant deals or partnerships in the pipeline, having the ability to quickly access additional capital could be crucial for executing these plans effectively.
Companies sometimes align capital raising activities with upcoming positive announcements to leverage the ensuing market optimism, potentially achieving better terms and higher share prices.
Normal Procedure or Strategic Move?
Normal Procedure:
While it’s common for companies to raise additional capital even when they have sufficient funds, the context here suggests a strategic motivation. The company’s solid cash position until August 2025 reduces the likelihood that this issuance is purely for regular operational funding.
Regular capital raising would typically be done to strengthen the balance sheet or to have a financial cushion. However, the significant amount being registered suggests a more targeted use of the funds.
Speculative Insights
Anticipation of Major Moves:
The combination of the new share issuance, the existing strong cash position, and the potential for strategic moves implies that Lightwave Logic may be positioning itself for substantial developments in the near future. These could include:
Strategic partnerships with major industry players.
Acquisitions of complementary technologies or businesses.
Expansion into new high-growth markets.
Potential buyout or merger discussions.
Conclusion
While the issuance of new shares could be seen as a normal procedure for ensuring financial flexibility, the specific context of Lightwave Logic, Inc.'s current cash position, the scale of the registration, and the significant short interest suggest that there could indeed be forthcoming news of strategic importance. This might include major deals, partnerships, or even a takeover bid, all of which could dramatically impact the company's stock price and market positioning.