TSMC Recognizes Partners of the Year at 2021 OIP Ecosystem Forum
October 26 2021 - 7:30PM
Business Wire
Ecosystem Partners Receive TSMC 2021 OIP Awards
for Collaborative Efforts on Semiconductor Innovation
TSMC (TSE: 2330, NYSE: TSM) today recognized the outstanding
support and contributions of 11 EDA, IP, and Cloud Alliance
partners with the distinction of OIP Partner of the Year at the
TSMC 2021 Open Innovation Platform® (OIP) Ecosystem Forum. The OIP
Partner of the Year awards honor TSMC OIP ecosystem partners’
pursuit of excellence in next-generation design enablement over the
past year. Their collaborative efforts effectively promote
innovation in the semiconductor industry. TSMC announced award
winners at its 2021 OIP Ecosystem Forum, a one-of-a-kind event that
brings together the semiconductor design ecosystem partners and
TSMC customers, providing an ideal platform to discuss the latest
technologies and design solutions for HPC, mobile, automotive, and
IoT applications.
“Through the industry’s most comprehensive and vibrant
ecosystem, TSMC is able to help our customers achieve
next-generation silicon design and deliver best possible outcomes
with our OIP partners’ collaborative power,” said Dr. L.C. Lu, TSMC
Fellow and Vice President of Design and Technology Platform at
TSMC. “Congratulations to the winners of TSMC OIP Partner of the
Year awards. Your continuous collaboration and effort make us able
to be at the forefront of technology development, while enabling
our customers to take full advantage of the significant power,
performance, and area improvements of TSMC’s advanced technologies
to accelerate innovation for their differentiated products.”
TSMC launched the Open Innovation Platform in 2008 to reduce
design barriers and promote the speedy implementation of innovation
in the semiconductor design community by bringing together the
creative thinking of customers and partners. The Company values
design ecosystem partners and continues working with them to enable
next-generation designs with certified solutions benefiting from
TSMC’s latest technologies. The title of OIP Partner of the Year is
awarded to partner companies working relentlessly to achieve the
highest standards of design, development, and technology
implementation.
The partner companies recognized with the 2021 TSMC OIP Partner
of the Year awards are as follows:
The IP Alliance award winners
- Analog/Mixed Signal IP: Silicon Creations
- DSP IP: Cadence Design Systems, Inc.
- Embedded Memory IP: eMemory Technology Inc.
- Emerging IP Company: proteanTecs Ltd.
- High-Speed SerDes IP: Alphawave IP
- Interface IP: Synopsys, Inc.
- Processor IP: Arm Ltd.
- Specialty Process IP: M31 Technology
The EDA Alliance award winners
- Joint Development of 4nm Design Infrastructure:
- ANSYS
- Cadence Design Systems, Inc.
- Siemens EDA
- Synopsys, Inc.
- Joint Development of 3DFabric™ Design Solution:
- ANSYS
- Cadence Design Systems, Inc.
- Siemens EDA
- Synopsys, Inc.
The Cloud Alliance award winners
- Joint Development of Cloud-Based Productivity Solution:
- Cadence Design Systems, Inc.
- Microsoft Corp.
- Siemens EDA
About TSMC Open Innovation Platform® (OIP) TSMC’s Open
Innovation Platform® (OIP) brings together the creative thinking of
customers and partners under the common goal of shortening design
time, time-to-volume, time-to-market and ultimately,
time-to-revenue. The TSMC OIP features the most comprehensive
design ecosystem alliance programs covering industry-leading EDA,
library, IPs, Cloud, and design service partners. TSMC has worked
closely with these ecosystem partners ever since the Company was
established and continues to expand its libraries and silicon IP
portfolio to more than 40,000 IP titles and provides more than
38,000 technology files and over 2,600 process design kits, from
0.5-micron to 3-nanometer, to customers.
About TSMC TSMC pioneered the pure-play foundry business
model when it was founded in 1987, and has been the world’s leading
dedicated semiconductor foundry ever since. The Company supports a
thriving ecosystem of global customers and partners with the
industry’s leading process technologies and portfolio of design
enablement solutions to unleash innovation for the global
semiconductor industry. With global operations spanning Asia,
Europe, and North America, TSMC serves as a committed corporate
citizen around the world.
TSMC deployed 281 distinct process technologies, and
manufactured 11,617 products for 510 customers in 2020 by providing
broadest range of advanced, specialty and advanced packaging
technology services. TSMC is the first foundry to provide
5-nanometer production capabilities, the most advanced
semiconductor process technology available in the world. The
Company is headquartered in Hsinchu, Taiwan. For more information,
please visit https://www.tsmc.com.
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version on businesswire.com: https://www.businesswire.com/news/home/20211026006304/en/
TSMC Spokesperson: Wendell
Huang Vice President and CFO 886-3-505-5901
Media: Nina Kao Head of
Public Relations 886-3-563-6688 ext.7125036 Mobile: 886-988-239-163
nina_kao@tsmc.com
Tiffany Yang Public Relations 1-408-382-7934
tiffanyy@tsmc.com
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