ACM Research Launches Furnace Tool for Power Device Industry to Address IGBT Process Challenges
December 17 2020 - 4:15PM
ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of
wafer processing solutions for semiconductor and advanced
wafer-level packaging applications, today introduced alloy anneal
capabilities for its Ultra Fn Furnace tool to extend its furnace
product line to power device manufacturers. The new capabilities
are critical to meet the ever-increasing production requirements of
insulated gate bipolar transistor (IGBT) devices as transistors get
thinner, smaller and faster.
According to industry research firm Mordor Intelligence, “The
IGBT market was valued at USD 5.4 billion in 2019, and it is
expected to reach USD 9.38 billion by 2025, at a CAGR of
9.66%, during the forecast period (2020-2025). The broad
application range of IGBTs lured several new companies to venture
into the market. IGBT activates/modifies electrical energy in
several modern appliances, such as cookers, microwaves, electric
cars, trains, variable-frequency drives (VFDs), variable speed
refrigerators, air conditioners, lamp ballasts, municipal power
transmission systems, and stereo systems, which are well-equipped
with switching amplifiers.”1
In addition to rapid end-market growth, manufacturing
requirements for IGBT are also increasing as chip technology
becomes more advanced. Today’s IGBT applications, particularly EVs,
require faster switching capabilities, increased power efficiency,
and higher power density.
“Today’s IGBT devices must be smaller, faster and thinner than
ever,” said David Wang, CEO of ACM Research. “ACM entered this
product category earlier this year with our Thin Wafer Backside
Cleaning System. We have built on our experience and understanding
of power device manufacturing to add alloy anneal capabilities to
the Ultra Fn. This extends our furnace product offering from
foundry customers to now include power device customers.”
The Ultra Fn Furnace tool with alloy anneal capabilities is
customized to perform anneal processes under protective
inert gas, reductive gas conditions or high vacuum
conditions down to the micro-Torr level. With the special design in
the wafer handling system, process tube and boat, it also can be
applied for thin wafers or taiko wafers. The system is intended for
batch processing of up to 100 12-inch (300mm) wafers. The
applications of the Ultra Fn system also can be extended into the
low pressure chemical vapor deposition (LPCVD) process for SIN,
HTO, un-doped poly and doped poly deposition, gate oxide deposition
process, ultra-high temperature processes up to 1200°C, and atomic
layer deposition (ALD).
ACM delivered its first tool customized for alloy anneal
processing early this December to a power device manufacturer in
China. Contact ACM to learn how the Ultra Fn Furnace tool can be
customized to your specifications.
About ACM Research, Inc.ACM develops,
manufactures and sells semiconductor process equipment for
single-wafer or batch wet cleaning, electroplating, stress-free
polishing and thermal processes that are critical to advanced
semiconductor device manufacturing as well as wafer-level
packaging. The company is committed to delivering customized,
high-performance, cost-effective process solutions that
semiconductor manufacturers can use in numerous manufacturing steps
to improve productivity and product yield.
The ACM Research logo is a trademark of ACM Research, Inc. For
convenience, this trademark appears in this press release without a
™ symbol, but that practice does not mean that ACM will not assert,
to the fullest extent under applicable law, its rights to the
trademark.
1.
https://www.mordorintelligence.com/industry-reports/insulated-gate-bipolar-transistor-igbt-market
Media
Contact:Eric LawsonKiterocket+1
480.276.9572elawson@kiterocket.com |
Company Contacts: U.S. Robert MetterACM Research,
Inc. +1-503-367-9753 |
|
EuropeSally-Ann HenryACM Research, Inc.+43 660 7769721 |
|
ChinaXi WangACM Research (Shanghai), Inc.+86 21 50808868 |
|
Korea YY KimACM Research (Korea), Inc.+821041415171 |
|
Subsidiary Contacts SingaporeAdrian Ong+65
8813-1107 |
|
TaiwanDavid Chang+866 921-999-884 |
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