IMOS ChipMOS Technologies Inc

SIGNATURES

Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized.

ChipMOS REPORTS SEPTEMBER 2017 AND 3Q17 REVENUE

Hsinchu, Taiwan, October  6, 2017 - ChipMOS TECHNOLOGIES INC. (“ChipMOS” or the “Company”) (Taiwan Stock Exchange: 8150 and NASDAQ: IMOS), an industry leading provider of outsourced semiconductor assembly and test services (“OSAT”), today reported its unaudited consolidated revenue for the month of September 2017 and for the third quarter ended September 30, 2017. Both periods exclude revenue from ChipMOS Shanghai (see Note 1 below).

Revenue for the third quarter of 2017, was NT$4,431.1 million or US$146.1 million, representing a decrease of 2.4% from the second quarter of 2017, and a decrease of 7.1% from the third quarter of 2016.

Revenue for the month of September 2017, was NT$1,534.2 million or US$50.6 million, an increase of 3.7% from the month of August 2017 and a decrease of 4.6% from the same period in 2016.

All U.S. dollar figures cited in this press release are based on the exchange rate of NT$30.33 to US$1.00 as of September 29, 2017.

Note 1: In March 2017, the Company completed the sale and transfer of 54.98% equity interests of its wholly-owned subsidiary ChipMOS Shanghai to strategic investors. Under Taiwan-International Financial Reporting Standards, starting in Q1 2017 the revenue generated by ChipMOS Shanghai is no longer included in the Company’s consolidated revenue. The Company, however, recognizes 45.02% of the net income generated from ChipMOS Shanghai on an ongoing basis.

About ChipMOS TECHNOLOGIES INC.:

ChipMOS TECHNOLOGIES INC. (Taiwan Stock Exchange: 8150 and NASDAQ: IMOS) (http://www.chipmos.com) is an industry leading provider of outsourced semiconductor assembly and test services. With advanced facilities in Hsinchu Science Park, Hsinchu Industrial Park and Southern Taiwan Science Park in Taiwan, ChipMOS provide assembly and test services to a broad range of customers, including leading fabless semiconductor companies, integrated device manufacturers and independent semiconductor foundries.

Forward-Looking Statements

This press release may contain certain forward-looking statements. These forward-looking statements may be identified by words such as ‘believes,’ ‘expects,’ ‘anticipates,’ ‘projects,’ ‘intends,’ ‘should,’ ‘seeks,’ ‘estimates,’ ‘future’ or similar expressions or by discussion of, among other things, strategy, goals, plans or intentions. These statements may include financial projections and estimates and their underlying assumptions, statements regarding plans, objectives and expectations with respect to future operations, products and services, and statements regarding future performance. Actual results may differ materially in the future from those reflected in forward-looking statements contained in this document, due to various factors. Further information regarding these risks, uncertainties and other factors are included in the Company’s most recent Annual Report on Form 20-F filed with the U.S. Securities and Exchange commission (the “SEC”) and in the Company’s other filings with the SEC.