![ChipMOS Technologies Inc](/common/images/company/N_IMOS.png)
ChipMOS TECHNOLOGIES Inc provides semiconductor testing and packaging solutions to fabless companies, integrated device manufacturers, and foundries. Back-end testing services are offered for high-density memory, mixed-signal, and liquid crystal display driver semiconductors. Packaging and testing o... ChipMOS TECHNOLOGIES Inc provides semiconductor testing and packaging solutions to fabless companies, integrated device manufacturers, and foundries. Back-end testing services are offered for high-density memory, mixed-signal, and liquid crystal display driver semiconductors. Packaging and testing operations are held in Taiwan, but services are offered to a global client base. Testing solutions are carried out for the complete spectrum of integrated circuits, including digital logic, ASIC, high-speed digital, memory, mixed-signal, and LCD devices. Customers seeking package solutions are also offered a diverse group of options that include leadframe-based packages, substrate-based packages, and others. Show more
Period | Change | Change % | Open | High | Low | Avg. Daily Vol | VWAP | |
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1 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | DR |
4 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | DR |
12 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | DR |
26 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | DR |
52 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | DR |
156 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | DR |
260 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | DR |
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