KAOHSIUNG, Sept. 1,
2024 /PRNewswire/ -- E&R
Engineering Corp. (8027.TWO) hosted an event on August 28, 2024, in Taipei, Taiwan, where they launched the
"E-Core System." This initiative, a combination of "E&R" and
"Glass Core" inspired by the sound of "Ecosystem," led to the
establishment of the "Glass Substrate Supplier E-Core System
Alliance." The alliance aims to combine expertise to promote
comprehensive solutions, providing equipment and materials for
next-generation advanced packaging with glass substrates to both
domestic and international customers.
E&R's E-Core Alliance includes Manz AG, Scientech for wet
etching, ShyaWei
Optronics for AOI optical inspection, Lincotec, STK
Corp., Skytech, Group Up for sputtering and ABF lamination
equipment, and other key component suppliers such as HIWIN,
HIWIN Mikrosystem, Keyence Taiwan,
Mirle Group, ACE PILLAR, CHD TECH, and Coherent.
E&R will continue leading the development of glass substrate
technology in Taiwan, optimizing
processes, and collaborating with more industry partners to achieve
excellence.
With the rapid growth in demand for AI chips, high-frequency,
and high-speed communication devices, glass substrates in advanced
packaging technologies are becoming increasingly important.
Compared to the widespread use of copper foil substrates, glass
substrates offer higher wiring density and better signal
performance. Additionally, glass provides high flatness and can
withstand high temperatures and voltages, making it an ideal
replacement for traditional substrates.
The glass substrate process involves glass metallization, ABF
(Ajinomoto Build-up Film) lamination, and final substrate cutting.
Key steps in glass metallization include TGV (Through-Glass Via),
wet etching, AOI (Automated Optical Inspection), sputtering, and
plating. These substrates measure 515×510mm, representing a new
process in semiconductor and substrate manufacturing.
The critical aspect of glass substrate technology is the first
step—glass laser modification (TGV). Although introduced over a
decade ago, its speed had not met mass production requirements,
achieving only 10 to 50 vias per second, limiting the market impact
of glass substrates. E&R Engineering Corp. (8027.TWO) has been working with a North
American IDM customer for the past five years to develop glass
laser modification TGV technology. Last year, the process passed
validation, with E&R mastering key technology, now achieving up
to 8,000 vias per second for fixed patterns (matrix layout) or 600
to 1,000 vias per second for customized patterns (random layout),
with an accuracy of +/- 5 μm, meeting the 3 sigma standard. This
breakthrough has finally enabled glass substrates to reach mass
production.
E&R will also showcase the latest technologies at SEMICON
Taiwan 2024 and SEMICON Europa 2024.
SEMICON Taiwan 2024
- Location: Taipei Nangang Exhibition Center Hall 1
- Booth Information: 4F, #N0968
- Date: September 4-6, 2024
SEMICON Europa 2024
- Location: Messe München
- Booth Information:C2622
- Date: November 12-15, 2024
https://www.enr.com.tw/
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SOURCE E&R Engineering Corp