InvenSense® Ushers in the Era of Sensor System-On-Chip With the World’s First Integrated Motion Sensor & Multi-Core Proces...
January 06 2015 - 9:10AM
Business Wire
ICM-30630 Offers High Performance Sensor
Processing Hub with 6-Axis Motion Sensor in a Single Package, along
with Open Software Framework
InvenSense, Inc. (NYSE:INVN), the leading provider of
intelligent sensor solutions, announced the world’s first Sensor
System on Chip (SoC) integrating a 6-axis MEMS sensor, tri-core
sensor hub, embedded Flash and SRAM, and software framework. The
ICM-30630 disrupts the traditional discrete sensor subsystem in
many applications by providing a true turn-key and open solution in
the same footprint as competitive sensor only devices (3 mm x 3 mm
x 1mm LGA package).
The ICM-30630 consists of three distinct processors; an ARM
Cortex-M0 microcontroller and InvenSense’s next generation Digital
Motion Processors; DMP3 and DMP4. The DMP3 offloads all motion
processing tasks from the CPU and provides ready-to-use physical
and virtual sensors at ultra-low power, while the DMP4’s processing
capabilities complements the CPU by offloading
computationally-intensive operations, drastically reducing power
consumption. In tandem, the InvenSense ICM-30630 sensor software
framework and Cortex-M0 handle vital sensor management tasks via an
integrated RTOS and provides an “Open Platform” that is
programmable by any OEM allowing for custom software features, ease
of programming and quick time-to-market. The resulting solution
supports the acquisition and processing of sensor data from the
integrated 6-axis gyroscope and accelerometer, as well as external
sensors, which in turn significantly reduces system power
consumption and improves ‘AlwaysOn’ performance. The ICM-30630 is
fully compliant with Android Lollipop, and other operating systems,
while supporting multiple application processor platforms.
“InvenSense is expanding its content in the mobile market with
the world’s first multi-core 6-axis motion tracking solution with
integrated sensor-hub framework software, thus creating a fully
autonomous, intelligent sensor SoC,” said Ali Foughi, VP of
Marketing and Business Development. “InvenSense’s new platform
changes the game by saving valuable bill of material costs and
board real estate, while our open software framework enables rapid
time-to-market and unparalleled customer differentiation.”
The ICM-30630 solution is footprint compatible with InvenSense’s
existing devices and will sample 1H of CY2015. InvenSense is
exhibiting in booth #35806 in South Hall 4 at the 2015
Consumer Electronics Show taking place in Las Vegas, Nevada from
January 6 - 9, 2015. To schedule press and partner meetings at the
show, contact pr@invensense.com. For additional information
and data sheets regarding the ICM-30630, please visit
www.invensense.com or contact InvenSense Sales at
sales@invensense.com.
About InvenSense
InvenSense Inc. (NYSE:INVN) is the world’s leading provider of
intelligent sensor solutions for consumer electronic devices. The
company’s patented InvenSense Fabrication Platform and
patent-pending MotionFusion™ technology address the emerging needs
of many mass-market consumer applications via improved performance,
accuracy, and intuitive motion-, gesture- and sound-based
interfaces. InvenSense technology can be found in consumer
electronic products including smartphones, tablets, wearables,
gaming devices, optical image stabilization, and remote controls
for Smart TVs. The company’s MotionTracking products are also being
integrated into a number of industrial applications. InvenSense is
headquartered in San Jose, California and has offices in Canada,
China, France, Korea, Japan, Slovakia, Taiwan, and Boston, MA. More
information can be found at www.invensense.com or follow us on
Twitter at @InvenSense.
©2015 InvenSense, Inc. All rights reserved. InvenSense,
MotionTracking, MotionProcessing, MotionProcessor, MotionFusion,
MotionApps, DMP, AAR, and the InvenSense logo are trademarks of
InvenSense, Inc. Other company and product names may be trademarks
of the respective companies with which they are associated.
For Press Inquiries, Contact:InvenSense, Inc.Ali
Foughi, 408-501-2225Vice PresidentMarketing and Business
DevelopmentDavid Almoslino, 408-501-2278Senior
DirectorMarketing and Communicationspr@invensense.com
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