Aehr Test Systems to Exhibit at SEMICON West in San Francisco July 10-12, 2018
July 02 2018 - 7:30AM
Aehr Test Systems (NASDAQ:AEHR), a worldwide
supplier of semiconductor test and burn-in equipment, today
announced that it will be showcasing its FOX-XP next generation
multi-wafer test and burn-in systems for high volume production and
early failure rate (EFR) test in booth 5381 at SEMICON West 2018,
taking place July 10-12 at the Moscone Convention Center in San
Francisco, California.
In addition, Aehr Test President and CEO Gayn Erickson will be
presenting the keynote address to the attendees at this year’s Test
Vision 2020 conference on Wednesday, July 11 at 10am Pacific.
Held in conjunction with SEMICON West, the conference is
today's premier workshop for semiconductor and system test experts
that includes providers and users of test IP and equipment and is
organized with a vision towards the future of test, to discuss
upcoming trends, innovations, and requirements.
Mr. Erickson commented, “With the increasing requirements on
semiconductors to meet the safety, security, and mission critical
reliability needs of the automotive, mobile, and wearable biosensor
markets, a key question for the semiconductor industry is what the
most effective test strategy is to address these devices. The
industry has the challenge to develop and implement test strategies
that combine traditional automated functional test, reliability /
burn-in, and system level test equipment for a wholistic
methodology to capture and weed out manufacturing related defects
and infant mortality failures to meet quality and reliability needs
that the industry may have never faced in the past.
“Aehr Test is a unique supplier of both complete production
solutions as well as individual components including chambers,
electronics, and thermal control that can be combined with
applications-specific hardware designed with or provided by the
customer. Aehr partners with our customers to develop solutions to
meet their needs for a range of new applications where new
solutions are needed to test and burn-in devices in their
application environment. This includes automotive vehicle
control and sensor systems, sensors and security devices in mobile
smartphones and tablets, and an entire new need for reliability and
assurance of operation in wearable biosensors.”
The solutions Aehr Test will feature at its SEMICON West exhibit
booth include:
- The FOX-XP system, the company’s next-generation multi-wafer
and now singulated die/module test solution that is capable of
functional test and burn-in/cycling of flash memories,
microcontrollers, sensors, and other leading-edge ICs in wafer form
before they are assembled into single or multi-die stacked
packages. The FOX wafer-level systems utilize Aehr Test's FOX
WaferPakTM contactors, which provide cost effective solutions for
making electrical contact with a full wafer or substrate in a
multi-wafer environment. The new configuration with the DiePak®
Carriers also enables burn-in of singulated die and multi-die
modules to screen for defects in both the die and the module
assembly process. The resulting known-good die or single-die or
stacked-die packaged parts can then be used for high reliability
and quality applications such as enterprise solid state drives,
automotive devices, highly valuable mobile applications, and
mission critical integrated circuits and sensors.
- The FOX-1PTM system, Aehr Test’s second generation of its
single-wafer FOX-1 platform originally introduced in 2006, which
has proven to be a cost saving high-volume production solution for
single touchdown 300mm full-wafer parallel test. The new FOX-1P
system can be configured with over 16,000 “Universal Channels” and
features a massively parallel test interface, which enables testing
over a thousand die in a single touchdown.
- The ABTSTM family of packaged part burn-in and test systems,
which is based on a state-of-the-art hardware and software platform
that is designed to address not only today’s devices, but also
future devices for many years to come. This system can test and
burn-in high pin-count devices and there are also configurations
for both high-power and low-power applications.
The key features of the FOX-XP test cell that contribute to the
cost-effectiveness of the solution include the ability to provide
up to 2,048 “Universal Channels” per wafer or DiePak carrier, which
allows the system to test all the devices on the wafer or DiePak
carrier in parallel. The innovative “Universal Channel”
architecture allows any channel to be any function (I/O, Device
Power Supply (DPS) or Per-pin Precision Measurement Unit (PPMU)).
This enhanced architecture now allows customers to perform per pin
parametric testing, more extensive digital pattern test with deeper
data stimulus / capture memory (32M per pin), and deeper scan
(768M) optimized for BIST/DFT testing.
A single FOX-XP test system may be configured with up to 18
slots of test resources enabling up to 18 wafers to be tested
simultaneously. It also includes Aehr’s proprietary WaferPak full
wafer contactor or DiePak carrier, which enables meeting the very
high pin count and small pad size and pad pitch requirements of
today’s devices, and Aehr’s high performance thermal chucks that
enable managing the temperature of the high power density of the
devices under test. The footprint of the 18-slot test system is
similar to the footprint of typical semiconductor Automatic Test
Equipment (ATE) that can only test one wafer at a time.
With the highest wafer throughput available in the ATE industry,
the flexibility of Aehr Test’s new “Universal Channel”
architecture, and the ability to perform both functional pattern
verification and parametric testing at full-wafer parallel test,
the FOX-XP system provides a highly differentiated solution from
competitive alternatives.
About Aehr Test SystemsHeadquartered in
Fremont, California, Aehr Test Systems is a worldwide provider of
test systems for burning-in and testing logic, optical and memory
integrated circuits and has an installed base of more than 2,500
systems worldwide. Increased quality and reliability needs of the
Automotive and Mobility integrated circuit markets are driving
additional test requirements, incremental capacity needs, and new
opportunities for Aehr Test products in package, wafer level, and
singulated die/module level test. Aehr Test has developed and
introduced several innovative products, including the ABTSTM and
FOX-PTM families of test and burn-in systems and FOX WaferPakTM
Aligner, FOX-XP WaferPak Contactor, FOX DiePak® Carrier and FOX
DiePak Loader. The ABTS system is used in production and
qualification testing of packaged parts for both lower power and
higher power logic devices as well as all common types of memory
devices. The FOX-XP system is a full wafer contact and singulated
die/module test and burn-in system used for burn-in and functional
test of complex devices, such as leading-edge memories, digital
signal processors, microprocessors, microcontrollers,
systems-on-a-chip, and integrated optical devices. The WaferPak
contactor contains a unique full wafer probe card capable of
testing wafers up to 300mm that enables IC manufacturers to perform
test and burn-in of full wafers on Aehr Test FOX systems. The
DiePak Carrier is a reusable, temporary package that enables IC
manufacturers to perform cost-effective final test and burn-in of
both bare die and modules. For more information, please visit Aehr
Test Systems’ website at www.aehr.com.
Contacts:
Aehr Test
Systems
MKR
Group Inc.Carl Buck
Todd Kehrli or Jim ByersV.P of
Marketing
Analyst/Investor Contact (510)
623-9400 x381
(323)
468-2300cbuck@aehr.com
aehr@mkr-group.com
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