Aehr Test Systems to Participate at the Craig-Hallum Alpha Select Conference in New York on November 16, 2017
November 09 2017 - 7:30AM
Aehr Test Systems (NASDAQ:AEHR), a worldwide
supplier of semiconductor test and burn-in equipment, today
announced it has been invited to participate at the eighth annual
Craig-Hallum Alpha Select Conference on November 16, 2017 at the
Sheraton New York Times Square Hotel in New York City.
Gayn Erickson, President and CEO, and Ken Spink, CFO, will host
one-on-one and small group meetings with institutional investors
throughout the day. To schedule a meeting, please contact either
your Craig-Hallum representative, or the MKR Group, Aehr Test’s
investor relations firm, at aehr@mkr-group.com.
About Aehr Test
SystemsHeadquartered in Fremont, California, Aehr Test
Systems is a worldwide provider of test systems for burning-in and
testing logic, optical and memory integrated circuits and has an
installed base of more than 2,500 systems worldwide. Increased
quality and reliability needs of the Automotive and Mobility
integrated circuit markets are driving additional test
requirements, incremental capacity needs, and new opportunities for
Aehr Test products in package, wafer level, and singulated
die/module level test. Aehr Test has developed and introduced
several innovative products, including the ABTSTM and FOX-PTM
families of test and burn-in systems and FOX WaferPak Aligner,
FOX-XP WaferPak Contactor, and FOX DiePak® Carrier. The ABTS system
is used in production and qualification testing of packaged parts
for lower power and higher power logic devices as well as all
common types of memory devices. The FOX-XP system is a full wafer
contact and singulated die/module test and burn-in system used for
burn-in and functional test of complex devices, such as
leading-edge memories, digital signal processors, microprocessors,
microcontrollers, systems-on-a-chip, and integrated optical
devices. The WaferPak contactor contains a unique full wafer probe
card capable of testing wafers up to 300mm that enables IC
manufacturers to perform test and burn-in of full wafers on Aehr
Test FOX systems. The DiePak Carrier is a reusable, temporary
package that enables IC manufacturers to perform cost-effective
final test and burn-in of both bare die and modules. For more
information, please visit Aehr Test System’s website at
www.aehr.com.
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Contacts: |
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Aehr Test Systems |
MKR Group Inc. |
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Ken
Spink |
Todd
Kehrli or Jim Byers |
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Chief
Financial Officer |
Analyst/Investor Contact |
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(510)
623-9400 x309 |
(323)
468-2300 |
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aehr@mkr-group.com |
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