Certification enables customers to leverage the
integrated, comprehensive AMS solution to facilitate accelerated
designs on UMC’s most advanced 28nm node
Cadence Design Systems, Inc. (NASDAQ: CDNS) and United
Microelectronics Corporation (NYSE: UMC; TWSE: 2303) ("UMC"), a
leading global semiconductor foundry, today announced that the
Cadence® analog/mixed-signal (AMS) IC design flow has achieved
certification for UMC’s 28HPC+ process technology. With this
certification, mutual Cadence and UMC customers have access to a
comprehensive AMS solution for designing automotive, industrial
internet of things (IoT) and artificial intelligence (AI) chips
using 28HPC+ technology. The complete AMS flow, based on UMC’s
Foundry Design Kit (FDK), includes an actual demonstration circuit
with a highly automated circuit design, layout, signoff and
verification flow that enables more seamless design on 28HPC+.
The Cadence AMS flow incorporates the proven custom/analog,
digital and verification platforms, and supports the broader
Cadence Intelligent System Design™ strategy, accelerating SoC
design excellence. The AMS flow features integrated standard cell
digital capabilities that are well suited for digitally assisted
analog designs, and is an ideal solution for customers developing
automotive, industrial IoT and AI applications using the 28HPC+
technology.
The complete, certified AMS flow includes the Virtuoso® Analog
Design Environment (ADE), Virtuoso Schematic Editor, Virtuoso
Layout Suite, Virtuoso Space-Based Router, Spectre® Accelerated
Parallel Simulator (APS), Spectre AMS Designer with integrated
Xcelium™ Parallel Logic Simulation, Voltus™-Fi Custom
Power Integrity Solution, Innovus™ Implementation System, Quantus™
Extraction Solution and Physical Verification System (PVS). The
flow provides the following:
- Front-end design: Provides corner, statistical and
reliability simulation; circuit and device checks; and analog and
mixed-signal simulation and verification management.
- Custom layout design: Offers an advanced,
electromigration and parasitic-aware environment that includes
schematic-driven layout and module generation, wire-editor and
pin-to-trunk routing, symbolic placement, electrically aware design
and voltage-dependent rules.
- Post-layout parasitic simulation and electromigration and IR
drop (EM-IR) analysis and integrated signoff: Includes
parasitic extraction, DRC, and layout versus schematic (LVS)
checks.
- Mixed-Signal OpenAccess: Enables full interoperability
between the Virtuoso and Innovus platforms operating on a single
OpenAccess design database, enabling mixed-signal designers to
seamlessly perform digital block implementation using Innovus tools
directly from within the Virtuoso cockpit.
“In collaboration with UMC, Cadence has delivered a certified,
integrated flow for AMS design at 28HPC+ technology based on
Cadence’s industry-leading custom/analog, digital and signoff, and
verification platforms,” said Wilbur Luo, vice president, product
management in the Custom and PCB Group at Cadence. “This
certification drives SoC design excellence and allows UMC customers
to take advantage of the most advanced tool feature sets for
circuit design, performance and reliability verification, automated
layout, and block and chip integration, enabling them to design
automotive, industrial IoT and AI applications with
confidence.”
UMC's production-ready 28HPC+ process utilizes a
high-performance High-k/Metal Gate stack to support broad device
options for increased flexibility and performance requirements,
targeting a wide range of products such as application processors,
cellular basebands, Wi-Fi, DTV/STB, mmWave, etc. The High-k-/metal
gate stack and abundant options for core device Vt, various memory
bit-cells and under drive/overdrive I/O capabilities help SoC
designers realize unmatched cost, performance and battery life.
“Through our collaboration with Cadence, we have developed a
comprehensive and unique offering that utilizes the Cadence AMS
flow and a UMC design kit to offer a reliable and efficient flow
for designing with our 28HPC+ process technology,” said T.H. Lin,
director of the IP Development and Design Support division at UMC.
“Leveraging the capabilities of this flow, which was created with
the intention of providing detailed instructions so that users
could improve productivity with UMC’s process, customers can
deliver innovative, next-generation products to market faster.”
For more information on the Cadence AMS flow that supports the
UMC 28HPC+ process technology, visit
www.cadence.com/go/UMC28HPCp.
About Cadence
Cadence enables electronic systems and semiconductor companies
to create the innovative end products that are transforming the way
people live, work and play. Cadence software, hardware and
semiconductor IP are used by customers to deliver products to
market faster. The company’s Intelligent System Design strategy
helps customers develop differentiated products—from chips to
boards to intelligent systems—in mobile, consumer, cloud data
center, automotive, aerospace, IoT, industrial and other market
segments. Cadence is listed as one of Fortune Magazine's 100 Best
Companies to Work For. Learn more at cadence.com.
About UMC
UMC (NYSE: UMC, TWSE: 2303) is a leading global semiconductor
foundry that provides advanced IC production for applications
spanning every major sector of the electronics industry. UMC’s
comprehensive foundry solutions enable chip designers to leverage
the company’s sophisticated technology and manufacturing, which
include world-class 28nm High-K/Metal Gate technology, 14nm FinFET
volume production, specialty process platforms specifically
developed for AI, 5G and IoT applications and the automotive
industry’s highest-rated AEC-Q100 Grade-0 manufacturing
capabilities for the production of ICs found in vehicles. UMC’s 11
wafer fabs are strategically located throughout Asia and are able
to produce more than 600,000 wafers per month. The company employs
approximately 18,500 people worldwide, with offices in Taiwan,
China, Europe, Japan, Korea, Singapore, and the United States. UMC
can be found on the web at http://www.umc.com.
Note from UMC Concerning Forward-Looking Statements
Some of the statements in the foregoing announcement are
forward-looking within the meaning of the U.S. Federal Securities
laws, including statements about introduction of new services and
technologies, future outsourcing, competition, wafer capacity,
business relationships and market conditions. Investors are
cautioned that actual events and results could differ materially
from these statements as a result of a variety of factors,
including conditions in the overall semiconductor market and
economy; acceptance and demand for products from UMC; and
technological and development risks. Further information regarding
these and other risks is included in UMC’s filings with the U.S.
Securities and Exchange Commission. UMC does not undertake any
obligation to update any forward-looking statement as a result of
new information, future events or otherwise, except as required
under applicable law.
© 2019 Cadence Design Systems, Inc. All rights reserved
worldwide. Cadence, the Cadence logo and the other Cadence marks
found at www.cadence.com/go/trademarks are trademarks or registered
trademarks of Cadence Design Systems, Inc. All other trademarks are
the property of their respective owners.
View source
version on businesswire.com: https://www.businesswire.com/news/home/20190806005340/en/
For more information, please contact: Cadence Newsroom
408-944-7039 newsroom@cadence.com
UMC Richard Yu (886) 2-2658-9168 ext. 16951
richard_yu@umc.com
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