MOUNTAIN VIEW, Calif.,
Oct. 22, 2020 /PRNewswire/
-- Synopsys, Inc. (Nasdaq: SNPS) today announced that
its 3DIC Compiler solution enabled Samsung Foundry to
design, implement and tape out a complex 5-nanometer SoC featuring
eight high-bandwidth memories (HBMs) in a single package. With 3DIC
Compiler, Samsung's multi-die integration (MDI™), based
on silicon interposer technology, was able to scale complexity and
capacity of new SoC designs for high-performance computing (HPC)
applications. The collaboration with 3DIC Compiler accelerated
Samsung's design productivity and reduced turnaround time from
months to hours.
Advanced packaging has become increasingly important to address
key design challenges in accelerating markets, such as HPC, which
is driving the growing number of HBMs integrated in a package for
higher bandwidth and faster access. With each HBM stack
integration, thousands of additional die-to-die interconnects are
required, increasing the design complexities of a multi-die system
in a package and the need for extensive analysis from early
exploration to design signoff.
"AI and high-end networking applications increasingly require
higher levels of integration, high-performance computing and
increased memory access – all driving the demand for
advanced-packaging technologies," said Sangyun Kim, vice
president of Foundry Design Technology Team at Samsung Electronics.
"Samsung's innovative MDI silicon interposer technology enables
customer innovation with greater functionality and enhanced system
performance while allowing smaller form factors and faster time to
market. Our collaboration with Synopsys provides customers with a
comprehensive co-design and co-analysis solution for designing with
Samsung's MDI technologies ensuring high productivity and faster
time to production."
Synopsys' 3DIC Compiler is built on a unified platform that
leverages signal integrity-aware automated routing and shielding
capabilities for co-design efficiency. 3DIC Compiler provides a
comprehensive set of features for design automation, including bump
placement, high-density routing and shielding. To ensure design
robustness, 3DIC Compiler also provides in-design support of the
Ansys® RedHawk™ family of chip-package
co-simulation tools for a comprehensive analysis of signal and
power integrity, and thermal reliability for large numbers of HBM
stacks in a package using Samsung's silicon interposer
technology.
"SoC teams face complex design challenges when developing
heterogenous designs using multi-die solutions for leading-edge
applications including HPC, AI, 5G and automotive," said
Charles Matar, senior vice president of System Solutions and
Ecosystem Enablement for the Design Group at Synopsys. "Our work
with Samsung provides an optimal ecosystem for advanced levels of
integration and technological innovation, resulting in a faster
time to market, solving complex architectures and improved system
level cost for our customers."
Synopsys experts will discuss Synopsys' 3DIC Compiler's
capabilities, design flow methodologies and enablement optimized
for Samsung Foundry's MDI technologies at the upcoming Samsung
Advanced Foundry Ecosystem (SAFE) Forum on October 28. For more information about 3DIC
Compiler, visit: https://www.synopsys.com/3DIC.
About Synopsys
Synopsys, Inc. (Nasdaq: SNPS) is the
Silicon to Software™ partner for innovative companies
developing the electronic products and software applications we
rely on every day. As the world's 15th largest software
company, Synopsys has a long history of being a global leader in
electronic design automation (EDA) and semiconductor IP and is also
growing its leadership in software security and quality solutions.
Whether you're a system-on-chip (SoC) designer creating advanced
semiconductors, or a software developer writing applications that
require the highest security and quality, Synopsys has the
solutions needed to deliver innovative, high-quality, secure
products. Learn more at www.synopsys.com.
Editorial
Contact:
Simone Souza
Synopsys, Inc.
650-584-6454
simone@synopsys.com
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SOURCE Synopsys, Inc.