Aehr Test Systems (NASDAQ: AEHR), a worldwide
supplier of semiconductor test and burn-in equipment, today
announced that it began shipments of its recently introduced FOX-CP
and FOX-NP test and burn-in systems in its fourth quarter of fiscal
2019, which closed on May 31, 2019. These shipments, which included
multiple FOX-NP systems, were for orders previously announced
earlier this year. The new FOX-CP and FOX-NP systems, which were
introduced in the last few months, are the newest additions to
Aehr’s FOX-PTM family of semiconductor wafer level and singulated
die test and burn in systems.
Commenting on these shipments, Gayn Erickson, President and CEO
of Aehr, stated, “We are pleased to have shipped this initial
FOX-CP test and burn-in system to a major new customer. This system
will be used for 100% test and burn-in of devices in a very
high-volume application for the enterprise and data center market,
with a build out of this production ramp over the next several
years. This customer forecasts additional FOX-CP systems to be
delivered to multiple locations worldwide, where we will support
the turnkey solution directly with Aehr Test personnel.
“We see the data storage market, as well as multiple devices
related to the worldwide 5G build-out, as critical new
opportunities for our systems, where these end markets and
customers require devices to have extremely high levels of quality
and long-term reliability. IDC, a global provider of market
intelligence for the information technology, telecommunications,
and consumer technology markets, recently released a report
forecasting that the collective sum of the world’s data will grow
from 33 zettabytes in 2018 to 175 zettabytes by 2025, for a
compounded annual growth rate of 61 percent. A zettabyte equals one
trillion gigabytes.”
The FOX-CP is a new low-cost single-wafer compact test and
reliability verification solution for logic, memory and photonic
devices. The FOX-CP reduces test cost by functionally testing
wafers during reliability screening to identify failing
logic/memory/photonic die before the die are integrated into their
final package, and is optimal for test times ranging from minutes
to a few hours or where multiple touchdowns are required to test
the entire wafer. It complements the capabilities of the FOX-XPTM
and FOX-NP systems, which are optimal when the test time is
measured in hours or days and the full wafer can be tested in a
single touchdown.
Mr. Erickson continued, “We are also pleased to have shipped
several FOX-NP test and burn-in systems to two different customers
in our fiscal fourth quarter. One of these is a new customer who
will utilize the FOX-NP for initial product development,
qualification and production, and then plans to transition to high
volume production test and burn-in of 100% of their silicon
photonics chips using our FOX-XP multi-wafer and singulated
die/module test solution. The other is a leading semiconductor
manufacturer who will utilize the FOX-NP to compliment their
existing fleet of FOX-XP test and burn-in systems and provide
additional test and qualification capacity as a result of
increasing variety of silicon photonics devices.
“We are very optimistic about the silicon photonics and
photonics sensors markets and believe they will be significant
growth drivers for Aehr. Market research company Yole Développement
predicts silicon photonics technology will grow from being used in
a few percent of the total optical transceiver market in 2016 to
35% of the market in 2025, with a market value for transceivers of
almost $4 billion in 2025. The rapid growth of integrated optical
devices in high-performance servers and data centers, mobile
devices, automotive applications, and now wearable biosensors is
driving substantially higher requirements for initial quality and
long-term reliability, and the requirements are increasing with
every new product generation. We believe these new applications are
driving an entirely new level of quality and reliability
expectation for these systems and pose a significant long-term
growth opportunity for Aehr.”
For further perspective on the silicon photonics market, the
Yole Développement article is available at
http://www.yole.fr/SiPhotonics_MarketStatus.aspx.
The FOX-NP is a low cost entry-level system to provide a
configuration and price point for companies to do initial
production qualification and new product introduction,
enabling an easier transition to the FOX-XP system for
high volume production test. The FOX-NP system is 100% compatible
with the FOX-XP system and is configurable with up to two blades
per system compared to up to 18 blades in the FOX-XP system.
Aehr’s FOX-P Platform is the company’s next-generation
multi-wafer and singulated die/module test solution that is capable
of functional test and burn-in/cycling of photonics devices, flash
memories, microcontrollers, sensors, and other leading-edge ICs
before they are assembled into single or multi-die stacked
packages. The FOX wafer-level systems utilize Aehr’s FOX WaferPakTM
contactors, which provide cost effective solutions for making
electrical contact with a full wafer or substrate in a multi-wafer
environment. The configuration with the DiePak® Carriers enables
burn-in of singulated die and multi-die modules to screen for
defects in both the die and the module assembly process. The
resulting known-good die, single-die or stacked-die packaged parts
can then be used for high reliability and quality applications such
as enterprise solid state drives, automotive devices, highly
valuable mobile applications, and mission critical integrated
circuits and sensors.
The key features of the FOX-P Platform that contribute to the
cost-effectiveness of the solution include the ability to provide
up to 2,048 “Universal Channels” per wafer or DiePak carrier, which
allows the system to test all the devices on the wafer or DiePak
carrier in parallel. The innovative “Universal Channel”
architecture allows any channel to be any function (I/O, Device
Power Supply (DPS) or Per-pin Precision Measurement Unit (PPMU)).
This enhanced architecture now allows customers to perform per pin
parametric testing, more extensive digital pattern test with deeper
data stimulus / capture memory (32M per pin), and deeper scan
(768M) optimized for BIST/DFT testing. A single FOX-XP test system
may be configured with up to 18 blades of wafer test resources,
enabling up to 18 wafers to be tested simultaneously. The footprint
of the 18-wafer test system is similar to the footprint of typical
semiconductor Automatic Test Equipment (ATE) that can only test one
wafer at a time. The highly integrated 2-blade FOX-NP system has a
very small footprint and is designed to be easily integrated into
product design, reliability and test lab applications.
About Aehr Test SystemsHeadquartered in
Fremont, California, Aehr Test Systems is a worldwide provider of
test systems for burning-in and testing logic, optical and memory
integrated circuits and has over 2,500 systems installed worldwide.
Increased quality and reliability needs of the Automotive and
Mobility integrated circuit markets are driving additional test
requirements, incremental capacity needs, and new opportunities for
Aehr Test products in package, wafer level, and singulated
die/module level test. Aehr Test has developed and introduced
several innovative products, including the ABTSTM and FOX-PTM
families of test and burn-in systems and FOX WaferPakTM Aligner,
FOX-XP WaferPak Contactor, FOX DiePak® Carrier and FOX DiePak
Loader. The ABTS system is used in production and qualification
testing of packaged parts for both lower power and higher power
logic devices as well as all common types of memory devices. The
FOX-XP and FOX-NP systems are full wafer contact and singulated
die/module test and burn-in systems used for burn-in and functional
test of complex devices, such as leading-edge memories, digital
signal processors, microprocessors, microcontrollers,
systems-on-a-chip, and integrated optical devices. The FOX-CP
system is a new low-cost single-wafer compact test and reliability
verification solution for logic, memory and photonic devices and
the newest addition to the FOX-P product family. The WaferPak
contactor contains a unique full wafer probe card capable of
testing wafers up to 300mm that enables IC manufacturers to perform
test and burn-in of full wafers on Aehr Test FOX systems. The
DiePak Carrier is a reusable, temporary package that enables IC
manufacturers to perform cost-effective final test and burn-in of
both bare die and modules. For more information, please visit Aehr
Test Systems’ website at www.aehr.com.
Safe Harbor Statement This press release
contains certain forward-looking statements based on current
expectations, forecasts and assumptions that involve risks and
uncertainties. These statements are based on information available
to Aehr as of the date hereof and actual results could differ
materially from those stated or implied due to risks and
uncertainties. Forward-looking statements include statements
regarding Aehr’s expectations, beliefs, intentions or strategies
regarding its products, including statements regarding future
market opportunities and conditions, expected product shipment
dates and customer orders or commitments. These risks and
uncertainties include, without limitation, customer demand and
acceptance of Aehr’s products, the ability of new products to meet
customer needs or perform as described, as well as general market
conditions and Aehr’s ability to execute on its business strategy.
See Aehr’s recent 10-K, 10-Q and other reports from time to time
filed with the Securities and Exchange Commission for a more
detailed description of the risks facing Aehr’s business. Aehr
disclaims any obligation to update information contained in any
forward-looking statement to reflect events or circumstances
occurring after the date of this press release.
Contacts:
Aehr Test
Systems
MKR Investor Relations Inc.Vernon
Rogers
Todd Kehrli or Jim ByersE.V.P of Sales &
Marketing
Analyst/Investor Contact (510) 623-9400
x215
(323)
468-2300vrogers@aehr.com
aehr@mkr-group.com
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