Amphenol, Keysight Technologies, Molex and TE
Connectivity showcase 200G/lane copper links with Marvell DSPs for
increasing data center bandwidth
SANTA
CLARA, Calif., Jan. 31,
2024 /PRNewswire/ -- Marvell Technology, Inc.
(NASDAQ: MRVL), a leader in data infrastructure semiconductor
solutions, and leading cabling and system partners Amphenol,
Keysight Technologies, Molex and TE Connectivity (TE) this week are
demonstrating copper interconnects powered by Marvell®
224G long-reach (LR) DSP SerDes operating at 200 Gbps per lane or
faster, a critical milestone in the race to scale accelerated
infrastructure for AI and cloud workloads.
The demonstrations are taking place during DesignCon at the
Santa Clara Convention Center
January 30 through February 1, 2024
in Santa Clara, California.
Cloud service providers are undertaking wide-ranging
infrastructure upgrades to accommodate the insatiable demand for
generative AI and other services. Networking bandwidth in the cloud
is growing at over 40% per year while bandwidth dedicated to AI is
growing at over 100%.1 Without faster, higher capacity
networks, workloads will require more time, energy, and money to
complete, potentially upending the economic potential of AI and
cloud services.
Electrical copper cables are used for short reach
(0-5m) server to top-of-rack switch
connectivity and for certain cloud-optimized intra-rack
interconnects in data centers. Boosting baseline I/O lane speed to
200G/lane represents a 2x increase in bandwidth over current
leading-edge 100G/lane systems. Marvell 200G/lane LR DSP SerDes are
expected to be incorporated into a wide range of networking
platforms that will extend the reach of copper links with
cabled-backplane, cabled-host connections and other cabling
solutions. Marvell 200G/lane LR DSP SerDes will also extend copper
connectivity bandwidth and enable 1.6T Active Electrical Cables
(AECs).
"Driven by the market's need for increased speed, Molex is
collaborating with Marvell to deliver an industry-leading,
comprehensive 224G connector, cable, and backplane portfolio that
ensures optimal channel performance for AI, machine learning (ML)
and 1.6T high-speed applications," said Vivek Shah, director, New Product Development,
Molex.
"Keysight is working with its partners and standard bodies to
enable the next generation high-performance computing
infrastructure to cope with the rapidly expanding computing and
networking needs to support the upcoming AI applications," said Dr.
Joachim Peerlings, vice president and general manager of Keysight's
Network and Data Center Solutions Group.
"Active electrical technology extends the life of copper in data
centers," said Alan Weckel,
co-founder of 650 Group. "It will quickly become one of the
standard building blocks for data centers. AEC silicon revenue is
expected to grow at 64% per year and achieve sales of $1 billion by 2028 with chip units for powering
AEC devices reaching nearly 40 million per year."
Marvell is a leader in AEC and DSP technology. In March 2022, Marvell released the
Alaska® A PAM4 DSP, the
first 100G DSP for 400/800 Gbps AEC cables. In April 2023, Marvell unveiled a portfolio of
connectivity technologies, including long-reach SerDes, produced on
3nm processes, an industry first.
"Virtually every class of connection in the cloud—from
connections between distant data centers to connections between
components within a chip package—will be transformed over the next
several years. Active electrical cable (AEC) connectivity will be a
critical component for short reach interconnects at 200G," said
Venu Balasubramonian, vice president
of product marketing for the High Speed Connectivity Group at
Marvell. "We are actively collaborating with our ecosystem partners
and our hyperscale customers to deploy 200G/lane copper
interconnect technologies to enable the scaling of bandwidth needed
to keep up with the pace of AI innovation."
Demos at DesignCon
Amphenol (booth 833)
Amphenol, in collaboration
with Marvell, will be showcasing a live demonstration
of a cabled-fabric across multiple applications within a data
center rack. The demonstration will feature Amphenol
Paladin®HD2 right-angle female
(RAF) board mount connector, a
Paladin®HD2 pass-thru cable assembly,
and UltraPass™. UltraPass™ is
Amphenol's newest OverPass™ solution for
providing high-density, 224 Gb/s
performance for near-ASIC
interfaces.
Keysight Technologies (booth 1039)
In order to process
the large datasets associated with AI and large language models,
bandwidth improvements are needed in both the compute-oriented
interfaces as well as those used to enable higher speed data
networks. Keysight and Marvell will demonstrate the testing and
validation of next-gen SerDes designs running at 212 Gbps per lane
which are used to enable high-performance computing. This demo will
be based on the latest development of the OIF-CEI 224G and IEEE
802.3dj standard bodies.
Molex (booth 739)
Through the collaboration
with Marvell, Molex is demonstrating an OSFP
SMT and DAC channel, OSFP
BiPass/Flyover internal cable solution, and iHD
backplane capabilities, all driven by Marvell
200G LR SerDes. In addition, Molex plans to
adopt Marvell 200G DSP technology for the
next evolution of Active Electrical Cables
(AECs).
TE Connectivity (booth 913)
TE is showcasing a
cabled backplane architecture plus over-the-board
(OTB) near-chip connectivity, utilizing 224G
AdrenaLINE Catapult near-chip connector and AdrenaLINE
Slingshot cabled backplane connector
(cable-to-cable and cable-to-board). The demo is being driven
by Marvell 224 Gbps DSP SerDes
silicon.
1. 650 Group, DC Semiconductors Report Nov 29, 2023.
About Marvell
To deliver the data infrastructure
technology that connects the world, we're building solutions on the
most powerful foundation: our partnerships with our customers.
Trusted by the world's leading technology companies for over 25
years, we move, store, process and secure the world's data with
semiconductor solutions designed for our customers' current needs
and future ambitions. Through a process of deep collaboration and
transparency, we're ultimately changing the way tomorrow's
enterprise, cloud, automotive, and carrier architectures
transform—for the better.
Marvell and the M logo are trademarks of Marvell or its
affiliates. Please visit www.marvell.com for a complete list of
Marvell trademarks. Other names and brands may be claimed as the
property of others.
This press release contains forward-looking statements within
the meaning of the federal securities laws that involve risks and
uncertainties. Forward-looking statements include, without
limitation, any statement that may predict, forecast, indicate or
imply future events, results or achievements. Actual events,
results or achievements may differ materially from those
contemplated in this press release. Forward-looking statements are
only predictions and are subject to risks, uncertainties and
assumptions that are difficult to predict, including those
described in the "Risk Factors" section of our Annual Reports on
Form 10-K, Quarterly Reports on Form 10-Q and other documents filed
by us from time to time with the SEC. Forward-looking statements
speak only as of the date they are made. Readers are cautioned not
to put undue reliance on forward-looking statements, and no person
assumes any obligation to update or revise any such forward-looking
statements, whether as a result of new information, future events
or otherwise.
For further information, contact:
Michael Kanellos
pr@marvell.com
View original content to download
multimedia:https://www.prnewswire.com/news-releases/marvell-extends-connectivity-leadership-for-accelerated-infrastructure-with-200glane-partner-demonstrations-at-designcon-302048811.html
SOURCE Marvell