Alpha and Omega Semiconductor Announces Innovatively Designed Double-Sided Cooling DFN 5x6 Package
January 24 2024 - 8:00AM
Business Wire
The AONA66916 Power MOSFET in AOS’ new
top-exposed DFN 5 x 6 achieves industry leading thermal performance
to enable cooler, more reliable designs
Alpha and Omega Semiconductor Limited (AOS) (Nasdaq: AOSL), a
designer, developer, and global supplier of a broad range of
discrete power devices, wide band gap power devices, power
management ICs, and modules, today announced the AONA66916, a 100V
MOSFET packaged in the company’s innovatively designed top and
bottom side cooling DFN 5 x 6 package. Designers have long trusted
AOS power semiconductors as essential components that help them
meet a wide variety of high-performance application requirements.
Now, in delivering a state-of-the-art package that keeps its
semiconductor products cooler, AOS is taking a huge step in
enabling engineers to develop more efficient designs in
telecommunications and industrial applications that must frequently
operate in harsh conditions.
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The AONA66916 Power MOSFET in AOS’ new
top-exposed DFN 5 x 6 achieves industry leading thermal performance
to enable cooler, more reliable designs (Graphic: Business
Wire)
Typically, when using the standard DFN 5x6 package, the bottom
contact is the main contributor for cooling, and most of the heat
generated by the Power MOSFETs will be transferred to the PCB. This
increases the PCB thermal management design considerations to meet
system requirements. AOS’ new top and bottom cooling DFN 5x6
package is designed to achieve the highest heat transfer between
the exposed top contact and heat sink due to its large surface
contact area construction. This allows the device to achieve a low
thermal resistance (Rthc-top max) of 0.5°C / W with results being
transferred to the PCB board, enabling significant thermal
performance improvements. The top exposed DFN 5x6 package of the
AONA66916 shares the same 5mm x 6mm footprint as AOS’ standard DFN
5x6 package, eliminating the need to modify existing PCB
layouts.
Another benefit of the AONA66916 is that it utilizes AOS’ 100V
AlphaSGT™ technology, providing excellent FOM for balanced
performance in hard switching applications. AONA66916 has a maximum
RDS(on) rating of 3.4mOhms and has a 175°C junction temperature
rating.
“Cooling the power MOSFET in high power design can be
challenging, and AOS has successfully addressed this essential
issue with our advanced top exposed package design. It not only
enables better thermal transfer from its top side exposed contact
to heat sink due to large exposed surface area, our new package
delivers a much cooler device that contributes to a more efficient
and robust final design,” said Peter H. Wilson, Marketing Sr.
Director of the MOSFET product line at AOS.
Technical Highlights
Part Number
VDS (V)
VGS (±V)
RDS(ON) Max (mOhms)
@10V
Rthjc – max
(C/W)
Junction Temp
(C)
Continuous Drain Current
(A)
Top
bottom
@25°C
AONA66916
100
20
3.4
0.5
0.55
175
197
Pricing and Availability
The AONA66916 is immediately available in production quantities
with a lead time of 14-16 weeks. The unit price for 1,000 pieces is
$1.85.
About AOS
Alpha and Omega Semiconductor Limited, or AOS, is a designer,
developer, and global supplier of a broad range of discrete power
devices, wide band gap power devices, power management ICs, and
modules, including a wide portfolio of Power MOSFET, SiC, IGBT,
IPM, TVS, Gate Drivers, Power IC, and Digital Power products. AOS
has developed extensive intellectual property and technical
knowledge that encompasses the latest advancements in the power
semiconductor industry, which enables us to introduce innovative
products to address the increasingly complex power requirements of
advanced electronics. AOS differentiates itself by integrating its
Discrete and IC semiconductor process technology, product design,
and advanced packaging know-how to develop high-performance power
management solutions. AOS’ portfolio of products targets
high-volume applications, including portable computers, flat-panel
TVs, LED lighting, smartphones, battery packs, consumer and
industrial motor controls, automotive electronics, and power
supplies for TVs, computers, servers, and telecommunications
equipment. For more information, please visit www.aosmd.com.
Forward-Looking Statements
This press release contains forward-looking statements that are
based on current expectations, estimates, forecasts, and
projections of future performance based on management’s judgment,
beliefs, current trends, and anticipated product performance. These
forward-looking statements include, without limitation, references
to the efficiency and capability of new products and the potential
to expand into new markets. Forward-looking statements involve
risks and uncertainties that may cause actual results to differ
materially from those contained in the forward-looking statements.
These factors include but are not limited to, the actual product
performance in volume production, the quality and reliability of
the product, our ability to achieve design wins, the general
business and economic conditions, the state of the semiconductor
industry, and other risks as described in the Company’s annual
report and other filings with the U.S. Securities and Exchange
Commission. Although the Company believes that the expectations
reflected in the forward-looking statements are reasonable, it
cannot guarantee future results, level of activity, performance, or
achievements. You should not place undue reliance on these
forward-looking statements. All information provided in this press
release is as of today’s date unless otherwise stated, and AOS
undertakes no duty to update such information except as required
under applicable law.
View source
version on businesswire.com: https://www.businesswire.com/news/home/20240124903450/en/
Media Contact: Mina Galvan Tel: 408.789.3233 Email:
mina.galvan@aosmd.com
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