Today at its Financial Analyst Day, AMD (NASDAQ: AMD) outlined its
strategy to deliver its next phase of growth driven by the
company’s expanded portfolio of high-performance and adaptive
computing products spanning the data center, embedded, client, and
gaming markets.
“From the cloud and PCs to communications and intelligent
endpoints, AMD’s high-performance and adaptive computing solutions
play an increasingly larger role in shaping the capabilities of
nearly every service and product defining the future of computing
today,” said Dr. Lisa Su, AMD chair and CEO. “The close of our
transformational acquisition of Xilinx and our expanded portfolio
of leadership compute engines provide AMD with significant
opportunities to deliver continued strong revenue growth with
compelling shareholder returns as we capture a larger share of the
diverse $300 billion market for our high-performance and adaptive
products.”
Technology and Product Portfolio UpdatesAMD
announced expanded multi-generational CPU core, graphics, and
adaptive computing architecture roadmaps including new details on
the:
- “Zen 4” CPU core expected to power the world’s first
high-performance 5nm x86 CPUs later this year. “Zen 4” is expected
to increase IPC 8%-10%1 and deliver more than a 25% increase in
performance-per-watt2 and 35% overall performance increase compared
to “Zen 3” when running desktop applications3.
- “Zen 5” CPU core planned for 2024, which is built from the
ground up to deliver performance and efficiency leadership across a
broad range of workloads and features and includes optimizations
for AI and machine learning.
- AMD RDNA™ 3 gaming architecture that combines a chiplet design,
next generation AMD Infinity Cache™ technology, leading-edge 5nm
manufacturing technology, and other enhancements to deliver more
than 50% greater performance-per-watt compared to the prior
generation4.
- 4th Gen Infinity Architecture that further extends AMD’s
leadership modular SoC design approach with a high-speed
interconnect, allowing seamless integration of both AMD IP and 3rd
party chiplets to enable an entirely new class of high-performance
and adaptive processors and providing a custom-ready heterogenous
computing platform.
- AMD CDNA™ 3 architecture, which combines 5nm chiplets, 3D die
stacking, 4th generation Infinity Architecture, next-generation AMD
Infinity Cache™ technology, and HBM memory in a single package with
a unified memory programming model. The first AMD CDNA 3
architecture-based products are planned for 2023 and are expected
to deliver more than 5X greater performance-per-watt compared to
AMD CDNA 2 architecture on AI training workloads5.
- AMD XDNA, the foundational architecture IP from Xilinx that
consists of key technologies including the FPGA fabric and AI
Engine (AIE). The FPGA fabric combines an adaptive interconnect
with FPGA logic and local memory, while the AIE provides a dataflow
architecture optimized for high performance and energy efficient AI
and signal processing applications. AMD plans to integrate AMD XDNA
IP across multiple products in the future, starting with AMD Ryzen™
processors planned for 2023.
Expanded Data Center Solutions PortfolioAMD revealed an expanded
portfolio of high-performance, next-generation CPUs, accelerators,
data processing units (DPUs), and adaptive computing products
optimized for multiple workloads, including:
- 4th Gen AMD EPYC™ processors powered by “Zen 4” and “Zen 4c”
cores.
- “Genoa” powered by “Zen 4”: On-track to launch in Q4 2022 as
the highest performance general purpose server processor available,
with the top-of-stack product delivering greater than 75% faster
enterprise Java® performance compared to top-of-stack 3rd Gen EPYC
processors6.
- “Bergamo” powered by “Zen 4c”: Expected to be the highest
performance server processors for cloud native computing, offering
more than double the container density of 3rd Gen EPYC processors
at their launch planned for the first half of 20237.
- “Genoa-X” powered by “Zen 4”: An optimized version of 4th Gen
EPYC processors with AMD 3D V-Cache™ technology to enable
leadership performance in relational database and technical
computing workloads8.
- "Siena” powered by “Zen 4”: The first AMD EPYC processor
optimized for intelligent edge and communications deployments that
require higher compute densities in a cost and power optimized
platform.
- AMD Instinct™ MI300 accelerators, the world’s first data center
APUs, expected to deliver a greater than 8x increase in AI training
performance compared to the AMD Instinct MI200 accelerator9. MI300
accelerators leverage a groundbreaking 3D chiplet design combining
AMD CDNA 3 GPU, “Zen 4” CPU, cache memory, and HBM chiplets that
are designed to provide leadership memory bandwidth and application
latency for AI training and HPC workloads.
- AMD Pensando DPUs that combine a robust software stack with
“zero trust security” throughout and an industry-leading packet
processor to create the world’s most intelligent and performant
DPU, which is already deployed at scale across cloud and enterprise
customers.
- Alveo™ SmartNICs deployed by hyperscale customers to accelerate
custom workloads and extend confidential computing to the
networking interface.
Accelerating Leadership in Pervasive AI AMD is uniquely
positioned with its broad product portfolio and experience serving
diverse embedded markets to help customers develop and deploy
applications with multiple forms of AI.
The transformative acquisition of Xilinx provides AMD with an
unmatched set of hardware and software capabilities, integrating
the leadership Xilinx AI Engine (AIE) across AMD Ryzen, AMD EPYC
and Xilinx Versal™ products for small and mid-size AI models to
complement next-generation AMD Instinct accelerators and adaptive
SoCs, enabling leadership performance on scale-out training and
inference workloads.
To unify AI programming tools, AMD also announced a
multi-generation Unified AI Software roadmap that will allow AI
developers to program across its CPU, GPU, and Adaptive SoC product
portfolio from machine learning (ML) frameworks with the same set
of tools and pre-optimized models.
Expanding PC LeadershipAMD showcased its leadership in the
global PC market, detailing how it continues to deepen OEM
partnerships and drive continued growth across premium, gaming, and
commercial markets, and provided a preview of its client roadmap
over the next several years, including:
- The “Phoenix Point” mobile processor planned for 2023 will
bring together the AMD “Zen 4” core architecture with AMD RDNA 3
graphics architecture and AIE, followed by the “Strix Point”
processor planned for 2024. “Phoenix Point” innovations include the
AIE inference accelerator, image signal processor, advanced display
for refresh and response, AMD chiplet architecture, and extreme
power management.
- The “Zen 4”-based Ryzen 7000 Series desktop processors, which
are expected to deliver faster clock speeds and greater single and
multi-threaded performance compared to Ryzen 6000 processors10,
will be followed by “Zen 5”-based “Granite Ridge” processors.
Driving Graphics Momentum AMD announced the latest developments
designed to continue bringing world-class graphics solutions to
customers worldwide, including:
- “Navi 3x” products are expected to launch later this year,
built on the next-generation AMD RDNA 3 gaming architecture.
- More than 50 new gaming PC platforms are expected to launch in
2022, elevating gaming to new levels of performance and visual
fidelity by combining AMD Radeon™ RX Series graphics with AMD Ryzen
processors.
- AMD expanded its leadership position in the gaming console
space with the addition of Valve’s Steam Deck™ gaming handheld,
powered by AMD “Zen 2” architecture- based processors and AMD RDNA
2 architecture-based graphics.
- New growth opportunities in 2022 and beyond, including
providing a range of graphics technologies to accelerate
next-generation metaverse applications, ranging from 3D content
creation beyond games and movies, to cloud gaming and interactivity
within metaverse environments.
New Financial Reporting SegmentsStarting with
second quarter 2022 results, AMD is updating its financial
reporting segments to align with its strategic end markets:
- Data Center: Including server CPUs, data center GPUs, and the
portions of Xilinx revenue related to the data center business
- Embedded: Including the Xilinx embedded business plus the AMD
embedded business
- Client: Including the traditional desktop and notebook PC
business
- Gaming: Including the discrete graphics gaming business and the
semi-custom game console business.
Together We Advance To complement the evolution
of its strategic end markets and leadership product portfolio, AMD
also showcased a new evolution of its brand. The new brand
platform, “together we advance_” demonstrates how, together with
its partners, customers, and employees, AMD is advancing innovation
to create solutions to the world’s toughest challenges. The new
brand campaign is the largest in AMD history and sees the AMD arrow
mark becoming more prominent in all communications assets,
illustrating how pervasive AMD technology is by powering large,
diverse, and growing markets.
Supporting Resources
- Watch the event replay
- Access event presentations
- Read more about AMD brand updates
- Follow AMD on Twitter
About AMDFor more than 50 years AMD has driven
innovation in high-performance computing, graphics, and
visualization technologies. AMD employees are focused on building
leadership high-performance and adaptive products that push the
boundaries of what is possible. Billions of people, leading Fortune
500 businesses, and cutting-edge scientific research institutions
around the world rely on AMD technology daily to improve how they
live, work, and play. For more information about how AMD is
enabling today and inspiring tomorrow, visit the AMD (NASDAQ: AMD)
website, blog, LinkedIn, and Twitter pages.
Cautionary Statement This press release
contains forward-looking statements concerning Advanced Micro
Devices, Inc. (AMD) such as the features, functionality,
performance, availability, timing and expected benefits of AMD
products; AMD’s next phase of growth; AMD’s significant opportunity
to deliver strong growth and shareholder returns over the next five
years; expected benefits of AMD’s acquisition of Pensando Systems;
and AMD’s new growth opportunities in 2022 and beyond, which are
made pursuant to the Safe Harbor provisions of the Private
Securities Litigation Reform Act of 1995. Forward-looking
statements are commonly identified by words such as "would," "may,"
"expects," "believes," "plans," "intends," "projects" and other
terms with similar meaning. Investors are cautioned that the
forward-looking statements in this press release are based on
current beliefs, assumptions and expectations, speak only as of the
date of this press release and involve risks and uncertainties that
could cause actual results to differ materially from current
expectations. Such statements are subject to certain known and
unknown risks and uncertainties, many of which are difficult to
predict and generally beyond AMD's control, that could cause actual
results and other future events to differ materially from those
expressed in, or implied or projected by, the forward-looking
information and statements. Material factors that could cause
actual results to differ materially from current expectations
include, without limitation, the following: Intel Corporation’s
dominance of the microprocessor market and its aggressive business
practices; global economic uncertainty; loss of a significant
customer; impact of the COVID-19 pandemic on AMD’s business,
financial condition and results of operations; competitive markets
in which AMD’s products are sold; market conditions of the
industries in which AMD products are sold; cyclical nature of the
semiconductor industry; quarterly and seasonal sales patterns;
AMD's ability to adequately protect its technology or other
intellectual property; unfavorable currency exchange rate
fluctuations; ability of third party manufacturers to manufacture
AMD's products on a timely basis in sufficient quantities and using
competitive technologies; availability of essential equipment,
materials, substrates or manufacturing processes; ability to
achieve expected manufacturing yields for AMD’s products; AMD's
ability to introduce products on a timely basis with expected
features and performance levels; AMD's ability to generate revenue
from its semi-custom SoC products; potential security
vulnerabilities; potential security incidents including IT outages,
data loss, data breaches and cyber-attacks; uncertainties involving
the ordering and shipment of AMD’s products; AMD’s reliance on
third-party intellectual property to design and introduce new
products in a timely manner; AMD's reliance on third-party
companies for design, manufacture and supply of motherboards,
software and other computer platform components; AMD's reliance on
Microsoft and other software vendors' support to design and develop
software to run on AMD’s products; AMD’s reliance on third-party
distributors and add-in-board partners; impact of modification or
interruption of AMD’s internal business processes and information
systems; compatibility of AMD’s products with some or all
industry-standard software and hardware; costs related to defective
products; efficiency of AMD's supply chain; AMD's ability to rely
on third party supply-chain logistics functions; AMD’s ability to
effectively control sales of its products on the gray market;
impact of government actions and regulations such as export
administration regulations, tariffs and trade protection measures;
AMD’s ability to realize its deferred tax assets; potential tax
liabilities; current and future claims and litigation; impact of
environmental laws, conflict minerals-related provisions and other
laws or regulations; impact of acquisitions, joint ventures and/or
investments on AMD's business, and ability to integrate acquired
businesses, such as Xilinx; impact of any impairment of the
combined company’s assets on the combined company’s financial
position and results of operation; restrictions imposed by
agreements governing AMD’s notes, the guarantees of Xilinx’s notes
and the revolving credit facility; AMD's indebtedness; AMD's
ability to generate sufficient cash to meet its working capital
requirements or generate sufficient revenue and operating cash flow
to make all of its planned R&D or strategic investments;
political, legal, economic risks and natural disasters; future
impairments of goodwill and technology license purchases; AMD’s
ability to attract and retain qualified personnel; AMD’s stock
price volatility; and worldwide political conditions. Investors are
urged to review in detail the risks and uncertainties in AMD’s
Securities and Exchange Commission filings, including but not
limited to AMD’s most recent reports on Forms 10-K and 10-Q.
©2022 Advanced Micro Devices, Inc. All rights reserved.
AMD, the AMD Arrow logo, AMD CDNA, EPYC, Infinity Cache, Radeon,
RDNA, Ryzen and combinations thereof, are trademarks of Advanced
Micro Devices, Inc. Other names are for informational purposes only
and may be trademarks of their respective owners.
1 Z4-001: IPC uplift based on the average of estimated/published
2017 SPECint® and 2017 SPECfp® scores and internal
estimates/testing on Cinebench R23 1T and Geekbench 5 1T.for “Zen4”
and “Zen 3” processors2 Z4-003: Testing as of May 31, 2022, by AMD
Performance Labs. Power measured at CPU socket only (Watts), CPU
performance (“points”) measured with Cinebench R23 nT. AMD Ryzen 9
5950X System: AMD Reference X570 Motherboard, 2x8 DDR4-3200. AMD
Ryzen 7000 Series: AMD Reference X670 Motherboard, Ryzen 7000
Series 16-core pre-production processor sample, 2x16GB DDR5-5200.
All systems configured with Radeon™ RX 6950XT GPU (driver: 22.10
Prime), Windows 11 Build 22000.593, Samsung 980 Pro 1TB SSD, Asetek
280MM liquid cooler. Results may vary when final products are
released in market.3 Z4-004: Testing as of May 5, 2022, by AMD
Performance Labs. Single-thread performance evaluated with
Cinebench R23 1T. AMD Ryzen 9 5950X System: ASUS ROG Crosshair VIII
Hero X570, 2x8 DDR4-3600C16. AMD Ryzen 7000 Series: AMD Reference
X670 Motherboard, Ryzen 7000 Series 16-core pre-production
processor sample, 2x16GB DDR5-6000CL30. All systems configured with
Radeon™ RX 6950XT GPU (driver: 22.10 Prime), Windows 11 Build
22000.593, Samsung 980 Pro 1TB SSD, Asetek 280MM liquid cooler.
Results may vary when final products are released in market.4 Based
on preliminary internal engineering estimates. Actual results
subject to change5 MI300-004: Measurements by AMD Performance Labs
June 4, 2022. MI250X (560W) FP16 (306.4 estimated delivered TFLOPS
based on 80% of peak theoretical floating-point performance). MI300
FP8 performance based on preliminary estimates and expectations.
MI300 TDP power based on preliminary projections. Final performance
may vary6 SP5-005: Server-side Java multiJVM workload demo
comparison based on AMD measured testing as of 6/2/2022.
Configurations: 2x 96-core AMD 4th Gen EPYC (pre-production
silicon) on a reference system versus 2x 64-core EPYC 7763 on a
reference system. Java version JDK18.To fit in demo time permitted,
the full server-side Java run that typically takes about 20 minutes
was reduced to a short-preset time where both systems were running
at 99% CPU utilization, eliminating the “warm up” period data. OEM
published scores will vary based on system configuration and use of
production silicon.7 SP5-006: 128-core 4th Gen EPYC CPUs compared
to a 64-core 3rd Gen EPYC 7763 for 2x the container density8
“Technical Computing” or “Technical Computing Workloads” as defined
by AMD can include: electronic design automation, computational
fluid dynamics, finite element analysis, seismic tomography,
weather forecasting, quantum mechanics, climate research, molecular
modeling, or similar workloads. GD-2049 MI300-03 - Measurements by
AMD Performance Labs June 4, 2022 on current specification and/or
estimation for delivered FP8 floating point performance with
structure sparsity supported for AMD Instinct™ MI300 vs. MI250X
FP16 (306.4 estimated delivered TFLOPS based on 80% of peak
theoretical floating-point performance). MI300 performance based on
preliminary estimates and expectations. Final performance may vary.
MI300-0310 Z4-005: Testing as of May 5, 2022, by AMD Performance
Labs. Single-thread performance evaluated with Cinebench R23 1T.
AMD Ryzen 9 5950X System: ASUS ROG Crosshair VIII Hero X570, 2x8
DDR4-3600C16. AMD Ryzen 7000 Series: AMD Reference X670
Motherboard, Ryzen 7000 Series 16-core pre-production processor
sample, 2x16GB DDR5-6000CL30. All systems configured with Radeon™
RX 6950XT GPU (driver: 22.10 Prime), Windows 11 Build 22000.593,
Samsung 980 Pro 1TB SSD, Asetek 280MM liquid cooler.Testing as of
May 31, 2022 by AMD performance labs. Multi-thread performance
evaluated with Cinebench R23 1T. AMD Ryzen 9 5950X System: AMD
Reference X570 Motherboard, 2x8 DDR4-3200. AMD Ryzen 7000 Series:
AMD Reference X670 Motherboard, Ryzen 7000 Series 16-core
pre-production processor sample, 2x16GB DDR5-5200. All systems
configured with Radeon™ RX 6950XT GPU (driver: 22.10 Prime),
Windows 11 Build 22000.593, Samsung 980 Pro 1TB SSD, Asetek 280MM
liquid cooler Results may vary when final products are released in
market.
Contact:Drew
Prairie AMD Communications(512)
602-4425Drew.prairie@amd.com
Laura GravesAMD Investor
Relations(408) 306-9157Laura.graves@amd.com
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