Alliance Memory Expands eMMC Offering With New 5GB and 10GB 3D pSLC Solutions
July 10 2024 - 11:00AM
Alliance Memory today introduced new industrial-grade 3D pSLC
embedded multi-media card (eMMC) solutions for solid-state storage
in consumer, industrial, and networking applications. Offering
30,000 program/erase cycles, the 5GB ASFC5G31P3-51BIN and 10GB
ASFC10G31P3-51BIN integrate high-reliability 3D pSLC NAND flash
memory with an eMMC controller and flash transition layer (FTL)
management software in a single 11.5 mm by 13 mm by 1 mm 153-ball
FBGA package.
The devices released today are compliant with the JEDEC eMMC
v5.1 industry standard, supporting features such as boot operation,
replay protected memory block (RPMB), device health report, field
firmware updates, power-off notification, enhanced strobe features
for faster and more reliable operation, write leveling,
high-priority interrupt (HPI), secure trim/erase, and high-speed
HS200 and HS400 modes. The ASFC5G31P3-51BIN and ASFC10G31P3-51BIN
are also backwards-compatible with eMMC v4.5 and v5.0.
Featuring a 32MB boot partition, the eMMCs will be used in
products such as smart watches, tablets, digital TVs, set-top
boxes, VR and AR headsets, digital cameras, CCTV, infotainment,
surveillance, automation, point-of-sale systems, and emerging
embedded applications. For designers, the ASFC5G31P3-51BIN and
ASFC10G31P3-51BIN simplify designs for fast and easy system
integration in these products, speeding up product development and
time to market while saving space by eliminating the need for an
external controller. In addition, the device’s FTL software
provides high reliability and stable performance with wear
levelling and bad block management.
“With the introduction of these new enhanced-mode 3D pSLC parts,
we’ve further solidified our position as a leading provider of eMMC
technology,” said David Bagby, president and CEO, Alliance Memory.
“For our customers, these lower-density devices offer higher
reliability and endurance than MLC and TLC NAND solutions while
delivering the same ease of integration and space savings.”
The ASFC5G31P3-51BIN and ASFC10G31P3-51BIN operate over an
industrial temperature range of -40°C to +85°C and offer
programmable bus widths of x1, x4, and x8. The devices’ NAND memory
with internal LDO can be powered with a single 3V supply voltage,
while the controller can be powered by 1.8V or 3V dual supply
voltages.
Samples of the eMMCs are available now. Production quantities
are available with lead times of eight weeks.
About Alliance Memory Inc.Alliance Memory is a
worldwide provider of critical and hard-to-find memory ICs for the
communications, computing, consumer electronics, medical,
automotive, and industrial markets. The company’s product range
includes flash, DRAM, and SRAM memory ICs with commercial,
industrial, and automotive operating temperature ranges and
densities from 64Kb to 128GB. Privately held, Alliance Memory
maintains headquarters in Kirkland, Washington, and regional
offices in Europe, Asia, Canada, and South America. More
information about Alliance Memory is available online at
www.alliancememory.com.
Editor resources:
Link to product image:
https://www.flickr.com/photos/alliancememory/albums/72177720318599476
Links to detailed product info:
https://www.alliancememory.com/emmc-storage/
Agency Contact:Bob DeckerRedpines+1 415 409
0233bob.decker@redpinesgroup.com