PITTSBURGH, May 13, 2019 /PRNewswire/ -- Customers of
Samsung Foundry and ANSYS (NASDAQ: ANSS) are enabled to
meet low power and high performance demands of next-generation 5G,
artificial intelligence (AI), high performance computing (HPC) and
automotive applications thanks to Samsung Foundry's latest
certification of ANSYS' multiphysics solutions for 5nm low power
early (5LPE) process technology.
At smaller FinFET geometries, engineers face increased
multiphysics challenges due to the complex interdependency of
power, thermal and reliability effects. These challenges impact
design convergence, affect project schedules and impede
performance. Mutual customers can overcome these challenges and
speed innovation by leveraging ANSYS multiphysics solutions for
5LPE process technology that enables greater area scaling and
ultra-low power benefits, when compared to its 7nm
predecessor.
Samsung certified the ANSYS® RedHawk™ family and
ANSYS® Totem™ multiphysics solutions for its latest 5LPE
process technology. The certification includes extraction, power
integrity and reliability, signal and power grid electromigration
(EM). To support multiphysics needs in advanced nodes, the
certification also includes thermal analysis and signoff with
self-heat and statistical EM budgeting (SEB).
"This certification empowers mutual customers to achieve
stringent power, performance area and reliability requirements for
5G, AI, HPC and automotive applications," said Jung Yun Choi, vice president of Design
Technology Team at Samsung Electronics. "Using ANSYS solutions, our
customers can overcome complex multiphysics challenges in advanced
FinFET designs to enable silicon success."
"With narrowing design margins in sub 7nm process nodes, guard
banding becomes difficult without accurately modeling the physical,
electrical and thermal effects that are prone to cause silicon
failure," said Vic Kulkarni, vice
president, strategy at ANSYS. "As a leader in multiphysics
simulations, we empower mutual customers to leverage best-in-class
solutions to conquer the toughest power, thermal and reliability
challenges to promote silicon success."
The following ANSYS products are certified for 5LPE:
- ANSYS RedHawk: The industry's go-to power integrity and
reliability signoff solution for systems-on-chips (SoCs). With a
track record of thousands of designs in silicon, ANSYS RedHawk
enables users to create high-performance SoCs that are still power
efficient and reliable against thermal, EM and electrostatic
discharge (ESD) issues for mobile, communications, high-performance
computing, automotive and IoT applications.
- ANSYS® RedHawk-SC™: The
next-generation SoC power integrity and reliability signoff
platform designed to enable sub-7nm design success. RedHawk-SC is
built on ANSYS® SeaScape™, the world's first custom designed big
data architecture for electronic system design and simulation.
ANSYS SeaScape provides per-core scalability, flexible design data
access, instantaneous design bringup, MapReduce-enabled analytics
and many other revolutionary capabilities. ANSYS RedHawk, the
industry's gold standard platform for SoC power noise and
reliability signoff is offered on the SeaScape platform as
RedHawk-SC, offering the best of both worlds — the signoff
confidence provided by RedHawk and the elastic scalability and big
data analytics of ANSYS SeaScape.
- ANSYS Totem: ANSYS Totem is a silicon proven
layout-based analog, mixed-signal and custom circuit simulation
platform for power integrity and reliability signoff. Power
integrity checks include static and dynamic voltage drop analysis
and the capability to account for substrate parasitic effects.
Reliability checks include power and signal interconnect EM, ESD
and thermal analysis covering self-heat, thermal-aware EM and SEB
analysis. Additionally, Totem can generate a comprehensive chip
macro model (CMM) of an IP for hierarchical modeling and simulation
and for enabling easy integration and accurate analysis at the SoC
level. Totem platform provides support for various design styles,
including SRAMS/FLASH/DRAM, IOs and analog mixed signal
designs.
About ANSYS, Inc.
If you've ever seen a rocket launch, flown on an airplane,
driven a car, used a computer, touched a mobile device, crossed a
bridge or put on wearable technology, chances are you've used a
product where ANSYS software played a critical role in its
creation. ANSYS is the global leader in engineering
simulation. Through our strategy of Pervasive Engineering
Simulation, we help the world's most innovative companies deliver
radically better products to their customers. By offering the best
and broadest portfolio of engineering simulation software, we help
them solve the most complex design challenges and create products
limited only by imagination. Founded in 1970, ANSYS is
headquartered south of Pittsburgh,
Pennsylvania, U.S.A., Visit www.ansys.com for more
information.
ANSYS and any and all ANSYS, Inc. brand, product, service and
feature names, logos and slogans are registered trademarks or
trademarks of ANSYS, Inc. or its subsidiaries in the United States or other countries
ANSS - C
Contact
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Media
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Mary Kate
Joyce
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724.820.4368
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marykate.joyce@ansys.com
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Investors
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Annette N. Arribas,
IRC
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724.820.3700
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annette.arribas@ansys.com
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SOURCE ANSYS, Inc.