Aehr Test Systems Introduces new FOX-XP™ System with Singulated Die/Module Test Configuration at Burn-in and Test Strategie...
March 06 2017 - 7:30AM
Aehr Test Systems (NASDAQ:AEHR)
,
a worldwide supplier of semiconductor test and burn-in equipment,
today announced that it is introducing a new configuration of its
FOX-XP™ Test and Burn-in system that includes its new highly
parallel singulated die/module test interface technology at the
18th annual Burn-in and Test Strategies (BiTS) Workshop taking
place March 5-8, 2017 in Mesa, Arizona (Booth A28).
In addition, Aehr Test FOX Product Director Carl Kasinski will
be presenting a technical paper at the conference on optical device
burn-in testing at both the wafer and packaged part levels.
Aehr Test’s introduction of the FOX system for module burn-in
follows the company’s announcement on February 21, 2017 that it
received its first order for a complete FOX-XP production test cell
for this new configuration. The order was in excess of $4.0 million
and included a FOX-XP Test and Burn-in System, proprietary DiePak®
carriers to interface electrically and thermally to the customer’s
modules in burn-in/test, and a DiePak Autoloader for loading the
modules into the DiePak carriers.
“We are excited to introduce our new FOX-XP system for module
test and burn-in and to showcase all our solutions for burn-in and
testing at BiTS, which also include our FOX family of wafer-level
systems and our ABTS™ family of packaged part burn-in and test
systems,” said Gayn Erickson, President and CEO of Aehr Test
Systems. “The new FOX-XP configuration for testing modules builds
on all the learning and IP that Aehr Test has developed over almost
40 years in burn-in, parallel test, interfacing to packaged parts,
and probing bare die and full wafers in a highly-parallel
environment.”
The new FOX-XP system configuration is capable of testing and
burning-in devices in singulated die or module level and adds to
the full wafer test capabilities of this platform. This high power
configuration is available with up to nine individual Blades that
can each test up to 1,024 devices using Aehr Test's proprietary
DiePak Carriers. Each DiePak Carrier can handle device power loads
of up to 2,000 Watts of power, which provides a higher level of
parallelism and power management for these types of devices than is
available from any other supplier in the market. The production
DiePak and WaferPak Carriers utilize proprietary technology for
contacting devices in wafer form, singulated die, ultra-compact
modules, or system level / module forms and can be designed to test
thousands of devices with pad pitches as low as 200 microns
apart.
Erickson continued, “As we have noted before, we believe the
sensor and photonics markets will be a significant opportunity for
Aehr Test, with a key market driver being the rapidly growing use
of integrated optical devices in sensors, Advanced Driver
Assistance Systems (ADAS) and entertainment in the automotive
market, which has substantially higher requirements for initial
quality and long-term reliability. Other key growing markets for
integrated optical devices are mobile devices, high-performance
servers and data centers, where the use of optical devices for
sensing and communications is increasing with every new product
generation. We believe that these are applications that are
going to drive an entirely new level of quality and reliability
expectation of hardware systems and pose a very interesting
long-term opportunity for Aehr Test.”
BiTS is the preeminent event for what’s Now & Next in the
test of packaged integrated circuits (ICs). The technical program
and exhibition is dedicated to providing a forum for the latest
information on a broad range of test topics including final,
wafer sort, and burn-in, and includes opportunities to meet,
network, and explore ideas with other test professionals who are
focused on test consumables, test cell integration, and test
operations. Additional details on the conference can be found on
the BiTS website, https://bitsworkshop.org.
In concert with the theme of the conference, Aehr Test is
showcasing its solutions for burn-in and test systems to enhance
the reliability of devices produced by semiconductor manufacturers.
These solutions include:
- The ABTSTM family of packaged part burn-in and test systems,
which is based on a new hardware and software platform that is
designed to address not only today’s devices, but also future
devices for many years to come. This system can test and burn-in
high pin-count devices and there are also configurations for both
high-power and low-power applications.
- The FOX family of products, which includes multi-wafer test
solutions that are capable of functional test and burn-in/cycling
of flash memories, microcontrollers and other leading edge ICs in
wafer form before they are assembled into multi-die stacked
packages. The FOX systems utilize Aehr Test's FOX WaferPak
contactor, which provides a cost effective solution for making
electrical contact with a full wafer or substrate in a multi-wafer
environment.
- The FOX-1P system, Aehr Test’s second generation of the
single-wafer FOX-1 platform originally introduced in 2006, which
has proven to be a cost saving high-volume production solution for
single touchdown 300mm full-wafer parallel test. The new FOX-1P
system can be configured with over 16,000 “Universal Channels” and
features a massively parallel test interface, which enables testing
over a thousand die in a single touchdown.
- The FOX-XP system, the company’s next-generation multi-wafer
and now singulated die/module test solution that is capable of
functional test and burn-in/cycling of flash memories,
microcontrollers, sensors, and other leading-edge ICs in wafer form
before they are assembled into single or multi-die stacked
packages. The new configuration with the DiePak Carriers also
enables burn-in of singulated die and multi-die modules to screen
for defects in both the die and the module assembly process. These
singulated known-good die or single-die or stacked-die packaged
parts can then be used for high reliability and quality
applications such as enterprise solid state drives, automotive
devices, highly valuable mobile applications, and mission critical
integrated circuits and sensors.
About Aehr Test
SystemsHeadquartered in Fremont, California, Aehr Test
Systems is a worldwide provider of test systems for burning-in and
testing logic, optical and memory integrated circuits and has an
installed base of more than 2,500 systems worldwide. Increased
quality and reliability needs of the Automotive and Mobility
integrated circuit markets are driving additional test
requirements, capacity needs and opportunities for Aehr Test
products in package and wafer level test. Aehr Test has
developed and introduced several innovative products, including the
ABTS and FOXTM families of test and burn-in systems and the DiePak®
carrier. The ABTS system is used in production and qualification
testing of packaged parts for both low-power and high-power logic
as well as all common types of memory devices. The FOX system is a
full wafer contact test and burn-in system used for burn-in and
functional test of complex devices, such as leading-edge memories,
digital signal processors, microprocessors, microcontrollers,
systems-on-a-chip and integrated optical devices. The DiePak
carrier is a reusable, temporary package that enables IC
manufacturers to perform cost-effective final test and burn-in of
bare die. For more information, please visit the Company’s website
at www.aehr.com.
Contacts:
Aehr Test Systems
Carl Buck
V.P. of Marketing
(510) 623-9400 x381
cbuck@aehr.com
MKR Group Inc.
Todd Kehrli or Jim Byers
Analyst/Investor Contact
(323) 468-2300
aehr@mkr-group.com
Aehr Test Systems (NASDAQ:AEHR)
Historical Stock Chart
From Mar 2024 to Apr 2024
Aehr Test Systems (NASDAQ:AEHR)
Historical Stock Chart
From Apr 2023 to Apr 2024