Aehr Test Systems to Participate in the 20th Annual Craig-Hallum Institutional Investor Conference on May 31
May 24 2023 - 4:05PM
Aehr Test Systems (
NASDAQ: AEHR),
a worldwide supplier of semiconductor test and production
burn-in equipment, today announced that it will be
participating in the 20th Annual Craig-Hallum Institutional
Investor Conference taking place on Wednesday, May 31, 2023 at the
Depot Renaissance Hotel in Minneapolis. Aehr Test President and CEO
Gayn Erickson will be hosting meetings with investors throughout
the day.
“I look forward to discussing our semiconductor wafer level and
singulated die test and burn-in solutions and the markets they
serve with investors,” said Mr. Erickson. “We continue to be
excited about the silicon carbide market for electric vehicles and
electrification of the worldwide infrastructure, as well as gallium
nitride that is used in both consumer applications and for
photovoltaic and automotive applications. Aehr Test provides
complete production solutions for improving yield and reliability
of semiconductors, and devices such as silicon carbide
semiconductors used in electric and hybrid electric vehicles,
silicon photonics devices used in data centers and 5G
infrastructure, and 2D/3D and other sensors used in mobile and
wearable applications, which are expected to be significant revenue
drivers for our products this fiscal year and next.”
For additional information, or to schedule a meeting with Mr.
Erickson, please contact your Craig-Hallum representative, or
Aehr’s investor relations firm, MKR Investor Relations, at
aehr@mkr-group.com.
About Aehr Test SystemsHeadquartered in
Fremont, California, Aehr Test Systems is a worldwide provider of
test systems for burning-in semiconductor devices in wafer level,
singulated die, and package part form, and has installed over 2,500
systems worldwide. Increased quality and reliability needs of the
Automotive and Mobility integrated circuit markets are driving
additional test requirements, incremental capacity needs, and new
opportunities for Aehr Test products in package, wafer level, and
singulated die/module level test. Aehr Test has developed and
introduced several innovative products, including the
ABTS™ and FOX-P™ families of test and burn-in systems and
FOX WaferPak™ Aligner, FOX WaferPak Contactor, FOX DiePak®
Carrier and FOX DiePak Loader. The ABTS system is used in
production and qualification testing of packaged parts for both
lower power and higher power logic devices as well as all common
types of memory devices. The FOX-XP and FOX-NP systems are full
wafer contact and singulated die/module test and burn-in systems
used for burn-in and functional test of complex devices, such as
leading-edge silicon carbide-based power semiconductors, memories,
digital signal processors, microprocessors, microcontrollers,
systems-on-a-chip, and integrated optical devices. The FOX-CP
system is a new low-cost single-wafer compact test and reliability
verification solution for logic, memory and photonic devices and
the newest addition to the FOX-P product family. The WaferPak
Contactor contains a unique full wafer probe card capable of
testing wafers up to 300mm that enables IC manufacturers to perform
test and burn-in of full wafers on Aehr Test FOX systems. The
DiePak Carrier is a reusable, temporary package that enables IC
manufacturers to perform cost-effective final test and burn-in of
both bare die and modules. For more information, please visit Aehr
Test Systems’ website at www.aehr.com.
Contacts:
Aehr
Test Systems |
MKR
Investor Relations Inc. |
Ken Spink |
Todd Kehrli or Jim Byers |
Chief Financial Officer |
Analyst/Investor Contact |
(510) 623-9400 x309 |
(323) 468-2300 |
|
aehr@mkr-group.com |
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