SAN JOSE, Calif., April 19, 2021 /CNW/ -- (TSXV:SEV) Spectra7
Microsystems Inc. ("Spectra7" or the "Company"), a
leading provider of high-performance analog semiconductor products
for broadband connectivity markets, and Wandtec, an innovative
technology leading interconnect supplier, today announced they are
collaborating on Spectra7 enabled 100G DSFP, 200G QSFP56 and 400G
QSFP-DD Active Copper Cable (ACC) interconnects targeted at major
datacenter operators and high-performance computing OEMs.
"Spectra7 has created a compelling solution to address the
dramatically increasing power and cost of data center
interconnects," said Xin Wu, CEO at
Wandtec. "We are seeing significant interest from our customers for
ACCs with Spectra7 technology and are pleased to be partnered to
deliver unprecedented solutions for low power, low latency and
extended reach. In combination with our innovative WDTCDR™ Twinax
cable and patent pending crosstalk noise mitigation technology, we
are able to extend 56G PAM4 based copper interconnects to lengths
of 10m while being compliant to the
IEEE 802.3cd standard."
The initial collaboration is for 100Gbps DSFP interconnects.
Major China operators including
Alibaba, Baidu and Tencent are
choosing this standard for higher speed and higher density switch
and server connections. The DSFP standard using 56G PAM4 signaling
enables a 4x increase in bandwidth over currently deployed SFP28
interconnects but the higher data rate limits the interconnect
length that can be served by low-cost direct-attach copper (DAC)
passive cables. Spectra7's GaugeChanger™ silicon enables ACC cables
up to three times the reach of passive DSFP copper cables.
"Wandtec is an up-and-coming innovative technology leader in
data center interconnects," said Spectra7 CEO Raouf Halim. "Partnering with them is
significant and will accelerate adoption of our technology in this
rapidly growing market."
About Wandtec
Wandtec is a spin-off of 30+ years old wire-harness manufacturer
dedicated for high-speed copper, hybrid copper and optical, and
high-speed interconnect module technology innovation and
manufacturing services. Our innovation in software-defined
engineering & manufacturing enables the finest processing
techniques of copper cable interconnects at um scale, which
minimizes the discontinuity where the three-dimensional transitions
of the combination of PCB, Twinax (Micro-coax), Connectors,
Optical-engine, and/or fiber playing critical roles in the
performance. In-line simulation and modeling, 100% testing and
data-tracking, artificial intelligence, and automation set our
foundation of product performance and reliability excellence.
With the operations in both USA
and China, Wandtec's 123210 operation principle shortens customers'
time-to-market 30%~50%.
For more information, please visit https://www.wandtec.com/.
ABOUT SPECTRA7 MICROSYSTEMS INC.
Spectra7 Microsystems Inc. is a high-performance analog
semiconductor company delivering unprecedented bandwidth, speed and
resolution to enable disruptive industrial design for leading
electronics manufacturers in virtual reality, augmented reality,
mixed reality, data centers and other connectivity markets.
Spectra7 is based in San Jose,
California with a design center in Cork, Ireland and technical support location
in Dongguan, China. For more
information, please visit www.spectra7.com.
Neither the TSX Venture Exchange nor its regulation services
provided (as that term is defined in the policies of the TSX
Venture Exchange) accepts responsibility for the adequacy or
accuracy of this release.
CAUTIONARY NOTES
Certain statements contained in this press release constitute
"forward-looking statements". All statements other than statements
of historical fact contained in this press release, including,
without limitation, those regarding the Company's strategy, plans,
objectives, goals and targets, and any statements preceded by,
followed by or that include the words "believe", "expect", "aim",
"intend", "plan", "continue", "will", "may", "would", "anticipate",
"estimate", "forecast", "predict", "project", "seek", "should" or
similar expressions or the negative thereof, are forward-looking
statements. These statements are not historical facts but instead
represent only the Company's expectations, estimates and
projections regarding future events. These statements are not
guarantees of future performance and involve assumptions, risks and
uncertainties that are difficult to predict. Therefore, actual
results may differ materially from what is expressed, implied or
forecasted in such forward-looking statements. Additional factors
that could cause actual results, performance or achievements to
differ materially include, but are not limited to the risk factors
discussed in the Company's Annual Information Form for the year
ended December 31, 2019. Management
provides forward-looking statements because it believes they
provide useful information to investors when considering their
investment objectives and cautions investors not to place undue
reliance on forward-looking information. Consequently, all of the
forward-looking statements made in this press release are qualified
by these cautionary statements and other cautionary statements or
factors contained herein, and there can be no assurance that the
actual results or developments will be realized or, even if
substantially realized, that they will have the expected
consequences to, or effects on, the Company. These forward-looking
statements are made as of the date of this press release and the
Company assumes no obligation to update or revise them to reflect
subsequent information, events or circumstances or otherwise,
except as required by law.
For more information, please contact:
Spectra7 Microsystems Inc.
Justin Leighton
Investor Relations
647-578-7996
ir@spectra7.com
Spectra7 Microsystems Inc.
David Mier
Chief Financial Officer
925-858-7011
pr@spectra7.com
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SOURCE Spectra7 Microsystems Inc.