CGD Launches New GaN Power IC Packages With Enhanced Thermal Performance for Data Centres, Inverters & More
June 04 2024 - 5:02AM
Business Wire
New packages deliver increased power output, simplifying
inspection, saving system cost and increasing reliability
Cambridge GaN Devices (CGD), the fabless, clean-tech
semiconductor company that develops energy-efficient GaN-based
power devices that make greener electronics possible, has announced
two new packages for the company’s ICeGaN™ family of GaN power ICs
that offer enhanced thermal performance and simplify inspection.
Variants of the well-proven DFN style, both packages are extremely
rugged and reliable.
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CGD New Packages (Photo: Business
Wire)
Developed for CGD, the DHDFN-9-1 (Dual Heat-spreader DFN) is a
thin, dual-side cooled package with a small, 10x10 mm footprint and
wettable flanks to simplify optical inspection. It offers low
thermal resistance (Rth(JC), and can be operated with bottom-side,
top-side and dual-side cooling, offering flexibility in design and
out-performing the often-used TOLT package in top-side and,
especially, dual-side cooled configurations. The DHDFN-9-1 package
has been designed with dual-gate pinout to facilitate optimal PCB
layout and simple paralleling, enabling customers to address
applications up to 6 kW with ease.
The BHDFN-9-1 (Bottom Heat-spreader DFN) is a bottom-side cooled
package, also with wettable flanks for easy inspection. Thermal
resistance is 0.28 K/W, matching or exceeding other leading
devices. Measuring 10x10 mm, the BHDFN is smaller than the
commonly-used TOLL package yet shares a similar footprint, hence a
common layout with TOLL-packaged GaN power ICs is possible for ease
of use and evaluation.
Nare Gabrielyan | product Marketing
manager, CGD
“These new packages are part of our
strategy to enable customers to use our ICeGaN GaN power ICs at
higher power levels. Servers, data centres, inverters/motor drives,
micro-inverters and other industrial applications are all beginning
to enjoy the power density and efficiency benefits that GaN brings,
but they are also more demanding. Therefore, it is essential for
such applications that devices are also rugged and reliable, and
easy to design in. These attributes are inherent in ICeGaN, and are
supported and extended by the new packages.”
Improving thermal resistance performance has several benefits.
First, more power output is available at the same RDS(on) . Devices
also run at cooler temperatures for the same power, so less
heatsinking is required, resulting in reduced system costs. Lower
operating temperatures also lead to higher reliability and longer
lifetimes. Finally, if cost is the constraint for the application,
designers can use a lower cost part with a higher RDS(on) and still
achieve the required power output.
The new packages will be shown for the first time publicly at
the upcoming PCIM exhibition on CGD’s booth # 7 643, Nürnberg
Messe, Nuremberg, Germany, 11-13th June 2024.
About Cambridge GaN Devices
Cambridge GaN Devices (CGD) designs, develops and commercialises
GaN transistors and ICs enabling a radical step change in energy
efficiency and compactness. Our mission is to bring
innovation into everyday life by delivering effortless
energy-efficient GaN solutions. CGD’s ICeGaN™ technology is proven
suitable for high volume production and the company is
rapidly scaling up with manufacturing and customer partnerships in
place. A fabless enterprise, CGD was spun out from Cambridge
University, and its founders, CEO Dr Giorgia Longobardi and CTO
Professor Florin Udrea, still retain strong links with the
world-renowned High Voltage Microelectronics and Sensors group
(HVMS) at the University. CGD’s ICeGaN HEMT technology is protected
by a strong and constantly-growing IP portfolio which is a result
of the company's commitment to innovation. The technical and
commercial expertise of the CGD team combined with an extensive
track record in the power electronics market has been fundamental
to the market acceptance of its proprietary technology.
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version on businesswire.com: https://www.businesswire.com/news/home/20240604228266/en/
Weiyi Pan, Digital Marketing Manager, CGD | +44 7410 506783
weiyi.pan@camgandevices.com Jeffreys Building, Suite 8, Cowley
Road, Cambridge CB4 0DS
Worldwide Agency: Nick Foot, BWW Communications |
+44-7808-362251 | nick.foot@bwwcomms.com