AALBORG, Denmark, Jan. 31, 2020 /PRNewswire/ -- Asetek today
announced that its InRackCDU™ Rack level direct to chip (D2C)
liquid cooling solution has been chosen by a global Server OEM for
an upcoming refresh of an existing server product platform
targeting the HPC segment.
The servers will be offered worldwide by the undisclosed OEM to
HPC data center customers with the option to use Asetek's liquid
cooling. Market release is expected before year-end 2020. Asetek
will support the OEM with final product integration and
testing.
"This is the company's first ever design win with a true global
server OEM and an important and significant step in maturing our
data center business. Energy efficiency, density and waste heat
recovery is increasingly on the agenda and now we will be able to
reach a broad range of end-customers worldwide," said André S.
Eriksen, CEO and Founder of Asetek. "The design win is in line with
our long-term strategy of increasing end-user adoption through new
and existing OEMs."
A server product platform is typically upgraded every 18 to 24
months. Early estimates indicate a revenue potential of
USD 4 to 5 million over the course of
the product life. Asetek plans to provide further information about
the OEM customer and product platform at time of market
release.
About Asetek
Asetek, the creator of the all-in-one liquid cooler, is the
global leader for liquid cooling solutions for high performance
gaming and enthusiast PCs, and environmentally aware data centers.
Founded in 2000, Asetek is headquartered in Denmark and has operations in China, Taiwan
and the United States. Asetek is
listed on the Oslo Stock Exchange (ASETEK.OL).
www.asetek.com
For further information, please contact:
CEO and Founder André S. Eriksen
+45-2125-7076, email: ceo@asetek.com
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SOURCE Asetek