SHANGHAI, China, May 13, 2024
/PRNewswire/ -- DuPont today announced it will showcase its
comprehensive range of advanced circuit materials and solutions at
the 2024 International Electronic Circuits Exhibition in
Shanghai. With a product portfolio
that includes fine line, signal integrity, power and thermal
management, DuPont will exhibit at Booth #8L06 at the
National Exhibition and Convention Center (NECC) from May 13 to 15.
Driven by rapid increase in data generation, the demand for
high-speed devices that power artificial intelligence (AI)
continues to soar. DuPont is leading the charge in innovation with
cutting-edge solutions for advanced packaging and integrated
circuit (IC) substrates, two crucial components for AI accelerators
and high-performance computing applications. Collaborations with
OEMs and key players in the industry have yielded groundbreaking
results, such as the development of glass substrate technology and
a micro-bump SnAg solution for next-generation high bandwidth
memory (HBM) tailored to AI applications.
"Our new technology solutions demonstrate DuPont's ability to
drive innovation and deliver value in partnership with industry
leaders in the AI sector. As a one-stop powerhouse for advanced
interconnect solutions, from chip packaging, IC substrate, advanced
PCB, to assembly, we are well equipped to enable our customers to
push the boundaries in AI-driven technologies. We are thrilled to
debut our product portfolio at the electronic circuits exhibition
this year," said Yuan Yuan Zhou, global business director, Advanced
Circuit & Packaging, DuPont.
As the PCB industry rapidly evolves, it faces challenges such as
miniaturization, signal integrity, and thermal management for
high-speed and high-frequency connectivity. DuPont's comprehensive
solutions are designed to address these challenges by advanced
materials and chemistry for flex, rigid-flex, rigid PCBs, IC
substrate and advanced packaging.
At the exhibition, DuPont experts will share their extensive
knowledge and expertise on technological advancements and industry
trends. Attendees will have the opportunity to explore DuPont's
range of total solutions for the PCB industry, which includes the
following product offerings:
DuPont™ Circuposit™ SAP8000 electroless copper is an
innovative SAP metallization technology tailored specifically for
AI CPU or GPU chip applications. This ionic base catalyst
electroless copper process is optimized for advanced packaging,
including high-end CPU or GPU, to meet the requirements for low
roughness dielectrics and low Dk and Df properties, which are
critical for fine line and high-frequency designs.
DuPont™ Microfill™ SFP-II-M acid plating copper is a
cutting-edge pattern plating solution, specifically engineered to
ensure optimal pattern distribution for large AI chips. Tailored
for high-performance computing applications, this novel plating
solution delivers consistent pattern distribution across large unit
sizes, providing superior performance and reliability.
DuPont™ Riston® DI1600 & DI1600M dry film
photoresist are advanced photoresist solutions that enable
fine line direct imaging for IC substrate applications. They offer
exceptional fine line adhesion and resolution, combined with
high-yield performance, making them the ideal choice for advanced
IC substrate production.
DuPont™ Solderon™ TS7000 series solder is a SnAg
micro bump plating solution, specially formulated for HBM
applications. It provides outstanding coplanarity performance,
making it the ideal choice for mixed bumps and fine pitch
micro-bump applications. Additionally, the BP7000 series can
accommodate both soluble and insoluble electrode plating solutions,
adding to its versatility.
DuPont™ CYCLOTENE™ 3300 3D encapsulant is a
copper-copper hybrid bonding solution designed for next-generation
HBM applications. This self-priming material eliminates the need
for a separate adhesion promotion process and provides excellent
material properties. With good uniformity and filling capability,
it enables heterogeneous 3DIC structures that meet customer
requirements and fulfill reliability critical to quality
specifications.
Laird™ Tpcm™ 7000, a high-performance phase change
material, is preferred for AI applications for its excellent
thermal performance and long-term reliability even at high
temperatures and non-coplanar mating surfaces. It provides
solutions for more efficient, longer running, and more secure AI
chips that meet the needs of data centers.
About DuPont Electronics & Industrial
DuPont
Electronics & Industrial is a global supplier of new
technologies and performance materials serving the semiconductor,
circuit board, display, digital and flexographic printing,
healthcare, aerospace, industrial, and transportation industries.
From advanced technology centers worldwide, teams of talented
research scientists and application experts work closely with
customers, providing solutions, products and technical service to
enable next-generation
technologies. http://electronics.dupont.com.
About DuPont
DuPont (NYSE: DD) is a global innovation
leader with technology-based materials and solutions that help
transform industries and everyday life. Our employees apply diverse
science and expertise to help customers advance their best ideas
and deliver essential innovations in key markets including
electronics, transportation, construction, water, healthcare and
worker safety. More information about the company, its businesses
and solutions can be found at www.dupont.com. Investors can access
information included on the Investor Relations section of the
website at investors.dupont.com.
DuPont™, the DuPont Oval Logo, and all trademarks and service
marks denoted with ™, SM or ® are owned
by affiliates of DuPont de Nemours, Inc. unless otherwise
noted.
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SOURCE DuPont