ST.
PAUL, Minn., Feb. 3,
2025 /PRNewswire/ -- 3M
is expanding its commitment to the semiconductor industry by
joining the US-JOINT Consortium, a strategic partnership of 12
leading semiconductor suppliers. The consortium drives research and
development in next-generation semiconductor advanced packaging and
back-end processing technologies anchored by a new cutting-edge
facility in Silicon Valley.
"As the demands of AI and other high performance computing
technologies increase, suppliers must work together to provide
comprehensive solutions to tough challenges on increasingly shorter
timelines." said Steven Vander Louw,
3M's president of display and electronics product platforms. "The
companies in the US-JOINT Consortium represent US and Japanese
innovation leaders in a range of advanced packaging technologies.
3M is pleased to join the consortium
in order to bring our decades of materials science expertise,
across more than 50 technology platforms, to help address these
challenges."
For more than 25 years, 3M has
been a supplier of materials and processing aids for semiconductor
polishing, advanced packaging, and chip transport applications.
Teaming up with industry leaders continues to reinforce 3M's
commitment to be an integrated total solutions provider for the
semiconductor industry.
The consortium was founded in 2023 and led by Japan-based Resonac, a global leader in the
semiconductor and electronics industry.
"We are delighted to welcome 3M to
the US-JOINT Consortium," said Hidenori
Abe, CTO for semiconductor materials, Resonac. "3M's
expertise in materials science and commitment to innovation in
advanced packaging device and process solutions will be an asset as
we work together to solve difficult technical and integration
challenges for customers onshore in the
United States."
The new US-JOINT Consortium R&D facility is expected to be
unveiled later this year in conjunction with a public launch
event.
Learn more about semiconductor advanced packaging technologies
on 3M.com.
About 3M
3M believes science helps create a brighter world
for everyone. By unlocking the power of people, ideas and science
to reimagine what's possible, our global team uniquely addresses
the opportunities and challenges of our customers, communities, and
planet. Learn how we're working to improve lives and make what's
next at 3M.com/news.
About the Resonac Group:
The Resonac Group was
established in January 2023 as a
result of the integration of the Showa Denko Group and the Showa
Denko Materials Group (former Hitachi Chemical Group). The Group's
annual sales of semiconductor and electronic materials amount to
approximately 340 billion yen. The
Group is recognized for its extensive lineup of semiconductor
materials for back-end processes, which have top market share
globally. The integration of the two companies has enabled the
Resonac Group to make material design and development in-house from
raw materials through to finished goods. The new trade name
"RESONAC" was created as a combination of two English words,
namely, the word "RESONATE" and "C" from the first letter of
CHEMISTRY. The Resonac Group actively leverages its co-creative
platform to accelerate technological innovation with semiconductor
manufacturers, materials manufacturers, and equipment manufacturers
in Japan and across the
globe.
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SOURCE 3M Company