Applied Materials and A*STAR’s Institute of Microelectronics Expand Research Collaboration to Accelerate Heterogeneous Chip Integration with Hybrid Bonding Technology
December 23 2021 - 4:00AM
Applied Materials, Inc. and the Institute of Microelectronics
(IME), a research institute of Singapore’s Agency for Science,
Technology and Research (A*STAR), today announced a new phase of
their research collaboration at the Center of Excellence in
Advanced Packaging in Singapore.
As traditional Moore’s Law scaling slows, chipmakers and systems
companies are increasingly looking to heterogeneous design and
advanced packaging solutions to enable continued advances in power,
performance, area, cost and time-to-market (PPACt™). By combining
chips of various nodes and functions in a single package,
heterogeneous integration also enables smaller form factors and
greater design and manufacturing flexibility. An emerging form of
heterogeneous integration called hybrid bonding connects chips and
wafers with direct copper-to-copper bonding, thereby reducing
wiring distances and increasing input/output (I/O) density. This
improves power efficiency and enables greater system
performance.
Under the new phase of their R&D engagement, Applied
Materials and A*STAR’s IME aim to accelerate the AI era of
computing by driving breakthroughs in heterogeneous integration and
advanced packaging for semiconductor innovation. The parties have
signed a five-year extension to their existing research
collaboration and will make a new, combined investment of
approximately USD$210 million to upgrade and expand the Center of
Excellence in Advanced Packaging in Singapore to accelerate
materials, equipment and process technology solutions for hybrid
bonding and other emerging, 3D chip integration technologies.
Singapore’s Minister for Trade and Industry, Mr. Gan Kim Yong,
presided at the ceremony today to kick off the third phase of the
R&D collaboration between the organizations.
“Creating breakthroughs in heterogeneous integration and
advanced packaging is a key element of Applied Materials’ strategy
to be the PPACt enablement company™ for our customers,” said Dr.
Prabu Raja, Senior Vice President and General Manager of
the Semiconductor Products Group at Applied Materials.
“We are excited to extend our research collaboration with A*STAR’s
IME, and look forward to accelerating hybrid bonding technology and
further innovations in 3D chip integration technologies for the
semiconductor and computing industries.”
“This year marks the 30th anniversary of Applied Materials in
Singapore and we are grateful for the continuous support and
collaboration from A*STAR’s IME,” said Mr. Brian Tan, Regional
President, Applied Materials South East Asia Pte. Ltd. “Together,
our organizations have created tremendous value for the Singapore
R&D and manufacturing ecosystems, and through our latest
efforts we aim to continue building up local talent and
infrastructure to address global technology inflections.”
“We are pleased at how Applied Materials has decided to take
another step forward with us, to further expand its R&D
activities in Singapore,” said Professor Alfred Huan, Assistant
Chief Executive, Science & Engineering Research Council,
A*STAR. “We are confident that this next phase of collaboration
with Applied Materials will help to create more business
opportunities and future-ready talent pools for Singapore. This
will benefit partners in the ecosystem, attract new industry
players, and strengthen Singapore’s position as a global leader in
the advanced packaging sector,” he added.
“Through this collaboration, we will see IME’s strategic R&D
capabilities in advanced packaging and heterogeneous integration
complement Applied Materials’ world-class expertise gained through
its Advanced Packaging Development Center. We aim to add value to
the semiconductor sector by working with companies to co-develop
solutions, transfer technologies, and increase Singapore’s
competitiveness in this space,” said Mr. Terence Gan, Executive
Director (Designate), Institute of Microelectronics (IME),
A*STAR.
About Applied MaterialsApplied Materials, Inc.
(Nasdaq: AMAT) is the leader in materials engineering solutions
used to produce virtually every new chip and advanced display in
the world. Our expertise in modifying materials at atomic levels
and on an industrial scale enables customers to transform
possibilities into reality. At Applied Materials, our innovations
make possible a better future. Learn more at
www.appliedmaterials.com.
About A*STAR’s Institute of Microelectronics
(IME)The Institute of Microelectronics (IME) is a research
institute of the Agency for Science, Technology and Research
(A*STAR). Positioned to bridge the R&D between academia and
industry, IME's mission is to add value to Singapore's
semiconductor industry by developing strategic competencies,
innovative technologies and intellectual property; enabling
enterprises to be technologically competitive; and cultivating a
technology talent pool to inject new knowledge to the industry. Its
key research areas are in Heterogeneous Integration,
System-in-Package, Sensor, Actuators and Microsystems, RF &
mmWave, SiC/GaN-on-SiC Power Electronics, and MedTech. For more
information about IME, please visit www.a-star.edu.sg/ime.
About the Agency for Science, Technology and Research
(A*STAR)The Agency for Science, Technology and Research
(A*STAR) is Singapore's lead public sector R&D agency. Through
open innovation, we collaborate with our partners in both the
public and private sectors to benefit the economy and society. As a
Science and Technology Organisation, A*STAR bridges the gap between
academia and industry. Our research creates economic growth and
jobs for Singapore, and enhances lives by improving societal
outcomes in healthcare, urban living, and sustainability. A*STAR
plays a key role in nurturing scientific talent and leaders for the
wider research community and industry. A*STAR’s R&D activities
span biomedical sciences to physical sciences and engineering, with
research entities primarily located in Biopolis and Fusionopolis.
For ongoing news, visit www.a-star.edu.sg.
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Editorial Contacts:
Applied Materials:Ricky Gradwohl (USA)+1 (408) 235-4676
Rita Tsang (Singapore)+65-8686-6447
A*STAR’s Institute of Microelectronics:Robin Chan
(Singapore)+65-9830-2610
Investor Relations Contact:
Applied Materials:Michael Sullivan+1 (408) 986-7977
PPACt and PPACt enablement company are trademarks of Applied
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respective owners.
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