Advanced Energy Unveils Next-Generation Litmas(TM) RF Plasma Sources
April 01 2004 - 8:00AM
PR Newswire (US)
Advanced Energy Unveils Next-Generation Litmas(TM) RF Plasma
Sources High-Power Systems Build on Proven Litmas Technology to
Perform Highly Efficient PFC Abatement in 200- and 300mm Etch
Processes FORT COLLINS, Colo., April 1 /PRNewswire-FirstCall/ --
Advanced Energy Industries, Inc. today announced the latest
additions to its Litmas(TM) family of high-density RF plasma
sources for abatement of perfluorinated compound (PFC) emissions in
semiconductor etch processes. The next-generation Litmas RPS 1501
and RPS 3001 linear-inductive plasma sources deliver a number of
benefits over competitive atmospheric-pressure plasma and
combustion-based PFC abatement offerings. Most notably, these
sources offer integrated, energy-efficient RF power delivery to
advanced cylindrical plasma chambers for cost-efficient foreline
abatement of PFC gases. AE also announced that CS CLEAN SYSTEMS AG
(Munich, Germany) will be the sole distributor for this line of
Litmas products into PFC abatement applications. PFCs are extremely
strong absorbers of infrared radiation and, therefore, show high
potential for contributing to global warming. By 2010, the World
Semiconductor Council has committed to reduce semiconductor
industry-emitted PFC emissions by more than 10 percent over 1995 to
1997 levels. However, many advanced chip designs that already
utilize a number of PFC-emitting poly etch steps in their
manufacturing process utilize increased numbers of metallization
layers which in turn require additional oxide and metal etch steps
-- the largest single source of PFC emissions in many
next-generation fabs -- thus leading to increased per-chip
emissions of PFCs. Semiconductor manufacturers' need for effective
PFC abatement technology for etch processes will therefore continue
to escalate as the 2010 deadline approaches. AE's Litmas technology
is designed to help eliminate the PFC emission problem from several
types of etch processes, just as AE's Xstream(TM) remote plasma
source has nearly eliminated PFC emissions from many CVD
chamber-clean processes. AE Chairman and CEO Douglas Schatz noted,
"These products are more powerful and efficient than other products
in the marketplace, providing customers with unmatched efficiency,
power and flexibility. We look forward to helping semiconductor
makers achieve their PFC reduction goals while helping them bring
their products to market more safely and cost-effectively than ever
before." Litmas(TM) RPS 1501/3001 Features and Capabilities Using
AE's field-proven foreline abatement technique, the new Litmas
sources help destroy PFCs and convert them into compounds that can
easily be removed by standard scrubbing technologies. This
technology offers a number of benefits over
competitiveatmospheric-pressure plasma, thermal- and
combustion-based abatement offerings. Because the plasma source can
turn on only when necessary, it is highly energy efficient.
Moreover, without burners or flammable fuel requirements, the
Litmas sources offer lower operating costs and improved fab safety.
Litmas sources also offer a high degree of flexibility at
installation due to their single-chamber foreline configuration --
they can be retrofitted to etch tools without changing scrubbers
and are compatible with all scrubber technology options. Finally,
the Litmas sources are based on field-proven technology tested at
fabs around the world for over five years. To provide a full
portfolio of hazardous gas scrubbing capabilities and ensure that
customers have access to a single vendor with worldwide
capabilities for the entire PFC abatement solution, AE is extending
its relationship with CS CLEAN SYSTEMS AG. CS AG will bundle its
gas-delivery system and tool-integration kit with AE's Litmas RPS
1501 plasma sources to create a complete package (sold under the CS
CLEAN PCS brand) that chipmakers can employ to achieve world-class
PFC abatement in their etch processes. Dr. Karl Markert, vice
president of sales and marketing with CS AG, noted, "We chose to
work with AE because of the wide set of plasma conditions that AE's
systems can address as well as AE's unparalleled technical know-how
in the PFC abatement and semiconductor equipment area. Our
companies' products are highly complimentary, and we believe that
CS AG's ability to offer Litmas products as part of a wider
emissions control portfolio will help speed interest in and
adoption of this technology." The new Litmas RPS 1501 and RPS 3001
plasma sources are slated to begin shipping in Q3 2004. About
Advanced Energy Advanced Energy is a global leader in the
development and support of technologies critical to high-technology
manufacturing processes used in the production of semiconductors,
flat panel displays, data storage products, compact discs, digital
video discs, architectural glass and other advanced product
applications. Leveraging a diverse product portfolio and technology
leadership, AE creates solutions that maximize process impact,
improve productivity and lower cost of ownership for its customers.
This portfolio includes a comprehensive line of technology
solutions in power, flow and thermal management and plasma and ion
beam sources for original equipment manufacturers (OEMs) and
end-users around the world. AE operates in regional centers in
North America, Asia and Europe and offers global sales and support
through direct offices, representatives and distributors. Founded
in 1981, AE is a publicly held company traded on Nasdaq National
Market under the symbol AEIS. More information can be found at
http://www.advanced-energy.com/. DATASOURCE: Advanced Energy
Industries, Inc. CONTACT: Marna Shillman, Corporate Communication
Manager of Advanced Energy Industries, Inc., +1-970-407-6280, ; or
Dori Jones, Account Director of MCA, +1-650-968-8900, , for
Advanced Energy Industries, Inc. Web site:
http://www.advanced-energy.com/
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