Aehr Test Systems to Present at William Blair 43rd Annual Growth Stock Conference on June 7
June 02 2023 - 7:30AM
Aehr Test Systems (
NASDAQ: AEHR),
a worldwide supplier of semiconductor test and production
burn-in equipment, today announced that President and CEO Gayn
Erickson will be presenting at the William Blair 43rd Annual Growth
Stock Conference in Chicago on Wednesday, June 7 at 3:20pm CT
(1:20pm PT) and will be meeting with institutional investors
throughout the day.
The presentation will be webcast live and available for replay
at the investor relations section of Aehr’s website at www.aehr.com
and may also be accessed by clicking here.
“I look forward to discussing our semiconductor wafer level and
singulated die test and burn-in solutions and the markets they
serve with investors,” said Mr. Erickson. “We continue to be
excited about the silicon carbide market for electric vehicles and
electrification of the worldwide infrastructure, as well as gallium
nitride that is used in both consumer applications and for
photovoltaic and automotive applications. Aehr Test provides
complete production solutions for improving yield and reliability
of semiconductors, and devices such as silicon carbide
semiconductors used in electric and hybrid electric vehicles,
silicon photonics devices used in data centers and 5G
infrastructure, and 2D/3D and other sensors used in mobile and
wearable applications, which are expected to be significant revenue
drivers for our products this fiscal year and next few years.”
For additional information, or to schedule a meeting with Mr.
Erickson, please contact your William Blair representative, or
Aehr’s investor relations firm, MKR Investor Relations, at
aehr@mkr-group.com.
About Aehr Test SystemsHeadquartered in
Fremont, California, Aehr Test Systems is a worldwide provider of
test systems for burning-in semiconductor devices in wafer level,
singulated die, and package part form, and has installed over 2,500
systems worldwide. Increased quality and reliability needs of the
Automotive and Mobility integrated circuit markets are driving
additional test requirements, incremental capacity needs, and new
opportunities for Aehr Test products in package, wafer level, and
singulated die/module level test. Aehr Test has developed and
introduced several innovative products, including the ABTSTM and
FOX-PTM families of test and burn-in systems and FOX WaferPakTM
Aligner, FOX WaferPak Contactor, FOX DiePak® Carrier and FOX DiePak
Loader. The ABTS system is used in production and qualification
testing of packaged parts for both lower power and higher power
logic devices as well as all common types of memory devices. The
FOX-XP and FOX-NP systems are full wafer contact and singulated
die/module test and burn-in systems used for burn-in and functional
test of complex devices, such as leading-edge silicon carbide-based
power semiconductors, memories, digital signal processors,
microprocessors, microcontrollers, systems-on-a-chip, and
integrated optical devices. The FOX-CP system is a new low-cost
single-wafer compact test and reliability verification solution for
logic, memory and photonic devices and the newest addition to the
FOX-P product family. The WaferPak Contactor contains a unique full
wafer probe card capable of testing wafers up to 300mm that enables
IC manufacturers to perform test and burn-in of full wafers on Aehr
Test FOX systems. The DiePak Carrier is a reusable, temporary
package that enables IC manufacturers to perform cost-effective
final test and burn-in of both bare die and modules. For more
information, please visit Aehr Test Systems’ website at
www.aehr.com.
Contacts: |
|
|
|
Aehr Test SystemsKen SpinkChief Financial
Officer(510) 623-9400 x309aehr@mkr-group.com |
MKR Investor Relations Inc.Todd Kehrli or Jim
ByersAnalyst/Investor Contact (323) 468-2300 |
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