Media Alert: Rambus to Present at BofA Securities and Rosenblatt Conferences
May 25 2023 - 4:05PM
Business Wire
Rambus Inc. (Nasdaq: RMBS), a provider of industry-leading chips
and IP making data faster and safer, today announced that its
executives will present at two upcoming investor events.
Luc Seraphin, chief executive officer, will present at:
- BofA Securities 2023 Global Technology Conference in San
Francisco, CA on June 7, 2023 at 3:20 p.m. PT. The presentation
will be available through a webcast which can be accessed on the
Rambus Investor Relations website at investor.rambus.com. A replay
of the presentation will also be available on the website following
the event.
Steven Woo, fellow and distinguished inventor, will present
at:
- Rosenblatt 3rd Annual Technology Virtual Summit on June 8, 2023
at 12:00 p.m. PT. The presentation will only be available to
conference attendees. A replay of the presentation will be
available on the Rambus Investor Relations website at
investor.rambus.com following the event.
About Rambus Inc.
Rambus is a provider of industry-leading chips and silicon IP
making data faster and safer. With over 30 years of advanced
semiconductor experience, we are a pioneer in high-performance
memory subsystems that solve the bottleneck between memory and
processing for data-intensive systems. Whether in the cloud, at the
edge or in your hand, real-time and immersive applications depend
on data throughput and integrity. Rambus products and innovations
deliver the increased bandwidth, capacity and security required to
meet the world’s data needs and drive ever-greater end-user
experiences. For more information, visit rambus.com.
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version on businesswire.com: https://www.businesswire.com/news/home/20230525005669/en/
Nicole Noutsios Rambus Investor Relations (510) 315-1003
rambus@nmnadvisors.com
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