Aehr Test Systems to Exhibit at the 2018 International Test Conference in Phoenix, Arizona Oct 28 - Nov 2
October 29 2018 - 7:30AM
Aehr Test Systems (NASDAQ: AEHR), a worldwide
supplier of semiconductor test and burn-in equipment, today
announced that it will be showcasing its FOX-XPTM next generation
multi-wafer test and burn-in systems for high volume production and
early failure rate (EFR) test in booth 315 at the 2018
International Test Conference (ITC) taking place October
28-November 2 in Phoenix, Arizona at the Phoenix Convention Center.
ITC is the world’s premier conference dedicated to electronics
test. This year features numerous topics including emerging test
needs for artificial intelligence, automotive and IoT, hardware
security, system test, analog and mixed-signal test, yield
learning, test analytics, test methodology, benchmarks, test
standards, memory and 3D test, diagnosis, DFT architectures, and
functional and software-based test. There will also be focus
Workshops on both Automotive Reliability and Test (ART 2018) and
Silicon Photonics Design and Test (SPDT 2018).
Aehr Test President and CEO Gayn Erickson commented, “Aehr Test
supplies complete test and burn-in solutions for reliability
screening and production to ensure that the devices meet their
reliability targets. As more new product designs challenge
traditional test and reliability screening methodologies, Aehr’s
wafer-level and singulated die/module production test and burn-in
capabilities offer a cost-effective solution for high volume
production.”
ITC Tutorials and the Automotive Workshop this year highlight
the IC industry’s drive towards “Zero Defect” IC quality -
especially in the expanding automotive market. With the anticipated
emergence of autonomous vehicles, reliability and safety are
paramount issues for automotive manufacturers and especially their
customers. In addition, these requirements are important for
reliability-critical applications such as sensors and security
devices in mobile smartphones and tablets, and are creating new
need for reliability and assurance of operation in wearable
biosensors. The Silicon Photonics Design and Test Workshop focuses
on the expanded use of photonics devices in data communications and
other applications. Aehr Test’s reliability screening solutions
directly address the needs to be discussed in both the Automotive
and Silicon Photonics Workshops.
”Aehr Test is a unique supplier of both complete production
solutions as well as subsystems, including chambers, electronics,
and thermal control, that can be combined with
applications-specific hardware designed with or provided by the
customer,” Erickson added. “Aehr partners with our customers to
develop solutions to meet their needs for a range of new
applications where solutions are needed to test and burn-in devices
in their application environment.”
The solutions Aehr Test will feature at its ITC exhibit booth
include:
- The FOX-XP system, the company’s next-generation multi-wafer
and now singulated die/module test solution is capable of
functional test and burn-in/cycling of flash memories,
microcontrollers, sensors, and other leading-edge ICs in wafer form
before they are assembled into single or multi-die stacked
packages. The FOX wafer-level systems utilize Aehr Test's FOX
WaferPakTM Contactors, which provide cost effective solutions for
making electrical contact with a full wafer or substrate in a
multi-wafer environment. The new configuration with the DiePak®
Carriers also enables burn-in of singulated die and multi-die
modules to screen for defects in both the die and the module
assembly process. The resulting known-good die, single-die or
stacked-die packaged parts can then be used for high reliability
and quality applications such as enterprise solid state drives,
automotive devices, photonics devices, highly valuable mobile
applications, and mission critical integrated circuits and
sensors.
- The ABTSTM family of packaged part burn-in and test systems is
based on a state-of-the-art hardware and software platform that is
designed to address not only today’s devices, but also future
devices for many years to come. This system can test and burn-in
high pin-count devices with configurations for both high-power and
low-power applications.
The key feature of the FOX-XP test cell that contributes to its
cost-effectiveness is the ability to provide up to 2,048 “Universal
Channels” per wafer or DiePak carrier, enabling the system to test
all the devices on the wafer or DiePak Carrier in parallel. The
innovative “Universal Channel” architecture allows any channel to
perform any function (I/O, Device Power Supply (DPS) or Per-pin
Precision Measurement Unit (PPMU)). This enhanced architecture
allows customers to perform per pin parametric testing, more
extensive digital pattern test with deeper data stimulus / capture
memory (32M per pin), and deeper scan (768M) optimized for BIST/DFT
testing.
A single FOX-XP test system may be configured with up to 18
slots of test resources enabling up to 18 WaferPak Contactors or
DiePak Carriers to be tested simultaneously. The FOX-XP system also
offers per slot high performance thermal chucks to enable managing
the temperature of the high power density devices under test, and
an 18-slot test system footprint similar to typical semiconductor
Automatic Test Equipment (ATE) that can only test one wafer at a
time.
With the highest wafer throughput available in the ATE industry,
the flexibility of Aehr Test’s new “Universal Channel”
architecture, and the ability to perform both functional pattern
verification and parametric testing at full-wafer parallel test,
the FOX-XP system provides a highly differentiated solution from
competitive alternatives.
About Aehr Test SystemsHeadquartered in
Fremont, California, Aehr Test Systems is a worldwide provider of
test systems for burning-in and testing logic, optical and memory
integrated circuits and has over 2,500 systems installed worldwide.
Increased quality and reliability needs of the Automotive and
Mobility integrated circuit markets are driving additional test
requirements, incremental capacity needs, and new opportunities for
Aehr Test products in package, wafer level, and singulated
die/module level test. Aehr Test has developed and introduced
several innovative products, including the ABTSTM and FOX-PTM
families of test and burn-in systems and FOX WaferPakTM Aligner,
FOX-XP WaferPak Contactor, FOX DiePak® Carrier and FOX DiePak
Loader. The ABTS system is used in production and qualification
testing of packaged parts for both lower power and higher power
logic devices as well as all common types of memory devices. The
FOX-XP system is a full wafer contact and singulated die/module
test and burn-in system used for burn-in and functional test of
complex devices, such as leading-edge memories, digital signal
processors, microprocessors, microcontrollers, systems-on-a-chip,
and integrated optical devices. The WaferPak contactor contains a
unique full wafer probe card capable of testing wafers up to 300mm
that enables IC manufacturers to perform test and burn-in of full
wafers on Aehr Test FOX systems. The DiePak Carrier is a reusable,
temporary package that enables IC manufacturers to perform
cost-effective final test and burn-in of both bare die and modules.
For more information, please visit Aehr Test Systems’ website at
www.aehr.com.
Contacts: |
|
Aehr Test
Systems |
MKR Group
Inc. |
Carl Buck |
Todd Kehrli or Jim
Byers |
V.P of Marketing |
Analyst/Investor
Contact |
(510) 623-9400
x381 |
(323) 468-2300 |
cbuck@aehr.com |
aehr@mkr-group.com |
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