Aehr Test Systems to Participate in Sixth Annual NYC Investor Summit
November 28 2017 - 7:30AM
Aehr Test Systems (
NASDAQ:AEHR),
a worldwide supplier of semiconductor test and burn-in equipment,
today announced that Gayn Erickson, President and CEO, is scheduled
to participate in the Sixth Annual NYC Investor Summit 2017, taking
place December 6, 2017 at Le Parker Méridien Hotel in New York
City.
Mr. Erickson commented, “We look forward to
discussing how our advanced test and burn-in systems are helping
companies that supply devices into the automotive sensor, mobile
communications, IC, and Internet of Things markets meet the higher
quality and reliability needs of these markets, where safety,
security and assurance of user confidence are absolutely
critical.”
About the NYC Summit
The NYC Summit is hosted by executive management
from participating companies and will feature a “round-robin”
format consisting of small group meetings, each 30 minutes in
duration. During the event, investors and analysts will have the
opportunity to meet with up to 10 of the 14 management teams during
the 30-minute group meeting sessions, as well as opportunities to
meet with additional management teams during the breakfast and
lunch networking sessions. The NYC Investor Summit is by invitation
only and is open to accredited investors and publishing research
analysts.
About Aehr Test
SystemsHeadquartered in Fremont, California, Aehr Test
Systems is a worldwide provider of test systems for burning-in and
testing logic, optical and memory integrated circuits and has an
installed base of more than 2,500 systems worldwide. Increased
quality and reliability needs of the Automotive and Mobility
integrated circuit markets are driving additional test
requirements, incremental capacity needs, and new opportunities for
Aehr Test products in package, wafer level, and singulated
die/module level test. Aehr Test has developed and introduced
several innovative products, including the ABTSTM and FOX-PTM
families of test and burn-in systems and FOX WaferPak Aligner,
FOX-XP WaferPak Contactor, and FOX DiePak® Carrier. The ABTS system
is used in production and qualification testing of packaged parts
for lower power and higher power logic devices as well as all
common types of memory devices. The FOX-XP system is a full wafer
contact and singulated die/module test and burn-in system used for
burn-in and functional test of complex devices, such as
leading-edge memories, digital signal processors, microprocessors,
microcontrollers, systems-on-a-chip, and integrated optical
devices. The WaferPak contactor contains a unique full wafer probe
card capable of testing wafers up to 300mm that enables IC
manufacturers to perform test and burn-in of full wafers on Aehr
Test FOX systems. The DiePak Carrier is a reusable, temporary
package that enables IC manufacturers to perform cost-effective
final test and burn-in of both bare die and modules. For more
information, please visit Aehr Test System’s website at
www.aehr.com.
Contacts:
Aehr Test SystemsKen SpinkChief
Financial Officer(510) 623-9400 x309
MKR Group Inc.Todd Kehrli or
Jim ByersAnalyst/Investor Contact(323)
468-2300aehr@mkr-group.com
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