Ansys power integrity and on-chip electromagnetic analysis
tools enable semiconductor products for HPC, graphics, and AI
applications
/ Key Highlights
- Ansys® Redhawk-SC™, Ansys® Totem™,
Ansys® PathFinder™, and Ansys® RaptorX™
support power integrity, signal integrity, and reliability signoff
requirements for the Intel 18A process technology
- The Ansys multiphysics platform supports new Intel
manufacturing technologies including RibbonFET transistors and
backside power distribution
PITTSBURGH, Feb. 22,
2024 /PRNewswire/ -- Intel Foundry certified
Ansys (NASDAQ: ANSS) multiphysics solutions for signoff
verification of advanced integrated circuits (ICs)
designed with the Intel 18A process technology with new
RibbonFET transistor technology and backside power delivery.
The predictive accuracy of Ansys' power and signal integrity
platforms helps designers lower the power consumption and increase
the performance of edge artificial intelligence (AI), graphic
processing, and advanced computing products by minimizing
over-design. Collaboration towards a smooth electronic design
automation (EDA) flow can significantly increase productivity for
joint customers.
Ansys RedHawk-SC and Totem are recognized as industry standards
for power integrity signoff of digital and analog designs,
respectively. The solutions' cloud-enabled data infrastructure
provides unparalleled capacity to analyze full-chip designs and
multi-die assemblies. PathFinder uses the same elastic compute
infrastructure to also verify the electrostatic discharge (ESD)
protection circuitry found on all chips. The Ansys Raptor family
models high-speed signals including on-chip electromagnetic
coupling.
"Intel Foundry and Ansys have partnered to ensure our customers
have access to accurate analysis solutions for the latest
manufacturing innovations in our Intel 18A process technology,"
said Rahul Goyal, vice president
& general manager, product & design ecosystem enablement at
Intel. "Partnerships across the industry are essential for solving
challenges and taking advantage of the exciting opportunities
opened up by this leading-edge silicon technology."
"Ansys works with leading foundry partners like Intel Foundry to
address complex multiphysics challenges and meet stringent power,
performance, and reliability requirements," said John Lee, vice president and general manager of
the electronics, semiconductor, and optics business unit at Ansys.
"Ansys' signoff platform helps empower mutual customers to
accelerate design convergence with greater confidence thanks to the
collaborative work between the companies to ensure silicon
predictive accuracy and a stellar user experience."
/ About Ansys
Our Mission: Powering Innovation that Drives Human
Advancement™
When visionary companies need to know how their world-changing
ideas will perform, they close the gap between design and reality
with Ansys simulation. For more than 50 years, Ansys software has
enabled innovators across industries to push boundaries by using
the predictive power of simulation. From sustainable transportation
to advanced semiconductors, from satellite systems to life-saving
medical devices, the next great leaps in human advancement will be
powered by Ansys.
Ansys and any and all ANSYS, Inc. brand, product, service and
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other brand, product, service and feature names or trademarks are
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ANSS–T
/ Contacts
Media
|
Mary Kate
Joyce
|
|
724.820.4368
|
|
marykate.joyce@ansys.com
|
Investors
|
Kelsey
DeBriyn
|
|
724.820.3927
|
|
kelsey.debriyn@ansys.com
|
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SOURCE Ansys