Semiconductor Industry: KYOCERA and Vicor to Collaborate on Advanced Power-on-Package Solutions
April 10 2019 - 4:00PM
Business Wire
Collaboration will maximize AI performance and
minimize time-to-market for new processor designs
Kyocera Corporation (TOKYO:6971) and Vicor Corporation
(NASDAQ:VICR) will collaborate on next-generation Power-on-Package
solutions to maximize performance and minimize time-to-market for
emerging processor technologies, the companies announced today. As
a part of the collaboration between the two technology leaders,
Kyocera will provide the integration of power and data delivery to
the processor with organic packages, module substrates and
motherboard designs. Vicor will provide Power-on-Package current
multipliers enabling high density, high current delivery to
processors. This collaboration will address the rapid growth of
higher performing processors, which has created proportionate
growth and complexity in high-speed I/Os and high current
consumption demands.
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Vicor’s Power-on-Package technology enables current
multiplication within the processor package, allowing for higher
efficiency, density, and bandwidth. Providing current
multiplication within the package can reduce interconnect losses by
up to 90 percent, while allowing processor package pins, typically
required for high current delivery, to be reclaimed for expanded
I/O functionality. Vicor’s Power-on-Package solutions were featured
at the NVIDIA GPU Technology Conference 2018 and China ODCC 2018
Summit. Vicor’s advanced Power-on-Package technology enables
Vertical Power Delivery (VPD) from the bottom side of the
processor. VPD virtually eliminates Power Delivery Network (PDN)
losses while maximizing I/O capability and design flexibility.
Kyocera’s proprietary solutions to optimize processor
performance and reliability are based on decades of experience in
package, module and motherboard manufacturing for customers
worldwide. Kyocera has cultivated design expertise by applying
Vicor's Power-on-Package devices in multiple applications. By
utilizing its design technology, simulation tools and manufacturing
experience, Kyocera provides optimal designs for complex I/O
routing, high speed memory routing, and high-current power
delivery. Through collaboration, Kyocera and Vicor will bring new
solutions for AI and high-performance processor applications to
market.
About KYOCERA
Kyocera Corporation (TOKYO:6971) (https://global.kyocera.com/),
the parent and global headquarters of the Kyocera Group, was
founded in 1959 as a producer of fine ceramics (also known as
“advanced ceramics”). By combining these engineered materials with
metals and integrating them with other technologies, Kyocera has
become a leading supplier of semiconductor packages, industrial and
automotive components, electronic devices, solar power generating
systems, printers, copiers and mobile phones. During the year ended
March 31, 2018, the company’s consolidated net sales totaled 1.58
trillion yen (approx. USD14.9 billion). Kyocera appears on the
“Derwent Top 100 Global Innovators 2018-19” list by Clarivate
Analytics and is ranked #612 on Forbes magazine’s 2018 “Global
2000” list of the world’s largest publicly traded companies.
About Vicor
Vicor Corporation (NASDAQ: VICR) (http://www.vicorpower.com)
designs, develops, manufactures and markets modular power
components and complete power systems based upon a portfolio of
patented technologies. Headquartered in Andover, Massachusetts,
Vicor sells its products to the power systems market, including
enterprise and high-performance computing, industrial equipment and
automation, telecommunications and network infrastructure, vehicles
and transportation, aerospace and defense. www.vicorpower.com
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version on businesswire.com: https://www.businesswire.com/news/home/20190410005370/en/
KYOCERA Corporation (Japan)Corporate CommunicationsNatsuki Doi
+81-(0)75-604-3416webmaster.pressgl@kyocera.jpFax:
+81-(0)75-604-3516orRainier Communications for Vicor Corporation
(U.S.A.)Colin Boroski +1-508-475-0025 x
142cboroski@rainierco.com
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