The YES RapidCure tool, based on an exclusive license to the
process created by Deca Technologies, is a combination of UV and
direct thermal exposure that significantly reduces process cycle
time.
FREMONT,
Calif., Dec. 16, 2024 /PRNewswire/ -- YES (Yield
Engineering Systems, Inc.), a leading manufacturer of process
equipment for semiconductor advanced packaging today announced that
SkyWater Technology (NASDAQ: SKYT), has chosen the YES
RapidCure polymer dielectric curing systems for their
implementation of the M-Series™ fan-out wafer level packaging
(FOWLP) technology in partnership with Deca Technologies
'Deca'.
Shrinking line width and spacing in advanced packaging drives
new polymer materials that require low temperature curing. The YES
RapidCure tool, based on an exclusive license to the process
created by Deca, is a combination of UV and direct thermal exposure
that significantly reduces process cycle time. RapidCure enables
YES customers to reduce thermal budgets for the organic and
inorganic thin films used in semiconductor front end, packaging and
display applications. The RapidCure process consists of ultraviolet
(UV) pre-treatment to provide preliminary cross-linking of the
polymer, followed by precisely controlled thermal curing. Rapid
Cure provides a significant throughput advantage over conventional
curing for selected polymers, while delivering comparable or
superior dielectric properties.
"SkyWater is the first domestic licensee of Deca's M-Series and
Adaptive Patterning solutions to support the reshoring of the
semiconductor supply chain," said Bassel
Haddad, SVP & General Manager, Advanced Packaging at
SkyWater. "We are delighted to be an anchor customer of YES's
RapidCure technology, which will be critical in reducing cycle
times of curing processes, allowing SkyWater to offer faster
prototyping services, improved reliability and higher
throughput."
"We are extremely pleased to be chosen by SkyWater to support
the manufacturing ramp of their M-Series FOWLP technology," said
Rezwan Lateef, President of YES.
"The Deca RapidCure technology has been a significant complementary
addition to our cure and materials engineering capabilities that
allows YES to address a broader variety of advanced packaging
applications including low temperature polymer cure, underfill
bake, adhesive curing, degas/curing of low-K films, and a variety
of new fan-out processes. The announcement today is a realization
of a vision where ultimately, we can provide SkyWater and other
leading advanced packaging customers with the widest array of
polymer curing technologies with lower CoO and better reliability
to enable next-generation products."
"We are excited that Rezwan and the YES team are bringing to
market their robust RapidCure product for the semiconductor
industry," stated Tim Olson, founder
& CEO of Deca. "With the proven capability to fully cure
industry standard polyimide and PBO materials in under 20 minutes,
RapidCure brings an unprecedented breakthrough in cycle time
reduction for the future of high-density heterogeneous
integration. Deca created the RapidCure process as a
component of the M-Series FOWLP & FOPLP technology development
under the direction of our legendary chairman, TJ Rodgers, founder
and CEO of Cypress Semiconductor. RapidCure slashes the
typical six-hour cure time by more than 10X to accelerate the
development and production of tomorrow's advanced chiplet-based
devices."
About YES
YES is a leading provider of differentiated technologies for
materials and interface engineering needed for a wide range of
applications and markets. YES customers are market leaders,
creating next generation solutions for a variety of markets
including Advanced Packaging for AI and HPC, Memory Systems and
Life Sciences. YES is a leading manufacturer of state-of-the-art
cost-effective high volume production equipment for semiconductor
Advanced Packaging solutions for wafers and glass panels. The
company's products include Vacuum Cure, Coat & Anneal Tools,
Fluxless Reflow tools, Thru Glass Via and Cavity Etch and
Electroless Deposition tools for the semiconductor industry. YES is
headquartered in Fremont, California, with a growing global presence.
For more information, please visit YES.tech.
Media Contact
Alex Chow
SVP Worldwide Sales and BD
YES (Yield Engineering Systems, Inc.)
+886-926136155 direct
achow@yes.tech
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