Micron Commences Volume Production of Industry-Leading HBM3E Solution to Accelerate the Growth of AI
February 26 2024 - 7:00AM
Micron Technology, Inc. (Nasdaq: MU), a global leader in memory and
storage solutions, today announced it has begun volume production
of its HBM3E (High Bandwidth Memory 3E) solution.
Micron’s 24GB 8H HBM3E will be part of NVIDIA H200 Tensor Core
GPUs, which will begin shipping in the second calendar quarter of
2024. This milestone positions Micron at the forefront of the
industry, empowering artificial intelligence (AI) solutions with
HBM3E’s industry-leading performance and energy efficiency.
HBM3E: Fueling the AI Revolution As the demand
for AI continues to surge, the need for memory solutions to keep
pace with expanded workloads is critical. Micron’s HBM3E solution
addresses this challenge head-on with:
- Superior Performance: With pin speed greater
than 9.2 gigabits per second (Gb/s), Micron’s
HBM3E delivers more than 1.2 terabytes per second
(TB/s) of memory bandwidth, enabling lightning-fast data
access for AI accelerators, supercomputers, and data centers.
- Exceptional Efficiency: Micron’s HBM3E leads
the industry with ~30% lower power
consumption compared to competitive offerings. To support
increasing demand and usage of AI, HBM3E offers maximum throughput
with the lowest levels of power consumption to improve important
data center operational expense metrics.
- Seamless Scalability: With 24 GB of
capacity today, Micron’s HBM3E allows data centers to
seamlessly scale their AI applications. Whether for training
massive neural networks or accelerating inferencing tasks, Micron’s
solution provides the necessary memory bandwidth.
“Micron is delivering a trifecta with this HBM3E milestone:
time-to-market leadership, best-in-class industry performance, and
a differentiated power efficiency profile,” said Sumit Sadana,
executive vice president and chief business officer at Micron
Technology. “AI workloads are heavily reliant on memory bandwidth
and capacity, and Micron is very well-positioned to support the
significant AI growth ahead through our industry-leading HBM3E and
HBM4 roadmap, as well as our full portfolio of DRAM and NAND
solutions for AI applications.”
Micron developed this industry-leading HBM3E design using its
1-beta technology, advanced through-silicon via (TSV), and other
innovations that enable a differentiated packaging solution.
Micron, a proven leader in memory for 2.5D/3D-stacking and advanced
packaging technologies, is proud to be a partner in TSMC’s 3DFabric
Alliance and to help shape the future of semiconductor and system
innovations.
Micron is also extending its leadership with the sampling of
36GB 12-High HBM3E, which is set to deliver greater than 1.2 TB/s
performance and superior energy efficiency compared to competitive
solutions, in March 2024. Micron is a sponsor at NVIDIA GTC, a
global AI conference starting March 18, where the company will
share more about its industry-leading AI memory portfolio and
roadmaps.
About Micron Technology, Inc.We are an industry
leader in innovative memory and storage solutions transforming how
the world uses information to enrich life for all. With a
relentless focus on our customers, technology leadership, and
manufacturing and operational excellence, Micron delivers a rich
portfolio of high-performance DRAM, NAND and NOR memory and storage
products through our Micron® and Crucial® brands. Every day, the
innovations that our people create fuel the data economy, enabling
advances in artificial intelligence and 5G applications that
unleash opportunities — from the data center to the intelligent
edge and across the client and mobile user experience. To learn
more about Micron Technology, Inc. (Nasdaq: MU), visit
micron.com.
© 2024 Micron Technology, Inc. All rights reserved. Information,
products, and/or specifications are subject to change without
notice. Micron, the Micron logo, and all other Micron trademarks
are the property of Micron Technology, Inc. All other trademarks
are the property of their respective owners.
Micron Media Relations ContactKelly
Sasso Micron Technology, Inc. +1 (208)
340-2410 ksasso@micron.com
Micron Investor Relations ContactSatya
KumarMicron Technology, Inc.+1 (408)
450-6199satyakumar@micron.com
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