Micron Introduces Automotive-Grade UFS Portfolio to Deliver an Immersive Cabin Experience in Connected Vehicles
June 06 2019 - 9:00AM
Micron Technology, Inc. (Nasdaq: MU), an industry leader in
innovative memory and storage solutions, today introduced its new
UFS 2.1 managed NAND products for automotive applications. The new
portfolio addresses the need for fast system startup and higher
data bandwidth for in-vehicle infotainment systems and instrument
clusters to enhance the driver experience. The Micron® UFS 2.1
compliant managed NAND storage solutions deliver ultrafast boot and
automotive-grade reliability using cost-effective 64-layer 3D TLC
NAND architecture.
Next-generation infotainment systems include multiple
high-resolution displays as well as artificial intelligence-enabled
human-machine interface functionality such as voice, gesture and
image recognition. These feature-rich and advanced performance
systems require high-density, high-throughput and low-latency
storage. Micron’s UFS 2.1 products deliver up to three times the
sequential read performance of the company’s e.MMC-based products,
bringing instant-on capability and improved responsiveness to
create an immersive cabin experience in connected vehicles.1
“Automotive partners are demanding high-value memory solutions
that deliver better performance at affordable price points, in
addition to quality, reliability to operate in stringent automotive
environments and supply longevity,” said Aravind Ramamoorthy,
senior director of NAND solutions for Micron's Embedded Business
Unit. “Micron’s UFS 2.1 portfolio based on automotive-grade
64-layer 3D TLC NAND demonstrates our continued commitment to meet
the requirements of emerging automotive applications with
cost-effective solutions.”
Key Features of Micron’s Automotive-Grade UFS
Portfolio
- Superior performance: Up to 940 MB/s reads and
650 MB/s writes, UFS delivers up to 3X faster reads and more than
2X faster writes than e.MMC interfaces1
- Operating temperature: -40 to 105 C and -40 to
95 C2
- Quality and reliability: AEC-Q100, IATF
16949-compliant
- Cost-effectiveness: Based on industry-leading
64-layer TLC NAND with CMOS under array technology
AvailabilityMicron’s UFS
managed NAND portfolio of products is sampling to automotive
customers today, with volume production expected in the third
quarter of calendar year 2019. Micron automotive-grade UFS NAND
solutions are offered in capacities ranging from 32GB to
256GB.3
As the leading memory partner with more than 25 years of
experience serving the automotive industry, Micron provides
advanced automotive memory solutions that meet stringent quality,
reliability and compliance requirements. Micron's broad portfolio
of volatile and nonvolatile memory products is optimized for
automotive and supported by a formal product longevity program.
For more information on Micron Technology's automotive memory
solutions, visit https://www.micron.com/solutions/automotive
Resources:
- Blog: https://www.micron.com/about/blog
- Twitter: https://twitter.com/MicronTech
- LinkedIn:
https://www.linkedin.com/company/micron-technology/
- YouTube: http://www.youtube.com/user/MicronTechnology
About Micron Technology, Inc.
We are an industry leader in innovative memory and storage
solutions. Through our global brands – Micron®, Crucial®, and
Ballistix® – our broad portfolio of high-performance memory and
storage technologies, including DRAM, NAND, NOR Flash and 3D
XPoint™ memory, is transforming how the world uses information to
enrich life. Backed by 40 years of technology leadership, our
memory and storage solutions enable disruptive trends, including
artificial intelligence, machine learning and autonomous vehicles,
in key market segments like data center, networking, automotive,
industrial, mobile, graphics and client. Our common stock is traded
on the Nasdaq under the MU symbol. To learn more about Micron
Technology, Inc., visit micron.com.
References and Sources
- Sequential writes, nominal temperature and fresh-out-of-box
burst performance. May vary based on host and test
environments
- Case temperature
- 1GB = 1,000,000,000 bytes. Total user accessible capacity
varies and may be less
© 2019 Micron Technology, Inc. All rights reserved. Information,
products, and/or specifications are subject to change without
notice. Micron, the Micron logo, and all other Micron trademarks
are the property of Micron Technology, Inc. All other trademarks
are the property of their respective owners.
Media Relations Contact:
Vishal Bali
Micron Technology, Inc.
+1 (408) 822-0291
vbali@micron.com
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