Cadence and UMC Collaborate on 22ULP/ULL Reference Flow Certification for Advanced Consumer, 5G and Automotive Designs
July 13 2021 - 2:00AM
Business Wire
Collaboration enables mutual customers to
easily adopt the integrated Cadence digital full flow, which offers
leading implementation and signoff technology for ultra-low power
designs
Cadence Design Systems, Inc. (Nasdaq: CDNS) and United
Microelectronics Corporation (NYSE:UMC; TWSE: 2303) (“UMC”), a
global semiconductor foundry, today announced that the Cadence
digital full flow has been optimized and certified for the UMC
22ULP/ULL process technologies to accelerate consumer, 5G and
automotive application design. The flow, which incorporates leading
implementation and signoff technology for ultra-low power designs,
enables mutual customers to deliver top-quality designs and achieve
a faster path to tapeout. To learn more about the Cadence digital
advanced-node solutions, please visit
www.cadence.com/go/advnd22.
The Cadence digital full flow that has been optimized for use on
UMC’s 22ULP/ULL process technologies includes the Innovus™
Implementation System, Genus™ Synthesis Solution, Liberate™
Characterization, Quantus™ Extraction Solution, Tempus™ Timing
Signoff Solution, Litho Physical Analyzer and Physical Verification
System. Some of the flow’s key capabilities that enable 22ULP/ULL
design are as follows:
- Best-in-class design implementation and optimization
engines: The engines are fully integrated from RTL to GDSII,
enabling users to achieve power, performance and area (PPA) goals
and reduce time to market.
- Optimal signoff convergence: Cadence offers the only
digital flow with fully integrated place-and-route, timing signoff,
physical verification and IR drop/power signoff capabilities, which
provide unparalleled last-mile design closure with the fewest
iterations to facilitate the timely delivery of advanced-node
products.
- Low-power standard cell library development and
characterization: UMC replaced its incumbent library
characterization tool with Cadence Liberate Characterization, which
is the foundation of the broader digital full flow and a critical
piece that enables advanced timing and power analysis, optimization
and signoff flows.
“Our 22ULP/ULL platform is ideal for a wide variety of
semiconductor applications, including power- or leakage-sensitive
consumer chips and wearable products that require longer battery
life,” said Y.H. Chen, director of the IP Development and Design
Support Division at UMC. “By collaborating with Cadence, we’re
providing access to our latest process technologies and Cadence’s
robust digital full flow, which enables our customers to meet
stringent design requirements and achieve design and productivity
goals.”
“Through our latest collaboration with UMC, our mutual customers
can adopt our certified digital reference flow and UMC’s 22ULP/ULL
low-power technologies and begin design work immediately,” said Kam
Kittrell, senior product management group director in the Digital
& Signoff Group at Cadence. “This certification allows UMC
customers to leverage the most advanced low-power tool feature sets
for synthesis, place-and-route, and signoff, enabling customers to
design innovative applications with confidence.”
The Cadence digital full flow provides customers with a fast
path to design closure and better predictability and supports the
company’s Intelligent System Design™ strategy, which enables
advanced-node system-on-chip (SoC) design excellence.
About Cadence
Cadence is a pivotal leader in electronic design, building upon
more than 30 years of computational software expertise. The company
applies its underlying Intelligent System Design strategy to
deliver software, hardware and IP that turn design concepts into
reality. Cadence customers are the world’s most innovative
companies, delivering extraordinary electronic products from chips
to boards to systems for the most dynamic market applications,
including consumer, hyperscale computing, 5G communications,
automotive, mobile, aerospace, industrial and healthcare. For seven
years in a row, Fortune magazine has named Cadence one of the 100
Best Companies to Work For. Learn more at cadence.com.
About UMC
UMC (NYSE: UMC, TWSE: 2303) is a leading global semiconductor
foundry company. The company provides high quality IC fabrication
services, focusing on logic and various specialty technologies to
serve all major sectors of the electronics industry. UMC’s
comprehensive IC processing technologies and manufacturing
solutions include Logic/Mixed-Signal, embedded High-Voltage,
embedded Non-Volatile-Memory, RFSOI and BCD etc. Most of UMC's
12-in & 8-in fabs with its core R&D are located in Taiwan,
with additional ones throughout Asia. UMC has total 12 fabs in
production with combined capacity close to 800,000 wafers per month
(8-in equivalent), and all of them are certified with IATF-16949
automotive quality standard. UMC is headquartered in Hsinchu,
Taiwan, plus local offices in United States, Europe, China, Japan,
Korea & Singapore, with worldwide total 19,500 employees. For
more information, please visit: http://www.umc.com.
Note from UMC Concerning Forward-Looking Statements
Some of the statements in the foregoing announcement are
forward-looking within the meaning of the U.S. Federal Securities
laws, including statements about introduction of new services and
technologies, future outsourcing, competition, wafer capacity,
business relationships and market conditions. Investors are
cautioned that actual events and results could differ materially
from these statements as a result of a variety of factors,
including conditions in the overall semiconductor market and
economy; acceptance and demand for products from UMC; and
technological and development risks. Further information regarding
these and other risks is included in UMC’s filings with the U.S.
Securities and Exchange Commission. UMC does not undertake any
obligation to update any forward-looking statement as a result of
new information, future events or otherwise, except as required
under applicable law.
© 2021 Cadence Design Systems, Inc. All rights reserved
worldwide. Cadence, the Cadence logo and the other Cadence marks
found at www.cadence.com/go/trademarks are trademarks or registered
trademarks of Cadence Design Systems, Inc. All other trademarks are
the property of their respective owners.
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version on businesswire.com: https://www.businesswire.com/news/home/20210712005821/en/
For more information, please contact: Cadence Newsroom
408-944-7039 newsroom@cadence.com
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