Adesto Introduces EcoXiP™: the Ultimate Memory Solution for Intelligent IoT Devices
September 27 2016 - 9:00AM
Adesto Technologies (NASDAQ:IOTS), a leading provider of
application-specific, ultra-low power non-volatile memory products,
today introduced EcoXiP™, a new eXecute-in-Place (XiP) non-volatile
memory (NVM) that replaces expensive, energy-inefficient
architectures, making power and performance trade-offs unnecessary
in a wide range of connected devices. EcoXiP more than doubles
processor performance, lowers system power consumption and reduces
system cost compared to standard serial peripheral interface (SPI)
devices.
Photos accompanying this announcement are available at
http://www.globenewswire.com/NewsRoom/AttachmentNg/01377ec9-b781-4090-a170-4a05c1377752
http://www.globenewswire.com/NewsRoom/AttachmentNg/ed371ccf-0979-4101-814e-13f058b1a0af
Internet of things (IoT) and embedded devices such as wearables,
medical monitors, POS controllers and other connected embedded
systems must be designed to handle more intelligent local data
processing. The associated higher levels of functionality, new
wireless protocol stacks and advanced software mean these devices
need more program memory than what can be implemented economically
on-chip using embedded Flash or SRAM memory, and less than what is
offered by the smallest DRAM devices. Until now, to hit performance
targets, system designers have been required to invest in memory
solutions that are expensive, power-hungry and performance
limiting.
Built on an innovative memory and protocol architecture, EcoXiP
overcomes these challenges.
“Demand for higher performance, lower power and lower cost in
connected embedded devices presents a challenge to system designers
who find that existing solutions no longer meet requirements,” said
Narbeh Derhacobian, chief executive officer of Adesto Technologies.
“EcoXiP is designed from the ground-up to be the ultimate solution
for serving as the main program memory in an intelligent IoT
system.”
The EcoXiP AdvantageeXecute-in-Place (XiP)
technology holds great promise for small embedded systems since it
doesn’t suffer from the disadvantages of executing from on-chip
embedded Flash or SRAM. Unlike with embedded Flash, an MCU can be
implemented with an external XiP solution using latest process
technologies, leading to better power consumption, higher frequency
and lower system cost. Unlike embedded SRAM, an XiP Flash device
can be turned off so it won’t consume any power during power-down
modes. In addition, EcoXiP offers designers the flexibility of
increasing memory capacity as their storage needs increase.
However, even state-of-the-art XiP solutions suffer from a lack of
performance along with high power consumption and increased system
cost.
EcoXiP brings together all of the advantages of traditional XiP
systems over on-chip memory, but its novel architecture means
tradeoffs are no longer necessary. Benefits of EcoXiP include:
- High system performance: unlike existing
Serial Flash devices, EcoXiP delivers 2.4X CPU performance compared
to existing quad devices and 1.4X CPU performance compared to
best-in-class octal devices
- Optimized latency and throughput: a
high-speed, octal DDR interface with a proprietary pre-fetching
scheme reduces the effective latency dramatically and delivers
superior CPU performance
- Concurrent Read/Write capability: designers
can reduce system cost since in most cases there is no need for an
additional Flash device to handle over-the-air updates or data
logging
- Memory size flexibility: optimized densities
from 32Mb to 128Mb enable IoT SoC designers to optimize for their
specific application, with the ability to change memory capacity as
their needs change without the expense of redesigning their
SoCs
- Process scalability: SoC vendors can design
their chips with less embedded Flash or even no embedded Flash,
allowing them to migrate to process nodes that do not support Flash
such as 28nm and finer geometries, leading to faster, lower-power
and lower-cost SoCs
- Best standby power: configurable strength IO
pins and a range of power management features lead to improved
device and system power consumption
- Enhanced security with on-chip unique-ID
One-Time Programmable (OTP) security registers
SPI host controllers for EcoXiP are available from Adesto IP
partners including Mobiveil and Synopsys.
Supporting Quotes
“The high performance and concurrent read/write capability of
Adesto’s EcoXiP memories have the potential to dramatically impact
the customer experience for IoT and Industrial applications,” said
Emmanuel Sambuis, NXP® Semiconductors vice president, MCU &
connectivity. “The NXP MCU and i.MX products will support this
differentiated technology through an enhanced memory controller,
enabling customers to take full advantage of these memories.”
“As the IoT market evolves, designers are faced with the
challenges of increasing memory performance with lower power
budgets in smaller footprints,” said John Koeter, vice president of
marketing for IP and prototyping at Synopsys. “Providing
interoperability between Synopsys’ DesignWare® High-Performance
Synchronous Serial Interface IP with XiP functionality and Adesto’s
EcoXiP NVM enables designers to increase the memory access speed in
low-cost, energy-efficient IoT applications.”
“EcoXiP is an advancement over other flash products,
particularly for IoT applications that require relatively large
code size and high-performance XiP capability. This new
processor-optimized device shows Adesto's commitment and
understanding of the needs of intelligent IoT devices. Such
optimization, which is common in the SoC world, is now seen in
specialized memory devices.” -- Linley Gwennap, principal analyst,
The Linley Group.
AvailabilitySamples of Adesto’s EcoXiP are
available to lead customers now. Adesto is sampling a 32Mb device
at introduction, with a family of densities planned for the
future.
About Adesto TechnologiesAdesto Technologies
(NASDAQ:IOTS) is a leading provider of application-specific,
ultra-low power non-volatile memory products. The company has
designed and built a portfolio of innovative products with
intelligent features to conserve energy and enhance performance
including Fusion Serial Flash, DataFlash® and products based on
Conductive Bridging RAM (CBRAM®) technology. CBRAM® is a
breakthrough technology platform that enables 100 times less energy
consumption than today’s memory technologies without sacrificing
speed and performance. Adesto is focused on delivering
differentiated solutions and helping its customers usher in the era
of the Internet of Things. See: www.adestotech.com.
Follow Adesto on Twitter.
Adesto Technologies and the Adesto logo are trademarks of Adesto
Technologies in the United States and other regions. All other
trademarks are property of their respective owners.
Adesto Technologies Media Contact:
David Viera
Corporate Communications
408 400 0578
press@adestotech.com
Adesto Technologies Investor Relations:
Leanne K. Sievers
Shelton Group
949-224-3874
sheltonir@sheltongroup.com
Adesto Technologies (NASDAQ:IOTS)
Historical Stock Chart
From Jul 2024 to Aug 2024
Adesto Technologies (NASDAQ:IOTS)
Historical Stock Chart
From Aug 2023 to Aug 2024