Avalanche Technology and UMC Announce 22nm Production of High-Density MRAM-Based Devices for Aerospace Applications
September 12 2022 - 10:00AM
Business Wire
New standard solutions are the highest
endurance, highest density and lowest power non-volatile memory
options available
Avalanche Technology, the leader in next generation MRAM
technology, and United Microelectronics Corporation (NYSE: UMC;
TWSE: 2303) (“UMC”), a leading semiconductor foundry, announced
today the immediate availability of new High-Reliability Persistent
SRAM (P-SRAM) memory devices through UMC’s 22nm process technology.
Based on Avalanche Technology’s latest generation of Spin Transfer
Torque Magnetoresistive RAM (STT-MRAM) technology, this much
anticipated third generation product platform offers significant
density, endurance, reliability and power benefits over existing
non-volatile solutions.
“With this new product release, Avalanche Technology is bringing
to market standard products that are truly enabling a variety of
applications that require high endurance, reliability and density,
but without the need for external batteries, ECC or wear leveling,”
said Danny Sabour, Vice President of Marketing and Business
Development at Avalanche Technology. “The increased ubiquity of
sensors constantly recording data and high transaction applications
require highly endurant memory that doesn’t wear out. We will also
soon be launching development efforts to raise the bar even further
toward 16Gb monolithic solutions.”
“We are pleased to work with a technology leader like Avalanche
Technology to bring this stand-alone memory solution into
production. This is an important project to help commercialize
robust and highly scalable MRAM solutions for the industry,” said G
C Hung, Vice President of the Result Delivery Office and Research
Development at UMC. “With our comprehensive foundry technology
portfolio and focus on manufacturing excellence, UMC is well
positioned to serve the growing demand for persistent memory
through Avalanche Technology’s powerful solutions.”
“Avalanche Technology has intensively developed our innovative
perpendicular Magnetic Tunnel Junctions (pMTJ) based STT MRAM
technology since 2006. Our industry leading pMTJ and CMOS designs
are enabling the most advanced high-density and high-performance
STT MRAM products, which are now available through our foundry
partner UMC,” said Yiming Huai, Chief Technology Officer and Vice
President of Technology & Foundry Business at Avalanche
Technology.
Avalanche Gen 3 Persistent SRAM
The Parallel x 32 series is offered as a standard product in
various density options and has asynchronous SRAM-compatible
read/write timings. Data is always non-volatile with our industry
leading >1014 write cycle endurance and 1,000-year retention (at
85°C). Both density options are available in a small footprint
142-ball FBGA (15mm x 17mm) package. The devices are offered in the
extended (-40°C to 125°C) operating temperature range with a JEDEC
qualification flow, where every device goes through a 48-hour burn
in before being shipped to customers. There are additional
qualification screening options available through partners.
More information about Avalanche P-SRAM products is available at
https://www.avalanche-technology.com/products/discrete-mram/space/.
About Avalanche Technology
Avalanche Technology Inc. is the leader in next generation
Perpendicular STT-MRAM technology, accepted as the front-runner to
replace traditional Flash and SRAM for unified memory architectures
in future SOC systems, delivering high performance and low power at
55, 40, 28 and 22nm with scalability beyond 14nm. With a proven
STT-MRAM portfolio at multiple geometry nodes combined with an
intellectual property portfolio of over 300 patents and
applications, Avalanche Technology is delivering on the promise of
enabling the next generation of scalable unified memory
architecture for industrial, IoT, aerospace and storage
applications, making it the true “Next Generation MRAM Company.”
For more information, visit us online at
https://www.avalanche-technology.com.
About UMC
UMC (NYSE: UMC, TWSE: 2303) is a leading global semiconductor
foundry company. The company provides high quality IC fabrication
services, focusing on logic and various specialty technologies to
serve all major sectors of the electronics industry. UMC’s
comprehensive IC processing technologies and manufacturing
solutions include Logic/Mixed-Signal, embedded High-Voltage,
embedded Non-Volatile-Memory, RFSOI and BCD etc. Most of UMC's
12-in & 8-in fabs with its core R&D are located in Taiwan,
with additional ones throughout Asia. UMC has total 12 fabs in
production with combined capacity over 800,000 wafers per month
(8-in equivalent), and all of them are certified with IATF 16949
automotive quality standard. UMC is headquartered in Hsinchu,
Taiwan, plus local offices in United States, Europe, China, Japan,
Korea & Singapore, with worldwide total 20,000 employees. For
more information, please visit: https://www.umc.com.
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version on businesswire.com: https://www.businesswire.com/news/home/20220912005402/en/
UMC Corporate Communications Michelle Yun (886) 2-2658-9168 ext.
16951 michelle_yun@umc.com
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