Intevac to Participate in the 6th Annual NYC Investor Summit 2017
November 15 2017 - 9:00AM
Business Wire
Intevac, Inc. (Nasdaq: IVAC), today announced that company
management is scheduled to participate in the 6th Annual NYC
Investor Summit 2017, being held December 6, 2017 at Le Parker
Méridien Hotel, New York City.
The presentation material utilized during the NYC Summit will be
made accessible on the investor page of the company’s website at
www.intevac.com.
About the 6th Annual NYC Summit
The NYC Summit is hosted by executive management from
participating companies and will feature a “round-robin” format
consisting of small group meetings, each 30 minutes in duration.
During the event, investors and analysts will have the opportunity
to meet with up to 10 of the 15 management teams during the
30-minute group meeting sessions, as well as opportunities to meet
with additional management teams during the breakfast and lunch
networking sessions.
The 15 management teams collectively hosting the 2017 NYC Summit
include: Aehr Test (AEHR), Axcelis (ACLS), BE Semiconductor
Industries (BESI.AS), Brooks (BRKS), Camtek (CAMT), Cohu (COHU),
Electro Scientific (ESIO), FormFactor (FORM), Ichor Systems (ICHR),
Intermolecular (IMI), inTEST (INTT), Intevac (IVAC), Kulicke &
Soffa (KLIC), Nanometrics (NANO), and Rudolph Technologies (RTEC).
Cowen is sponsoring the networking luncheon.
The NYC Investor Summit is by invitation only and is open to
accredited investors and publishing research analysts. As space is
limited, please RSVP early. Hosts reserve the right to limit
attendance as necessary. Last day for registration is November 27,
2017.
RSVP Contacts for 6th Annual NYC Summit
2017
To RSVP for the NYC Summit, please contact either of the
Summit’s co-chairs.
Laura J. Guerrant-Oiye
Claire E. McAdams
Guerrant Associates Headgate Partners LLC Phone: (808) 960-2642
Phone: (530) 265-9899
Email: lguerrant@guerrantir.com
Email: claire@headgatepartners.com
About Intevac
Intevac was founded in 1991 and has two businesses: Thin-film
Equipment and Photonics.
In our Thin-film Equipment business, we are a leader in the
design and development of high-productivity, thin-film processing
systems. Our production-proven platforms are designed for
high-volume manufacturing of substrates with precise thin film
properties, such as the hard drive media, display cover panel, and
solar photovoltaic markets we serve currently.
In our Photonics business, we are a recognized leading developer
of advanced high-sensitivity digital sensors, cameras and systems
that primarily serve the defense industry. We are the provider of
integrated digital imaging systems for most U.S. military night
vision programs.
For more information call 408-986-9888, or visit the Company's
website at www.intevac.com.
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version on businesswire.com: http://www.businesswire.com/news/home/20171115005512/en/
Intevac, Inc.James Moniz, 408-986-9888Chief Financial
OfficerorClaire McAdams, 530-265-9899Investor Relations
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