PITTSBURGH, Pa., March 25, 2021 /PRNewswire/ --
/ Key Highlights
- GUC engineers are using Ansys HFSS 3D Layout's advanced
simulation workflow to speed advanced integrated circuit
(Advanced-IC) design
- The workflow helps GUC rapidly incorporate its die-to-die
solution across CoWoS (Chip-on-Wafer-on-Substrate), InFO
(Integrated Fan-Out) and interposer designs to create leading-edge
artificial intelligence (AI), high-performance computing (HPC) and
data center networking customer ASICs
Global Unichip Corporation (GUC) is adopting a groundbreaking
simulation workflow developed by Ansys (NASDAQ: ANSS) to accelerate
Advanced-IC design. The workflow enables enhanced innovation across
CoWoS, InFO and interposer designs, including GUC's newly
announced, silicon-proven GUC multi-die interLink (GLink)
interface, which is essential for developing leading-edge AI, HPC
and data center networking applications.
To maintain market leadership, GUC engineers must create,
simulate and optimize Advanced-ICs with unprecedented speed,
achieving first-pass design success and optimal device performance.
However, major roadblocks stall the simulation process, especially
in complex areas such as CoWoS, InFO design manipulation and device
meshing.
Ansys HFSS 3D Layout's workflow empowers GUC engineers to
simulate faster and solve challenging geometries by incorporating
several innovative tools, including ECADXplorer — a powerful new
GDS editing platform that simplifies design manipulation to drive
rapid simulation. Integrating cutting-edge meshing technologies
coupled with Ansys' industry-leading 3D HFSS solver, the workflow
reduces simulation set-up time from hours to minutes. This helps
GUC Advanced-IC designers efficiently extract S-parameter models of
their devices with the highest fidelity. Additionally, it spurs the
development of game-changing technologies such as GLink, which
provides 6-10 times less power consumption than an alternative
solution and occupies two times less silicon area.
"Advanced-IC package designs are highly sophisticated due to the
ever-growing demand for increased functionality and lower power
consumption within a smaller footprint. The strong momentum of
GLink adoption by our AI, HPC and networking customers supports our
commitment to building a wide IP portfolio and deepening GUC's
advanced packaging design expertise," said Igor Elkanovich,
chief technology officer at GUC. "HFSS 3D Layout helps our
engineering team decrease Advanced-IC design complexity, integrate
heterogeneous chips and improve multi-chip performance to ensure
customers receive new AI, HPC and Data Center
Networking products much sooner."
"Through this enhanced workflow, Ansys increases the
productivity for GUC Advanced-IC designers by significantly
simplifying the design process," said Shane
Emswiler, senior vice president at Ansys. "Leveraging HFSS
3D Layout, GUC engineers are swiftly creating fully parametric
models, performing design studies of electronic packaging and
exploring more design options than ever to evaluate tradeoffs prior
to production — delivering considerable reductions in development
time and expense."
/ About GUC
Global Unichip Corporation (GUC) is the advanced ASIC leader,
who provides the semiconductor industry with leading IC
implementation and SoC manufacturing services, using advanced
process and packaging technology. Based in Hsin-chu Taiwan, GUC has developed a global reputation
with a presence in China,
Europe, Japan, Korea and North America. GUC is publicly traded on the
Taiwan Stock Exchange under the symbol 3443. For more information,
visit https://www.guc-asic.com
/ About Ansys
If you've ever seen a rocket launch, flown on an airplane,
driven a car, used a computer, touched a mobile device, crossed a
bridge or put on wearable technology, chances are you've used a
product where Ansys software played a critical role in its
creation. Ansys is the global leader in engineering simulation.
Through our strategy of Pervasive Engineering Simulation, we help
the world's most innovative companies deliver radically better
products to their customers. By offering the best and broadest
portfolio of engineering simulation software, we help them solve
the most complex design challenges and create products limited only
by imagination. Founded in 1970, Ansys is headquartered south of
Pittsburgh, Pennsylvania, U.S.A.
Visit www.ansys.com for more information.
Ansys and any and all ANSYS, Inc. brand, product, service and
feature names, logos and slogans are registered trademarks or
trademarks of ANSYS, Inc. or its subsidiaries in the United States or other countries. All
other brand, product, service and feature names or trademarks are
the property of their respective owners.
ANSS–C
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Contacts
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Media
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Mary Kate
Joyce
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724.820.4368
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marykate.joyce@ansys.com
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Investors
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Kelsey
DeBriyn
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724.820.3927
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kelsey.debriyn@ansys.com
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SOURCE Ansys