Aehr Receives Production Orders for WaferPak™ Full Wafer Contactors to Meet Growing Demand for Electric Vehicles
August 17 2022 - 7:30AM
Aehr Test Systems (NASDAQ: AEHR), a worldwide
supplier of semiconductor test and reliability qualification
equipment, today announced it has received over $4.0
million in orders from its lead silicon carbide test and burn-in
customer for WaferPak™ full wafer Contactors for multiple new
silicon carbide device designs and increased production capacity
needs for power semiconductors for the electric vehicle market.
These WaferPak Contactors are expected to ship by the end of Aehr’s
fiscal third quarter ending February 28, 2023.
Gayn Erickson, President and CEO of Aehr Test Systems,
commented, “We are excited to receive these orders for additional
WaferPak Contactors to meet this customer’s increased production
capacity needs as well as for multiple new device configurations to
be qualified by their customers. These WaferPak Contactor orders
are for FOX™ systems previously ordered by this customer. We
also expect them to order multiple new sets of WaferPak Contactors
in the future to be used with the new system orders announced last
month for current devices that have already been qualified by
electric vehicle manufacturers.
“This customer recently announced that they expect their growth
rate to accelerate faster than previously forecasted. They continue
to forecast orders for a significant number of FOX systems and
WaferPak Contactors over the next several years and into the
future, driven by semiconductor demand for the electric vehicle
market that is expected to grow at least 30 percent plus annually
over the next decade. Multiple companies including this lead
silicon carbide customer have announced their plans to
significantly increase their output capacity, which is exciting for
our business. Aehr has been increasing manufacturing capacity of
both our systems and WaferPak Contactors to meet the anticipated
capacity needs of the silicon carbide market this year and through
the end of the decade.
“Aehr’s proprietary WaferPak Contactors are used with our
silicon carbide-focused FOX-XP systems, which are configured to
test eighteen silicon carbide wafers in parallel in the footprint
of a typical single wafer test solution. The Aehr FOX WaferPak
Aligner is used to optically align the customer’s wafers in our
WaferPak Contactors to contact 100% of the devices on the wafer.
Aehr provides a unique, fully integrated solution that includes the
test systems, full wafer WaferPak Contactors, and WaferPak Aligners
that can not only test today’s 150mm diameter silicon carbide
wafers, but can test the future 200mm wafers planned to be
introduced over the next several years.
“Forecasts from Canaccord Genuity estimate that the silicon
carbide market for devices in electric vehicles, such as traction
inverters and the on-board chargers, is expected to grow from fewer
than 150,000 wafers in 2021 to more than four million 6-inch
equivalent wafers in 2030 to meet the demand of the automotive
electric vehicle market, representing a growth rate of over 25
times the current wafer capacity just for the in-vehicle
devices.
“Canaccord also estimates that the silicon carbide market will
require an additional four million silicon carbide wafers to meet
demand in 2030 for electrification infrastructure, industrial and
photovoltaic power devices.”
The FOX-XP system, available with multiple WaferPak Contactors
(full wafer test) or multiple DiePak™ Carriers (singulated
die/module test) configurations, is capable of functional test and
burn-in/cycling of integrated devices such as silicon carbide power
devices, silicon photonics as well as other optical devices, 2D and
3D sensors, flash memories, Gallium Nitride (GaN), magnetic
sensors, microcontrollers, and other leading-edge ICs in either
wafer form factor, before they are assembled into single or
multi-die stacked packages, or in singulated die or module form
factor.
About Aehr Test SystemsHeadquartered in
Fremont, California, Aehr Test Systems is a worldwide provider of
test systems for burning-in semiconductor devices in wafer level,
singulated die, and package part form, and has installed over 2,500
systems worldwide. Increased quality and reliability needs of the
Automotive and Mobility integrated circuit markets are driving
additional test requirements, incremental capacity needs, and new
opportunities for Aehr Test products in package, wafer level, and
singulated die/module level test. Aehr Test has developed and
introduced several innovative products, including the
ABTS™ and FOX-P™ families of test and burn-in systems and
FOX WaferPak™ Aligner, FOX WaferPak Contactor, FOX DiePak®
Carrier and FOX DiePak Loader. The ABTS system is used in
production and qualification testing of packaged parts for both
lower power and higher power logic devices as well as all common
types of memory devices. The FOX-XP and FOX-NP systems are full
wafer contact and singulated die/module test and burn-in systems
used for burn-in and functional test of complex devices, such as
leading-edge silicon carbide-based power semiconductors, memories,
digital signal processors, microprocessors, microcontrollers,
systems-on-a-chip, and integrated optical devices. The FOX-CP
system is a new low-cost single-wafer compact test and reliability
verification solution for logic, memory and photonic devices and
the newest addition to the FOX-P product family. The WaferPak
Contactor contains a unique full wafer probe card capable of
testing wafers up to 300mm that enables IC manufacturers to perform
test and burn-in of full wafers on Aehr Test FOX systems. The
DiePak Carrier is a reusable, temporary package that enables IC
manufacturers to perform cost-effective final test and burn-in of
both bare die and modules. For more information, please visit Aehr
Test Systems’ website at www.aehr.com.
Safe Harbor StatementThis press release
contains certain forward-looking statements within the meaning of
Section 27A of the Securities Act of 1933 and Section 21E of the
Securities Exchange Act of 1934. Forward-looking statements
generally relate to future events or Aehr’s future financial or
operating performance. In some cases, you can identify
forward-looking statements because they contain words such as
"may," "will," "should," "expects," "plans," "anticipates,” “going
to,” "could," "intends," "target," "projects," "contemplates,"
"believes," "estimates," "predicts," "potential," or "continue," or
the negative of these words or other similar terms or expressions
that concern Aehr’s expectations, strategy, priorities, plans, or
intentions. Forward-looking statements in this press release
include, but are not limited to, future requirements and orders of
Aehr’s new and existing customers; bookings forecasted for
proprietary WaferPak™ and DiePak consumables; and expectations
related to long-term demand for Aehr’s productions and the
attractiveness of key markets. The forward-looking statements
contained in this press release are also subject to other risks and
uncertainties, including those more fully described in Aehr’s
recent Form 10-K, 10-Q and other reports filed from time to time
with the Securities and Exchange Commission. Aehr disclaims any
obligation to update information contained in any forward-looking
statement to reflect events or circumstances occurring after the
date of this press release.
Contacts:
Aehr Test Systems |
MKR Investor Relations Inc. |
Vernon Rogers |
Todd Kehrli or Jim Byers |
EVP of Sales & Marketing |
Analyst/Investor Contact |
(510) 623-9400 x215 |
(323) 468-2300 |
vrogers@aehr.com |
aehr@mkr-group.com |
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