Tower Semiconductor and Cadence Expand Collaboration to Accelerate Automotive IC Development
July 14 2022 - 6:00AM
Business Wire
Highlights:
- Collaboration aimed at enabling mutual customers to design
differentiated ICs optimized for cost and performance
- Automotive reference flow development to provide a unified
design environment for chip and package co-design and
simulation
Cadence Design Systems, Inc. (Nasdaq: CDNS) and Tower
Semiconductor (Nasdaq/TASE: TSEM), the leading foundry of
high-value analog semiconductor solutions, today announced a
collaboration to advance automotive and mobile IC development.
Through the collaboration, the companies are developing a new,
comprehensive automotive reference design flow using the Cadence®
Virtuoso® Design Platform and Spectre® Simulation Platform to
provide customers with a faster design cycle, maintaining
comprehensive design verification for advanced automotive IC
product development.
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The unique design challenges and analysis characteristics of
automotive ICs require a carefully crafted combination of
technologies and methodologies in order to satisfy the demanding
ISO 26262 specification. By working to combine Cadence and Tower
technologies, mutual customers can meet automotive design goals and
achieve a faster path to ISO 26262 certification.
“Cadence and Tower have successfully collaborated for many
years, delivering solutions for RF and silicon photonics, which
help our mutual customers develop advanced offerings,” said Dr.
Anirudh Devgan, president and CEO of Cadence. “The mutual work
we’re doing on the automotive reference flow focuses on enabling
customers to develop critical automotive ICs, leveraging an
integrated workflow using an all-Cadence toolset and a Tower
reference design to develop compelling products faster.”
“Our long-term partnership and collaboration with Cadence has
enabled us to continuously provide our customers with leading-edge
design tools that allow the development of innovative analog ICs
that have been co-optimized with the package they reside in,” said
Russell Ellwanger, Tower Semiconductor CEO. “This new reference
flow provides our customers with a functional toolset for the
development and manufacturing of high-performance ICs meeting the
high quality and reliability demands of the automotive market and
is another testament to our strong commitment to delivering
advanced technology solutions that proficiently address our
customers’ current and future needs.”
Tower Semiconductor offers a broad range of advanced analog
technology platforms addressing the automotive market. These
include image sensor, RF, and SiPho for ADAS systems, mixed-signal
and advanced analog for multiple application-specific ICs and power
management platforms enabling battery management systems, motor
drivers, onboard chargers, and power converters for the
fast-growing EV market. The new reference flow further solidifies
the Company’s comprehensive automotive offering.
The Cadence and Tower collaboration supports automotive SoC
design and the broader Cadence Intelligent System Design™ strategy,
which enables customers to achieve SoC design excellence. For more
information on Cadence automotive solutions, visit
www.cadence.com/go/CadenceAutoSol.
For more information about Tower Semiconductor’s foundry
technology and design enablement offerings, please visit here.
About Cadence
Cadence is a pivotal leader in electronic systems design,
building upon more than 30 years of computational software
expertise. The company applies its underlying Intelligent System
Design strategy to deliver software, hardware and IP that turn
design concepts into reality. Cadence customers are the world’s
most innovative companies, delivering extraordinary electronic
products from chips to boards to complete systems for the most
dynamic market applications, including hyperscale computing, 5G
communications, automotive, mobile, aerospace, consumer, industrial
and healthcare. For eight years in a row, Fortune magazine has
named Cadence one of the 100 Best Companies to Work For. Learn more
at cadence.com.
About Tower Semiconductor
Tower Semiconductor Ltd. (NASDAQ: TSEM, TASE: TSEM), the leading
foundry of high-value analog semiconductor solutions, provides
technology and manufacturing platforms for integrated circuits
(ICs) in growing markets such as consumer, industrial, automotive,
mobile, infrastructure, medical, and aerospace and defense. Tower
Semiconductor focuses on creating positive and sustainable impact
on the world through long-term partnerships and its advanced and
innovative analog technology offering, comprised of a broad range
of customizable process platforms such as SiGe, BiCMOS,
mixed-signal/CMOS, RF CMOS, CMOS image sensor, non-imaging sensors,
integrated power management (BCD and 700V), and MEMS. Tower
Semiconductor also provides world-class design enablement for a
quick and accurate design cycle as well as process transfer
services including development, transfer, and optimization, to IDMs
and fabless companies. To provide multi-fab sourcing and extended
capacity for its customers, Tower Semiconductor owns two
manufacturing facilities in Israel (150mm and 200mm), two in the
U.S. (200mm), two facilities in Japan (200mm and 300mm) which it
owns through its 51% holdings in TPSCo and is sharing a 300mm
manufacturing facility being established in Italy with ST
Microelectronics. For information, please visit:
www.towersemi.com.
© 2022 Cadence Design Systems, Inc. All rights reserved
worldwide. Cadence, the Cadence logo and the other Cadence marks
found at www.cadence.com/go/trademarks are trademarks or registered
trademarks of Cadence Design Systems, Inc.
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Cadence Newsroom 408-944-7039 newsroom@cadence.com
Tower Semiconductor Company Contact: Orit Shahar
+972-74-7377440 oritsha@towersemi.com
Tower Semiconductor Investor Relations Contact: Noit Levy
+972-4-604-7066 noitle@towersemi.com
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