Business Overview of the Company
As a foundry, we manufacture semiconductors using our manufacturing processes for our customers based on their own or third parties
proprietary integrated circuit designs. We offer a comprehensive range of wafer fabrication processes, including processes to manufacture complementary metal oxide silicon (CMOS) logic, mixed-signal, radio frequency (RF),
embedded memory, bipolar complementary metal oxide silicon (BiCMOS, which uses CMOS transistors in conjunction with bipolar junction transistor) mixed-signal and other semiconductors. We estimate that our revenue market segment share
among total foundries worldwide was 56% in 2018. We also offer design, mask making, bumping, advanced packaging, and testing services.
We
believe that our large capacity, particularly for advanced technologies, is a major competitive advantage. Please see Semiconductor Manufacturing Capacity and Technology and Capacity Management and Technology Upgrade
Plans for a further discussion of our capacity.
We count among our customers many of the worlds leading semiconductor
companies, ranging from fabless semiconductor companies, system companies to integrated device manufacturers, including, but not limited to, Advanced Micro Devices, Inc., Broadcom Limited, Hisilicon Technologies Co., Ltd., Intel Corporation, Marvell
Technology Group Ltd., MediaTek Inc., NVIDIA Corporation, NXP Semiconductors N.V., Qualcomm Inc., Sony Corporation and Texas Instruments Inc.
Growth
Opportunities
In light of the rapid growth in four major markets, namely mobile, high-performance computing, automotive electronics,
and IoT, and the fact that focus of customer demand is shifting from process-technology-centric to product-application-centric, we have constructed four different technology platforms to provide customers with the most comprehensive and competitive
logic process technologies, specialty technologies, intellectual properties, and packaging and testing technologies to shorten customers
time-to-design
and
time-to-market.
Mobile platform:
We offer leading
process technologies such as
5-nanometer
Fin Field-Effect Transistor (FinFET),
7-nanometer
FinFET Plus,
7-nanometer
FinFET,
10-nanometer
FinFET,
16-nanometer
FinFET Plus (16FF+) technology, and
20-nanometer
system-on-chip
(SoC) logic process technologies, as well as comprehensive intellectual properties for premium product applications to further enhance chip
performance, reduce power consumption, and decrease chip size. For
low-end
to
high-end
product applications, we offer leading process technologies such as
12-nanometer
FinFET compact technology (12FFC),
16-nanometer
FinFET compact technology (16FFC),
28-nanometer
high performance compact (HPC),
28-nanometer
high performance mobile compact plus (28HPC+), and
22-nanometer
ultra-low
power (22ULP) logic process technologies, in addition to comprehensive intellectual properties, to satisfy customer needs for high-performance and
low-power
chips. Furthermore, for premium,
high-end,
mid-end, and
low-end
product applications, we also offer the most
competitive, leading-edge specialty technologies, including RF, embedded flash memory, emerging memory technologies, power management, sensors, and display chips as well as advanced packaging technologies such as the leading integrated
fan-out
(InFO) technology.
High-performance computing platform:
We provide
customers with leading process technologies such as
5-nanometer
FinFET,
7-nanometer
FinFET Plus, 7-nanometer FinFET and 16-nanometer FinFET (16FF), as well
as comprehensive intellectual properties, including high-speed interconnect intellectual properties, to meet customers high-performance computing and communication requirements. We also offer multiple advanced packaging technologies such as
chip on wafer on substrate (CoWoS
®
), InFO, and three-dimensional integrated circuits technologies to enable homogeneous and heterogeneous chip integration to meet
customers performance, power, and system footprint requirements. We will continue to optimize our high-performance computing platform offerings to help customers capture market growth driven by data explosion and application innovation.
Automotive electronics platform:
We offer industrys leading automotive technology to support the three megatrends
safety, connectivity and green in the automotive industry. We also provide a robust automotive IP ecosystem, which covers
16-nanometer
FinFET first and extends to
7-nanometer
FinFET, for advanced driver-assistance systems (ADAS), the most computation-demanding system in the automotive industry. In addition to the advanced logic technology platform, we offer broad and
competitive specialty technologies, including
40-nanometer
embedded flash memory,
28-nanometer
and
22-nanometer
millimeter wave
RF, high sensitivity CMOS Image/Lidar sensors, and power management IC technologies. All these automotive technologies are applied to our automotive process qualification standards based on
AEC-Q100
standards.
14