Fairchild Semiconductor Demonstrates Power and Mobile Technology Leadership at IIC China 2010

Fairchild Semiconductor (NYSE: FCS) will show its latest power and mobile technology at IIC China 2010 in Booth #2K19, Hall 2, in the Shenzhen Convention & Exhibition Center on March 4 and 5, and Booth #8H01, 4F of the Shanghai Mart on March 15 and 16.

Smart Mobile Solutions:

Fairchild will show how its substantial portfolio of analog technologies, combined with customized solutions and system-level expertise are integral in solving design and application challenges in the mobile space. For example, the FSA800, the industry’s smallest USB accessory switch, integrates all of the key multi-media functionality into a low profile UMLP package, simplifying and reducing external components in portable designs. Fairchild will also demonstrate how it continues to leverage its expertise in the USB space with USB transceivers and routing devices that offer important solutions for critical design and application challenges.

Power Technology:

Fairchild will also demonstrate how its leading power technologies, brand reliability and strong customer support continues to innovate power electronics. In power supply designs, Fairchild’s interleaved dual Boundary-Conduction-Mode (BCM) Power-Factor-Correction (PFC) controller, (FAN9612), the highly integrated PWM controllers (FAN6754), green Fairchild Power Switch (FPS™) (FSL136MR), and the third generation Primary Side Regulation (PSR) highly integrated PWM (FSEZ1317) all deliver high efficiency and lower standby power, while simplifying design. The FAN21SV06 TinyBuck™ device is a highly efficient, small-footprint, programmable-frequency, 6A integrated synchronous buck regulator.

Other power solutions on display include a wide portfolio of high-voltage 600V Super-Junction MOSFETS such as SupreMOS™ devices and mid-to low-voltage PowerTrench® MOSFETs that enable higher efficiency and power density for space-constrained computing designs.

Through interactive demonstrations, Fairchild’s power engineers and Field Application Engineers (FAEs) will demonstrate how the company enables OEMs and design engineers to meet their design challenges and accelerate time-to-market.

“We remain focused on solutions that help design engineers meet the evolving demands of energy-efficiency specifications and mobile connectivity,” said Ben Tan, Fairchild’s regional vice president of Sales and Marketing, China and South East Asia. “In the mobile market, we are concentrating on analog and power functions that bring our mobile customers a competitive advantage with design solutions for audio, video, USB, ASSP/logic, RF power, core power and lighting applications.”

For complete information on Fairchild’s upcoming events, please visit: www.fairchildsemi.com/tradeshow

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About Fairchild Semiconductor:

Fairchild Semiconductor (NYSE: FCS) – global presence, local support, smart ideas. Fairchild delivers energy-efficient, easy-to-use and value-added semiconductor solutions for power and mobile designs. We help our customers differentiate their products and solve difficult technical challenges with our expertise in power and signal path products. Please contact us on the web at www.fairchildsemi.com.

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