Fairchild Semiconductor Demonstrates Power and Mobile Technology Leadership at IIC China 2010
February 11 2010 - 11:00AM
Business Wire
Fairchild Semiconductor (NYSE: FCS) will show its latest power
and mobile technology at IIC China 2010 in Booth #2K19, Hall 2, in
the Shenzhen Convention & Exhibition Center on March 4 and 5,
and Booth #8H01, 4F of the Shanghai Mart on March 15 and 16.
Smart Mobile Solutions:
Fairchild will show how its substantial portfolio of analog
technologies, combined with customized solutions and system-level
expertise are integral in solving design and application challenges
in the mobile space. For example, the FSA800, the industry’s
smallest USB accessory switch, integrates all of the key
multi-media functionality into a low profile UMLP package,
simplifying and reducing external components in portable designs.
Fairchild will also demonstrate how it continues to leverage its
expertise in the USB space with USB transceivers and routing
devices that offer important solutions for critical design and
application challenges.
Power Technology:
Fairchild will also demonstrate how its leading power
technologies, brand reliability and strong customer support
continues to innovate power electronics. In power supply designs,
Fairchild’s interleaved dual Boundary-Conduction-Mode (BCM)
Power-Factor-Correction (PFC) controller, (FAN9612), the highly
integrated PWM controllers (FAN6754), green Fairchild Power Switch
(FPS™) (FSL136MR), and the third generation Primary Side Regulation
(PSR) highly integrated PWM (FSEZ1317) all deliver high efficiency
and lower standby power, while simplifying design. The FAN21SV06
TinyBuck™ device is a highly efficient, small-footprint,
programmable-frequency, 6A integrated synchronous buck
regulator.
Other power solutions on display include a wide portfolio of
high-voltage 600V Super-Junction MOSFETS such as SupreMOS™ devices
and mid-to low-voltage PowerTrench® MOSFETs that enable higher
efficiency and power density for space-constrained computing
designs.
Through interactive demonstrations, Fairchild’s power engineers
and Field Application Engineers (FAEs) will demonstrate how the
company enables OEMs and design engineers to meet their design
challenges and accelerate time-to-market.
“We remain focused on solutions that help design engineers meet
the evolving demands of energy-efficiency specifications and mobile
connectivity,” said Ben Tan, Fairchild’s regional vice president of
Sales and Marketing, China and South East Asia. “In the mobile
market, we are concentrating on analog and power functions that
bring our mobile customers a competitive advantage with design
solutions for audio, video, USB, ASSP/logic, RF power, core power
and lighting applications.”
For complete information on Fairchild’s upcoming events, please
visit: www.fairchildsemi.com/tradeshow
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About Fairchild Semiconductor:
Fairchild Semiconductor (NYSE: FCS) – global presence, local
support, smart ideas. Fairchild delivers energy-efficient,
easy-to-use and value-added semiconductor solutions for power and
mobile designs. We help our customers differentiate their products
and solve difficult technical challenges with our expertise in
power and signal path products. Please contact us on the web at
www.fairchildsemi.com.
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