ACM Research Enters Dry Processing Market with Launch of Ultra Furnace
April 28 2020 - 4:05PM
ACM Research, Inc. (“ACM” or the “Company”) (NASDAQ:ACMR), a
leading supplier of wafer cleaning technologies for advanced
semiconductor devices, today unveiled the Ultra Furnace, its first
system developed for multiple dry processing applications.
Initially optimized to deliver high performance for low-pressure
chemical vapor deposition (LPCVD), the Ultra Furnace also leverages
the same platform to be used for oxidation and annealing processes,
as well as for atomic layer deposition (ALD). This achievement
represents a two-year collaboration between ACM’s R&D teams
located in China and Korea.
“Advanced technology nodes present ongoing challenges that
require innovation from the capital equipment suppliers. This
demanding environment provides significant opportunities for ACM,”
explained Dr. David Wang, CEO of ACM Research. “Continuous
innovation is in our DNA. We saw a market need that could benefit
from our technology, and expanded our reach into a new market
segment. The addition of the Ultra Furnace to ACM’s established
portfolio of wet processing tools, expands our opportunity by
providing an integrated solution to our customers’ advanced
products.”
“The Ultra Furnace product is the result of collaboration
between our talented experts in China and Korea to develop
differentiated technology,” stated YY Kim, CEO of ACM Research
Korea. “ACM’s team in Korea was established to complement the
talents of our world-class Shanghai team, accelerate our time to
market, and provide outstanding technical support to our local
customers.”
Deposition processes utilize process gases at a high temperature
to react with each other on a silicon wafer, forming a silicon
oxide or nitride layer on the wafers. The Ultra Furnace system is
intended for batch processing of up to 100 12-inch (300mm) wafers.
The innovative system design combines newly developed hardware that
improves durability, with the company’s proven software technology
and a proprietary control system and algorithm. This enables the
tool to provide stable control of pressure, gas flow rate and
temperature.
While the Ultra Furnace system targets LPCVD processes, with a
few changes to the components and layout, each tool can address
other target applications. About 85 percent of the hardware
configuration remains unchanged, so the alterations for the new
application can be achieved efficiently.
ACM Research intends to target customers in China initially,
before expanding the offering of the Ultra Furnace into Korea and
Taiwan later. ACM delivered the first Ultra Furnace tool to a
key logic customer’s manufacturing facility in China in early 2020.
This tool targets LPCVD, and has been installed in a production
environment to begin qualification.
To learn more about the Ultra Furnace, please call the ACM
contact for your region listed below.
About ACM Research, Inc.ACM develops,
manufactures and sells semiconductor process equipment for single
wafer or batch wet cleaning, Electroplating, Stress free polishing
and thermal process are critical to advanced semiconductor device
manufacturing, as well as wafer-level packaging. The company is
committed to delivering customized, high performance,
cost-effective process solutions that semiconductor manufacturers
can use in numerous manufacturing steps to improve productivity and
product yield.
Forward-Looking StatementsStatements contained
in the second paragraph of this press release are not historical
facts and may be forward-looking statements within the meaning of
the Private Securities Litigation Reform Act of 1995.
Forward-looking statements include statements regarding the intent,
belief or current expectations with respect to the potential
success of the offering and sale of the Ultra Furnace system. Such
statements, which are expectations only, reflect management's
current views, are based on certain assumptions, and involve risks
and uncertainties. Actual results, events, or performance may
differ materially from the above forward-looking statements due to
a number of important factors, and will be dependent upon a variety
of factors, including, but not limited to, introduction of
competing products by other companies, lack of market acceptance of
the Ultra Furnace, and economic concerns, including the
unpredictability of current markets resulting from the ongoing
COVID-19 pandemic. ACM Research undertakes no obligation to
publicly update these forward-looking statements to reflect events
or circumstances that occur after the date hereof or to reflect any
change in its expectations with regard to these forward-looking
statements or the occurrence of unanticipated events.
Media
Contact:
Eric Lawson
Kiterocket
+1 480.276.9572
elawson@kiterocket.com
Company
Contact: USASallyann HenryACM
Research, Inc.+1 510.445.3700
ChinaXi WangACM Research (Shanghai), Inc.+86 21 50808868
Korea YY KimACM Research (Korea), Inc.+821041415171
TaiwanArthur Hsu+886 910663885
SingaporeAdrian Ong+65 8813-1107
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