Chiplet Summit to Focus on New Packages and AI Applications in 2025
July 24 2024 - 12:00PM
Business Wire
Chiplets Increase Performance and Lower Cost
Chiplet Summit announces its third annual event on January 21-23
at the Santa Clara Convention Center. The 2025 meeting focuses on a
new level in chip design: system-in-package (SiP). SiPs use
advanced packaging to raise performance and reduce time-to-market.
Co-optimization methods allow all design stages to proceed
together. The event also covers supercomputer-in-a-package, a
low-cost way to support generative AI.
The Summit features major vendor keynotes, expert tables, and
technology and market updates. It also offers sessions on the open
chiplet economy, die-to-die interfaces, and working with foundries.
Designers will learn to develop leading-edge chips at low cost. An
exhibit area will showcase the latest products.
“Chiplets help designers use the latest process nodes and
packaging methods. They also allow faster updates and revisions,”
said Chuck Sobey, Summit General Chair. He noted, “Specialists in
all aspects of chip development will meet to ensure successful
projects.”
To discuss exhibiting, contact:
Elizabeth Leventhal, Exhibit Sales Director
Elizabeth@ChipletSummit.com +1.760.809.5755
To ask about the program, contact:
Lance Leventhal, Program Chairperson Lance@ChipletSummit.com
+1.858.756.3327
About Chiplet Summit
Chiplet Summit, a product of Semper Technologies, showcases the
emerging chiplet market. It features the people who are using
chiplets in designs for processors, communications chips, and AI
devices.
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version on businesswire.com: https://www.businesswire.com/news/home/20240723380635/en/
Media Contact Elizabeth Leventhal +1.760.809.5755
Press@ChipletSummit.com